IP Library Granted Patent US 12682921
Granted Patent B2
US 12682921 · App. 18/938,416 · Granted Jul 14, 2026

Coin or medal with embossed soundtrack

Inventor: Alex Wegner (Munich, DE)
Assignee: FIRMA
G11B3/68A44C3/004A44C21/00B44B5/009A44C3/005B29L2017/003B44B5/0071B44B5/024G11B3/682G11B2220/20
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Quick Facts
Patent No.
US 12682921
App. No.
18/938,416
Granted
Jul 14, 2026
Kind
B2
Abstract

In order to create a long-lasting memento for a musical performance for example, which also has a practical use, a coin or medal is designed with an embossed soundtrack. Furthermore, a method for embossing this coin or medal is proposed.

Claims (17)

1 . A two-stage embossing method for producing a coin or medal, comprising:

during a first stage of the embossing method, introducing a coin blank into an embossing chamber that comprises an embossing ring and a first and a second embossing stamp facing each other and mounted to move towards each other so that the coin blank is embossed to compact and smooth at least one surface of the coin blank to form a planar, smooth surface, the first stage being performed without inserting a die into the embossing chamber, and

during a second stage of the embossing method, embossing a soundtrack using a die that is inserted in the embossing chamber between the blank and the first and/or second embossing stamp to emboss the soundtrack into the planar, smooth surface of the coin blank.

2 . The embossing method according to claim 1 , where at least one of the first and second embossing stamp have a smooth surface towards the embossing chamber.

3 . The embossing method according to claim 1 , wherein the die is smaller than the coin blank.

4 . The embossing method according claim 1 , further comprising providing the coin or medal with a central hole.

5 . The embossing method according to claim 1 , further comprising producing the die galvanically.

6 . The embossing method according to claim 5 , wherein a metal plate is provided with a plastic layer, into which the soundtrack of the die is introduced.

7 . The embossing method according to claim 6 , wherein the plastic layer is provided with a further layer of silver electrolyte.

8 . The embossing method according to claim 7 , wherein a separating agent is applied onto the layer of silver electrolyte.

9 . The embossing method according to claim 8 , wherein a nickel layer is applied galvanically that is subsequently removed and serves as a die.

10 . The embossing method according to claim 1 , wherein the coin blank is embossed with a pressing force of more than 200 tons during the first stage of the embossing method.

11 . The embossing method according to claim 1 , further comprising galvanically manufacturing the die used in the second stage of the embossing method, wherein the galvanic manufacturing comprises:

providing a metal plate with a plastic layer into which the soundtrack of the die is introduced,

subsequently galvanically providing the plastic layer with a layer of silver electrolyte, onto which a separating agent is applied, and

subsequently galvanically providing the separating agent with a nickel layer that is used as the die after being removed.

12 . The embossing method according to claim 1 , wherein the first and second embossing stamp have a smooth surface towards the embossing chamber.