IP Library Granted Patent US 12683062
Granted Patent B2
US 12683062 · App. 17/805,691 · Granted Jul 14, 2026

Inductor

Inventors: Chieh-Pin Chang (Hsinchu, TW); Cheng-Wei Luo (Hsinchu, TW)
Assignee: Realtek Semiconductor Corporation
H01F27/2823H01F27/34
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Quick Facts
Patent No.
US 12683062
App. No.
17/805,691
Granted
Jul 14, 2026
Kind
B2
Abstract

An inductor device includes a first wire and a second wire. The first wire includes a first sub-wire and a second sub-wire. The first sub-wire is disposed in a first area. The second sub-wire is disposed in a second area, and the first sub-wire and the second sub-wire are located on different layers. The second wire includes a third sub-wire and a fourth sub-wire. The third sub-wire is disposed in the second area, and located below the second sub-wire. The fourth sub-wire is disposed in the first area, the third sub-wire and the fourth sub-wire are located on different layers, and the fourth sub-wire is located above the first sub-wire.

Claims (33)

1 . An inductor, comprising:

a first wire, comprising:

a first sub-wire, disposed in a first area; and

a second sub-wire, disposed in a second area, wherein the first sub-wire and the second sub-wire are located on different layers;

a second wire, comprising:

a third sub-wire, disposed in the second area, and located below the second sub-wire; and

a fourth sub-wire, disposed in the first area, wherein the third sub-wire and the fourth sub-wire are located on different layers, and the fourth sub-wire is located above the first sub-wire;

a first input/output element, coupled to an inner side of the first sub-wire, and overlapped with the first sub-wire and the fourth sub-wire; and

a second input/output element, coupled to an inner side of the second sub-wire, and overlapped with the second sub-wire and the third sub-wire;

wherein the first sub-wire and the fourth sub-wire are wound along a first direction, wherein the second sub-wire and the third sub-wire are wound along a second direction, wherein the first direction and the second direction are opposite.

2 . The inductor of claim 1 , wherein the first sub-wire and the third sub-wire are located on a first layer, and the second sub-wire and the fourth sub-wire are located on a second layer.

3 . The inductor of claim 1 , wherein the first direction comprises a counterclockwise direction.

4 . The inductor of claim 3 , wherein the second direction comprises a clockwise direction.

5 . The inductor of claim 1 , further comprising:

a third input/output element, coupled to an inner side of the third sub-wire, and overlapped with the second sub-wire and the third sub-wire.

6 . The inductor of claim 5 , further comprising:

a fourth input/output element, coupled to an inner side of the fourth sub-wire, and overlapped with the first sub-wire and the fourth sub-wire.

7 . The inductor of claim 6 , wherein the first input/output element and the fourth input/output element are all located in the first area.

8 . The inductor of claim 7 , wherein the first input/output element and the fourth input/output element are located on different sides of the first area.

9 . The inductor of claim 8 , wherein the second input/output element and the third input/output element are all located on the second area.

10 . The inductor of claim 9 , wherein the second input/output element and the third input/output element are located on different sides of the second area.

11 . The inductor of claim 10 , further comprising:

a first connection element, configured to couple to the first sub-wire and the second sub-wire.

12 . The inductor of claim 11 , further comprising:

a first via, configured to couple to the first sub-wire and the first connection element.

13 . The inductor of claim 12 , further comprising:

a second via, configured to couple to the first connection element and the second sub-wire.

14 . The inductor of claim 13 , further comprising:

a second connection element, configured to couple to the third sub-wire and the fourth sub-wire, and disposed with the first connection element in an interlaced manner.

15 . The inductor of claim 14 , further comprising:

a third via, configured to couple to the third sub-wire and the second connection element.

16 . The inductor of claim 15 , further comprising:

a fourth via, configured to couple to the second connection element and the fourth sub-wire.