Electronic device

1 . An electronic device, comprising:

a first panel comprising a first substrate and a first bonding pad, wherein the first substrate has a first surface, the first surface has a first edge and a second edge oppositely disposed along a first direction, and the first bonding pad is disposed on the first surface of the first substrate and disposed closer to the first edge than the second edge;

a second panel overlapped with the first panel along a second direction perpendicular to the first direction, wherein the second panel comprises a second substrate and a second bonding pad, the second substrate has a second surface, the second surface has a third edge and a fourth edge oppositely disposed along the first direction, the first edge and the third edge extend along a third direction different from the first direction and the second direction, and the first edge is closer to the third edge than the fourth edge,

wherein the second bonding pad is disposed on the second surface of the second substrate and disposed closer to the third edge than the fourth edge;

a circuit board electrically connected to the first bonding pad of the first panel and configured to provide a first signal; and

a first conductive connector electrically connected to the first bonding pad of the first panel and the second bonding pad of the second panel,

wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector,

wherein in a top view and along the first direction, the first bonding pad is between the second bonding pad and the first edge of the first surface of the first substrate of the first panel.

2 . The electronic device of claim 1 , wherein the first panel comprises a first conductive layer, and the first bonding pad and the first conductive layer are overlapped; wherein the first conductive connector is electrically connected to the first bonding pad through the first conductive layer.

3 . The electronic device of claim 1 , further comprising a first polarizer disposed on the second panel, wherein the first polarizer has a concave to exposing a part of the first conductive connector, and the concave is disposed closer to the third edge than the fourth edge.

4 . The electronic device of claim 1 , further comprising:

a first polarizer disposed on a first side of the second panel away from the first panel;

a second polarizer disposed between the first panel and the second panel; and

a third polarizer disposed on a second side of the first panel away from the second panel,

wherein polarizing axes of the first polarizer, the second polarizer and the third polarizer are parallel to each other.

5 . The electronic device of claim 1 , wherein the first conductive connector and the circuit board are disposed closer to the first edge than the second edge, and the first conductive connector comprises a conductive glue.

6 . The electronic device of claim 1 , wherein the first panel comprises:

a third substrate disposed opposite to the first substrate;

a first conductive layer disposed on the first substrate;

a second conductive layer disposed on the third substrate; and

a first supporting unit disposed between the first conductive layer and the second conductive layer.

7 . The electronic device of claim 6 , wherein the first panel further comprises:

a first light modulating layer disposed between the first conductive layer and the second conductive layer; and

a first sealant disposed between the first conductive layer and the second conductive layer and surrounds the first light modulating layer,

wherein the first supporting unit is disposed outside the first sealant.

8 . The electronic device of claim 6 , wherein the first panel further comprises a second supporting unit disposed between the first conductive layer and the second conductive layer, wherein the first supporting unit and the second supporting unit are partially overlapped in a direction perpendicular to the top view direction of the electronic device.

9 . The electronic device of claim 1 , wherein the first panel has a first length, the second panel has a second length, and the first length is different from the second length.

10 . The electronic device of claim 1 , further comprising a third panel, wherein the first panel and the second panel are disposed on the third panel.

11 . The electronic device of claim 10 , further comprising a backlight module, wherein the third panel is disposed on the backlight module.

12 . The electronic device of claim 1 , wherein the first panel further comprises:

a third substrate disposed opposite to the first substrate and having a fifth edge,

wherein the second panel further comprising:

a fourth substrate disposed opposite to the second substrate and having a sixth edge,

wherein the first edge, the fifth edge, the second edge and the sixth edge are parallel to each other, and a distance between the first edge and the fifth edge is different from a distance between the second edge and the sixth edge.

13 . An electronic device, comprising:

a first panel comprising a first substrate and a first bonding pad, wherein the first substrate has a first surface, the first surface has a first edge and a second edge oppositely disposed along a first direction, and the first bonding pad is disposed on the first surface of the first substrate and disposed closer to the first edge than the second edge;

a second panel overlapped with the first panel along a second direction perpendicular to the first direction, wherein the second panel comprises a second substrate and a second bonding pad, the second substrate has a second surface, the second surface has a third edge and a fourth edge oppositely disposed along the first direction, the first edge and the third edge extend along a third direction different from the first direction and the second direction, and the first edge is closer to the third edge than the fourth edge,

wherein the second bonding pad is disposed on the second surface of the second substrate and disposed closer to the third edge than the fourth edge;

a circuit board electrically connected to the first bonding pad of the first panel and configured to provide a first signal; and

a first conductive connector electrically connected to the first bonding pad of the first panel and the second bonding pad of the second panel,

wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector,

wherein a resistance of the circuit board is different from a resistance of the first conductive connector.

14 . The electronic device of claim 13 , wherein the first panel comprises a first conductive layer, the first bonding pad and the first conductive layer are overlapped, and the first conductive connector is electrically connected to the first bonding pad through the first conductive layer.

15 . The electronic device of claim 13 , further comprising a first polarizer disposed on the second panel, wherein the first polarizer has a concave exposing a part of the first conductive connector, and the concave is disposed closer to the third edge than the fourth edge.

16 . The electronic device of claim 13 , further comprising:

a first polarizer disposed on a first side of the second panel away from the first panel;

a second polarizer disposed between the first panel and the second panel; and

a third polarizer disposed on a second side of the first panel away from the second panel,

wherein polarizing axes of the first polarizer, the second polarizer and the third polarizer are parallel to each other.

17 . The electronic device of claim 13 , wherein the first conductive connector and the circuit board are disposed closer to the first edge than the second edge, and the first conductive connector comprises a conductive glue.

18 . The electronic device of claim 13 , wherein the first panel comprises:

a third substrate disposed opposite to the first substrate;

a first conductive layer disposed on the first substrate;

a second conductive layer disposed on the third substrate; and

a first supporting unit disposed between the first conductive layer and the second conductive layer.

19 . The electronic device of claim 1 , wherein the first panel further comprises:

a third substrate disposed opposite to the first substrate;

a first conductive layer disposed on the first substrate;

a second conductive layer disposed on the third substrate; and

a first light modulating layer disposed between the first conductive layer and the second conductive layer,

wherein by controlling a voltage of the first conductive layer and a voltage of the second conductive layer, the first panel is configured to be switched between a sharing mode and a privacy mode.

20 . The electronic device of claim 19 , wherein the second panel further comprising:

a fourth substrate disposed opposite to the second substrate,

a third conductive layer disposed on the second substrate,

a fourth conductive layer disposed on the fourth substrate,

a second light modulating layer disposed between the third conductive layer and the fourth conductive layer,

wherein by controlling a voltage of the third conductive layer and a voltage of the fourth conductive layer, the second panel is configured to be switched between a sharing mode and a privacy mode.