IP Library Granted Patent US 12681374
Granted Patent B2
US 12681374 · App. 18/039,100 · Granted Jul 14, 2026

Fluorescence emitting element, fluorescence emitting module, and light emitting device

Inventors: Noriyasu Nakashima (Osaka, JP); Yosuke Honda (Nara, JP); Shinichi Kitaoka (Osaka, JP); Yoshiyuki Takahira (Kyoto, JP)
Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
G03B21/204G03B21/16
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Quick Facts
Patent No.
US 12681374
App. No.
18/039,100
Granted
Jul 14, 2026
Kind
B2
Abstract

A fluorescence emitting element includes: a wavelength conversion member that is plate-shaped and includes a fluorescent material, the wavelength conversion member including a first principal surface and a second principal surface that is on an opposite side from the first principal surface; and a metal film bonded to at least one surface out of the first principal surface and the second principal surface. In a plan view of the wavelength conversion member, the wavelength conversion member includes a region that does not overlap the metal film, and the metal film includes a bonding surface that is bonded to the at least one surface, and an exposed surface on an opposite side from the bonding surface.

Claims (27)

1 . A fluorescence emitting element comprising:

a wavelength conversion member that is plate-shaped and includes a fluorescent material, the wavelength conversion member including a first principal surface and a second principal surface that is on an opposite side from the first principal surface; and

a metal film bonded to at least one surface out of the first principal surface and the second principal surface,

wherein in a plan view of the wavelength conversion member, the wavelength conversion member includes a region that does not overlap the metal film,

the metal film includes a bonding surface that is bonded to the at least one surface, and an exposed surface on an opposite side from the bonding surface,

the region that does not overlap the metal film includes the fluorescent material,

the metal film includes a plurality of radiator fins, and

in a thickness direction of the wavelength conversion member, a thickness of the plurality of radiator fins is greater than a thickness of the wavelength conversion member.

2 . The fluorescence emitting element according to claim 1 ,

wherein the plurality of radiator fins are provided closer to the first principal surface than to the second principal surface.

3 . The fluorescence emitting element according to claim 1 ,

wherein the metal film consists essentially of copper.

4 . The fluorescence emitting element according to claim 1 , further comprising:

a nickel film provided between the metal film and the wavelength conversion member.

5 . A fluorescence emitting module comprising:

the fluorescence emitting element according to claim 1 ; and

a light emitter that emits excitation light that excites the fluorescent material and enters the region through the first principal surface.

6 . A light emitting device comprising:

the fluorescence emitting module according to claim 5 .

7 . A fluorescence emitting element comprising:

a wavelength conversion member that is plate-shaped and includes a fluorescent material, the wavelength conversion member including a first principal surface and a second principal surface that is on an opposite side from the first principal surface; and

a metal film bonded to at least one surface out of the first principal surface and the second principal surface,

wherein in a plan view of the wavelength conversion member, the wavelength conversion member includes a region that does not overlap the metal film,

the metal film includes a bonding surface that is bonded to the at least one surface, and an exposed surface on an opposite side from the bonding surface,

the metal film includes a plurality of radiator fins,

in the plan view of the wavelength conversion member, the plurality of radiator fins extend radially, and

in a thickness direction of the wavelength conversion member, the plurality of radiator fins each have a thickness greater than a thickness of the wavelength conversion member.