Non-destructive wire bonding inspection method

1 . A non-destructive wire bonding inspection method to inspect whether a wire bonding applied to a battery system is defective, comprising:

a) photographing a bonding portion using a CCD camera;

b) calculating an area of the bonding portion; and

c) determining whether the wire bonding is defective based on the calculated area of the bonding portion,

wherein the calculating comprises comparing the area of the bonding portion with an area of a wire before bonding to calculate a relative area percentage of the bonding portion to the area of the wire before bonding, and

wherein the determining calculates the relative area percentage by comparing the area of the bonding portion, which is calculated from a difference in brightness between the photographed bonding portion and a peripheral portion, with the area of the wire before bonding, and determines whether the wire bonding is defective by comparing the calculated relative area percentage with cumulative data of relative areas calculated from a plurality of bonding portions determined to be normal.

2 . The non-destructive wire bonding inspection method according to claim 1 , wherein the calculating comprises using a difference in brightness between the photographed bonding portion and a peripheral portion.

3 . The non-destructive wire bonding inspection method according to claim 1 , wherein the determining comprises c- 1 ) comparing the relative area percentage of the bonding portion with relative area data of a normal bonding portion to determine whether the wire bonding is defective.

4 . The non-destructive wire bonding inspection method according to claim 3 , wherein the relative area data of the normal bonding portion are cumulative data of relative areas calculated from the plurality of bonding portions determined to be normal as a result of inspection using a conventional inspection method.

5 . The non-destructive wire bonding inspection method according to claim 3 , wherein the determining further comprises c- 2 ) comparing left and right areas of the bonding portion with each other based on a center thereof and determining whether a degree of symmetry between the left and right areas is within an allowable range in order to determine whether the wire bonding is defective.

6 . The wire bonding inspection method according to claim 5 , wherein the allowable range is cumulative data of left-right symmetries calculated from a plurality of bonding portions determined to be normal as a result of inspection using a conventional inspection method.

7 . The non-destructive wire bonding inspection method according to claim 5 , wherein the determining comprises making a determination that the wire bonding is defective when a determination is made in at least one of c- 1 ) or c- 2 ) that the wire bonding is defective.

8 . A battery system comprising the wire bonding inspected according to the non-destructive wire bonding inspection method of claim 1 .

9 . A device comprising the battery system according to claim 8 .

10 . A non-destructive wire bonding inspection method to inspect whether a wire bonding applied to a battery system is defective, comprising:

a) photographing a bonding portion using a CCD camera;

b) calculating an area of the bonding portion; and

c) determining whether the wire bonding is defective based on the calculated area of the bonding portion,

wherein the calculating comprises comparing the area of the bonding portion with an area of a wire before bonding to calculate a relative area percentage of the bonding portion to the area of the wire before bonding, and

wherein when the relative area percentage of the bonding portion ranges from 140% and 200%, the bonding portion is normal, and when the relative area percentage of the bonding portion is less than 140% or greater than 200%, the bonding portion is defective.