Multilayer capacitor

Inventors: Kangha Lee (Suwon-si, KR); Yoona Park (Suwon-si, KR); Jinsoo Park (Suwon-si, KR); Eun-Jin Kim (Suwon-si, KR); Yeon Song Kang (Suwon-si, KR); Myung Jun Park (Suwon-si, KR)

Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.

H01G4/30 H01G4/008 H01G4/012 H01G4/12

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Quick Facts

Patent No.: US 12683084
App. No.: 19/095,567
Granted: Jul 14, 2026
Kind: B2

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Abstract

A multilayer capacitor includes a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including first to sixth surfaces; and first and second external electrodes disposed on both end portions of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes include first and second conductive layers disposed on the third and fourth surfaces, respectively; first and second conductive resin layers disposed on the first and second conductive layers, respectively; and first and second plating layers disposed on the first and second conductive resin layers, respectively, and contacting the first and second conductive layers in the upper or lower cover region, respectively.

Claims (48)

1 . A multilayer capacitor comprising:

a capacitor body including an active region having a dielectric layer, and first and second internal electrodes, and an upper cover region and a lower cover region respectively disposed above and below the active region, and including a first surface and a second surface, opposing each other in a first direction, a third surface and a fourth surface, opposing each other in a second direction different from the first direction, and a fifth surface and a sixth surface, opposing each other in a third direction different from the first direction; and

first and second external electrodes disposed on the third and the fourth surfaces of the capacitor body in the second direction, respectively, and connected to the first and second internal electrodes, respectively,

wherein the first external electrode comprises:

a first conductive layer disposed on the third surface of the capacitor body to be connected to the first internal electrode;

a first conductive resin layer disposed on the first conductive layer and disposed on portions of the first, second, fifth, and sixth surfaces of the capacitor body, and

a first plating layer disposed on the first conductive resin layer and contacting the first conductive layer in the upper or lower cover region,

wherein the second external electrode comprises:

a second conductive layer disposed on the fourth surface of the capacitor body to be connected to the second internal electrode;

a second conductive resin layer disposed on the second conductive layer and disposed on portions of the first, second, fifth, and sixth surfaces of the capacitor body; and

a second plating layer disposed on the second conductive resin layer and contacting the second conductive layer in the upper or lower cover region,

the first conductive layer and the first plating layer are in contact with each other, on a curved corner portion of the capacitor body to which the third surface and the first or second surface are connected, and

the second conductive layer and the second plating layer are in contact with each other, on a curved corner portion of the capacitor body to which the fourth surface and the first or second surface are connected.

2 . The multilayer capacitor of claim 1 , wherein the first conductive layer comprises a first inner conductive layer disposed on the third surface of the capacitor body, and a first outer conductive layer disposed on the first inner conductive layer, and

the second conductive layer comprises a second inner conductive layer disposed on the fourth surface of the capacitor body, and a second outer conductive layer disposed on the second inner conductive layer.

3 . The multilayer capacitor of claim 2 , wherein, in the first conductive layer, a metal component included in the first inner conductive layer is different from a metal component included in the first outer conductive layer, and

in the second conductive layer, a metal component included in the second inner conductive layer is different from a metal component included in the second outer conductive layer.

4 . The multilayer capacitor of claim 3 , wherein the first conductive resin layer includes a 1-1 conductive resin layer and a 1-2 conductive resin layer, the second conductive resin layer includes a 2-1 conductive resin layer and a 2-2 conductive resin layer, the first plating layer includes a 1-1 plating layer and a 1-2 plating layer, and the second plating layer includes a 2-1 plating layer and a 2-2 plating layer,

the first external electrode comprises a first connection portion disposed on the third surface of the capacitor body, and a first band portion extending from the first connection portion toward portions of the first, second, fifth, and sixth surfaces of the capacitor body, and

the first connection portion comprises the first conductive layer, the 1-1 conductive resin layer disposed on the first conductive layer, and the 1-1 plating layer disposed on the 1-1 conductive resin layer,

wherein the first band portion comprises the 1-2 conductive resin layer disposed on portions of the first, second, fifth, and sixth surfaces of the capacitor body, and the 1-2 plating layer extending from the 1-1 plating layer to cover the 1-2 conductive resin layer, and

the second external electrode comprises a second connection portion disposed on the fourth surface of the capacitor body, and a second band portion extending from the second connection portion toward portions of the first, second, fifth, and sixth surfaces of the capacitor body, and

the second connection portion comprises the second conductive layer, the 2-1 conductive resin layer disposed on the second conductive layer, and the 2-1 plating layer disposed on the 2-1 conductive resin layer,

wherein the second band portion comprises the 2-2 conductive resin layer disposed on portions of the first, second, fifth, and sixth surfaces of the capacitor body, and the 2-2 plating layer extending from the 2-1 plating layer to cover the 2-2 conductive resin layer.

5 . The multilayer capacitor of claim 4 , wherein a maximum thickness of the 1-2 conductive resin layer is less than a sum of a maximum thickness of the 1-1 conductive resin layer and a maximum thickness of the first conductive layer, and

a maximum thickness of the 2-2 conductive resin layer is less than a sum of a maximum thickness of the 2-1 conductive resin layer and a maximum thickness of the second conductive layer.

6 . The multilayer capacitor of claim 2 , wherein the first conductive resin layer includes a 1-1 conductive resin layer and a 1-2 conductive resin layer, the second conductive resin layer includes a 2-1 conductive resin layer and a 2-2 conductive resin layer, the first plating layer includes a 1-1 plating layer and a 1-2 plating layer, and the second plating layer includes a 2-1 plating layer and a 2-2 plating layer,

7 . The multilayer capacitor of claim 6 , wherein a maximum thickness of the 1-2 conductive resin layer is less than a sum of a maximum thickness of the 1-1 conductive resin layer and a maximum thickness of the first conductive layer, and

a maximum thickness of the 2-2 conductive resin layer is less than a sum of a maximum thickness of the 2-1 conductive resin layer and a maximum thickness of the second conductive layer.

8 . The multilayer capacitor of claim 1 , wherein the first and second conductive layers comprise at least one of copper (Cu), nickel (Ni), tin (Sn), or silver (Ag).

9 . The multilayer capacitor of claim 1 , wherein the first conductive resin layer includes a 1-1 conductive resin layer and a 1-2 conductive resin layer, the second conductive resin layer includes a 2-1 conductive resin layer and a 2-2 conductive resin layer, the first plating layer includes a 1-1 plating layer and a 1-2 plating layer, and the second plating layer includes a 2-1 plating layer and a 2-2 plating layer,

10 . The multilayer capacitor of claim 9 , wherein a maximum thickness of the 1-2 conductive resin layer is less than a sum of a maximum thickness of the 1-1 conductive resin layer and a maximum thickness of the first conductive layer, and

a maximum thickness of the 2-2 conductive resin layer is less than a sum of a maximum thickness of the 2-1 conductive resin layer and a maximum thickness of the second conductive layer.

11 . The multilayer capacitor of claim 1 , wherein the first and second conductive resin layers comprise a metal particle and a resin.

12 . The multilayer capacitor of claim 1 , wherein the first and second plating layers are a nickel (Ni) plating layer, and

the first and second external electrodes further comprises a third plating layer and a fourth plating layer respectively disposed on the first and second plating layers, respectively, and provided as a tin (Sn) plating layer.