Jumper chip component

1 . A jumper chip component to be mounted onto a printed board, the jumper chip component comprising:

a base having electrical insulation properties;

a conductor disposed on a lower surface of the base to extend from a first end of the lower surface through a second end, facing the first end, of the lower surface, the lower surface facing the printed board;

an end face electrode disposed on at least a side surface of the base and arranged to be electrically connected to the conductor; and

a step providing electrode including a pair of electrodes respectively covering a first area and a second area of a lower surface of the conductor, the first area being on a side of the first end, the second area being on a side of the second end, and the step providing electrode being arranged to provide a step between each of the pair of electrodes and the conductor, wherein:

the end face electrode includes a lower part, the end face electrode being disposed such that the lower part partially covers the step providing electrode,

the jumper chip component comprises one surface facing the printed board, the one surface having a recess in a central area of the one surface, the recess being recessed toward the conductor,

the recess is provided by the step, and

the recess comprises a lateral width defined based on widths of the pair of electrodes.

2 . The jumper chip component of claim 1 , further comprising a copper plating layer arranged to cover the conductor at least partially.

3 . The jumper chip component of claim 2 , further comprising an upper surface electrode disposed on at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

4 . The jumper chip component of claim 3 , further comprising a protective coating that covers at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

5 . The jumper chip component of claim 2 , further comprising a protective coating that covers at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

6 . The jumper chip component of claim 1 , further comprising an upper surface electrode disposed on at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

7 . The jumper chip component of claim 6 , further comprising a protective coating that covers at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

8 . The jumper chip component of claim 1 , further comprising a protective coating that covers at least a part of an upper surface of the base, the upper surface being opposite from the lower surface of the base.

9 . The jumper chip component of claim 1 , wherein

the end face electrode includes a pair of electrodes respectively disposed on a first side surface and a second side surface of the base, the first side surface being a side surface of the first end of the base, and the second side surface being a side surface of the second end of the base,

the pair of electrodes of the end face electrode respectively includes lower parts, the lower parts being disposed to respectively cover edge portions of the pair of electrodes of the step providing electrode,

the pair of electrodes of the step providing electrode respectively includes exposed portions that are exposed from the lower parts, and

the step is provided between the conductor and each of the exposed portions.