Self-calibration in a memory device
Systems and methods include receiving data bits at an input pin of a semiconductor device from a host device. The received data is latched in latch circuitries of the semiconductor device that at least partially implements an equalizer to aid in interpreting the received data bits. A first latched bit latched from the first received bit of the received bits is transmitted from the latch circuitries to self-calibration circuitry. The first received bit is also latched in error evaluation circuitry as a second latched bit. The second latched bit is transmitted from the error evaluation circuitry to the self-calibration circuitry. The self-calibration circuitry determines settings for the equalizer without involving the host device in determining the settings after the host device sends the data bits.
1 . A semiconductor device, comprising:
an input pin configured to receive data bits from a host device;
a plurality of latch circuitries comprising latches configured to latch the data bits for placement on an internal data bus and to at least partially implement an equalizer to aid in interpreting the received data bits, wherein the plurality of latch circuitries each corresponds to a phase of a plurality of phases of a clock received from the host device;
error evaluation circuitry comprising an error latch configured to latch a same bit as one of the latches of the plurality of latch circuitries in parallel with the one of the latches in the plurality of latch circuitries, wherein the number of bits latched in the error evaluation circuitry is fewer than the number of bits latched in the plurality of latch circuitries at one time; and
self-calibration circuitry configured to:
receive a first output from the error evaluation circuitry resulting from latching of the same bit;
receive a second output from one of the latches of the plurality of latch circuitries resulting from the one of the latches latching the same bit;
determine an error correction reference voltage based at least in part on a comparison between the first output and the second output; and
determine settings for the equalizer based at least in part on the comparison between the first output and the second output and using the error correction reference voltage.
2 . The semiconductor device of claim 1 , wherein the semiconductor device comprises a memory device.
3 . The semiconductor device of claim 1 , wherein the plurality of latch circuitries uses a data reference voltage to latch the data bits, and the data reference voltage is different than the error correction reference voltage.
4 . The semiconductor device of claim 3 , wherein the plurality of latch circuitries comprise first and second latches and selection circuitry for each bit of the data bits where the first latch corresponds to a previous bit being a logic high and the second latch corresponds to the previous bit being a logic low, and the selection circuitry is configured to select between outputs of the first and second latches based on the value of the previous bit.
5 . The semiconductor device of claim 4 , wherein the error evaluation circuitry comprises an additional error latch configured to latch the same bit and additional selection circuitry, where the first latch corresponds to a previous bit being a logic high and the second latch corresponds to the previous bit being a logic low, and the additional selection circuitry is configured to select between outputs of the error latch and the additional error latch based on the value of the previous bit.
6 . The semiconductor device of claim 5 , wherein the error latch is configured to utilize a first reference voltage corresponding to the previous bit being a logic high, the additional error latch is configured to utilize a second reference voltage corresponding to the previous bit being a logic low, and the first reference voltage and the second reference voltage are based at least in part on the error correction reference voltage.
7 . The semiconductor device of claim 1 , comprising a deserializer configured to take the data bits sent in a serial format from the host device and arrange the data bits in a parallel format for transportation via a data bus.
8 . The semiconductor device of claim 1 , wherein the settings of the equalizer are to be used for a subsequent bit of the received data bits after the same bit, and previous settings of the equalizer based on previous bits are to be used for the same bit.
9 . The semiconductor device of claim 1 , comprising a plurality of error evaluation circuitries each corresponding to a respective latch circuitry of the plurality of latch circuitries, and each of the received data bits is configured to be captured in both a respective error evaluation circuitry of the plurality of error evaluation circuitries and a respective latch circuitry of the plurality of latch circuitries.
10 . The semiconductor device of claim 1 , wherein the semiconductor device comprises a pre-amp to amplify the received data bits before transmission to the plurality of latch circuitries.
11 . A method comprising:
receiving data bits at an input pin of a semiconductor device from a host device;
latching the received data bits in a plurality of latch circuitries of the semiconductor device that at least partially implements an equalizer to aid in interpreting the received data bits;
transmitting, from the plurality of latch circuitries and to self-calibration circuitry of the semiconductor device, a first latched bit latched from a first received bit of the received bits;
latching the first received bit in an error evaluation latch of error evaluation circuitry of the semiconductor device as a second latched bit;
transmitting the second latched bit from the error evaluation circuitry to the self-calibration circuitry;
determining an error correction reference voltage based at least in part on a comparison between the first latched bit and the second latched bit;
using the self-calibration circuitry to determine settings for the equalizer without involving the host device in determining the settings after the host device sends the data bits and based at least in part on the error correction reference voltage; and
using the self-calibration circuitry to determine a first reference voltage that is based at least in part on a comparison of the first latched bit and the second latched bit, wherein latching the first received bit as the second latched bit comprises using the first reference voltage, and latching the first received bit as the first latched bit comprises using a second reference voltage.
12 . The method of claim 11 , wherein the equalizer comprises a decision feedback equalizer (DFE), and the settings comprise voltage levels or current levels associated with taps of the DFE.
13 . The method of claim 12 , wherein the settings comprise a location of a tap of the DFE in time.
14 . A memory device, comprising:
an equalizer to aid in properly interpreting data bits received at the memory device from a host device, wherein the equalizer comprises:
a data latch configured to:
latch the data bits as latched data bits, wherein the data bits are configured to be received from the host device; and
output the latched data bits based at least in part on a first reference voltage in relation to voltages of the respective data bits; and
an error evaluation latch configured to:
latch the data bits as latched error bits in parallel with the data latch; and
output the latched error bits based at least in part on a second reference voltage in relation to respective data bits;
self-calibration circuitry configured to:
receive the latched data bits and the latched error bits;
determine the second reference voltage for each data bit of the data bits based at least in part on a comparison between respective latched error bits and respective latched data bits received before the respective bit, wherein latching the data bits as the latched data bits comprises using the first reference voltage, and latching the error bits as the latched error bits comprises using the second reference voltage; and
determine settings for the equalizer based at least in part on the comparison.
15 . The memory device of claim 14 , wherein the equalizer comprises a plurality of data latches including the data latch and a plurality of error evaluation latches including the error evaluation latch, and there are equal numbers of latches in the plurality of data latches and the plurality of error evaluation latches.
16 . The memory device of claim 14 , comprising a plurality of self-calibration circuitries including the self-calibration circuitry.
17 . The memory device of claim 16 , comprising a plurality of data lines, wherein one of the self-calibration circuitries is dedicated to each data line of the plurality of data lines.
18 . The memory device of claim 14 , comprising a plurality of data lines, wherein the self-calibration circuitry is configured to be shared between the plurality of data lines.
19 . The semiconductor device of claim 1 , wherein the plurality of phases comprises four phases into which the clock is divided, and the number of bits latched into the plurality of latch circuitries at one time comprises four bits.
20 . The semiconductor device of claim 19 , wherein the error evaluation circuitry is configured to latch in a single bit at a time such that bits corresponding to three phases of the clock are not error evaluated in the error evaluation circuitry in each clock cycle.