Folded circulator device with coupling elements and flex connections for interconnects and methods of fabricating the circulator device
A device includes a top ferrite layer and a bottom ferrite layer. The device also includes a first circuit stack between the top ferrite layer and the bottom ferrite layer. The first circuit stack includes a first dielectric layer and a circulator circuit including a first circuit portion on a first side of the first dielectric layer and a second circuit portion on a second side of the first dielectric layer opposite the first side. The first circuit portion is different from the second circuit portion. The device also includes a second circuit stack including a second dielectric layer and a top ground layer disposed over the second dielectric layer. The second circuit stack is disposed over the top ferrite layer.
1 . A device comprising:
a top ferrite layer;
a bottom ferrite layer;
a first circuit stack between the top ferrite layer and the bottom ferrite layer, wherein the first circuit stack comprises a first dielectric layer and a circulator circuit comprising a first circuit portion on a first side of the first dielectric layer and a second circuit portion on a second side of the first dielectric layer opposite the first side, wherein the first circuit portion is different from the second circuit portion; and
a second circuit stack comprising a second dielectric layer and a top ground layer disposed over the second dielectric layer, wherein the second circuit stack is disposed over the top ferrite layer,
wherein the first circuit stack comprises a first plurality of connecting wings configured to be foldable, wherein the second circuit stack comprises a second plurality of connecting wings configured to be foldable.
2 . The device of claim 1 , wherein the first plurality of connecting wings is substantially pie shaped.
3 . The device of claim 1 , wherein the second plurality of connecting wings is substantially pie shaped.
4 . The device of claim 1 , wherein the first circuit stack is configured to be folded around the bottom ferrite layer to provide interconnect between the circulator circuit and a mounting surface of the device.
5 . The device of claim 4 , wherein the circulator circuit connects to the mounting surface by a first plurality of flex connections being connected between one of the first circuit portion or the second circuit portion comprising Y-junction conductors and the first plurality of connecting wings.
6 . The device of claim 4 , wherein the second plurality of connecting wings is configured to be folded around the bottom ferrite layer to connect to a bottom ground layer on the mounting surface.
7 . The device of claim 6 , wherein the top ground layer connects to the bottom ground layer by a second plurality of flex connections being connected to the second plurality of connecting wings.
8 . The device of claim 1 , wherein the first circuit stack comprises mounting pads and a middle ground layer over the first side of the first dielectric layer, wherein the mounting pads and a portion of the middle ground layer are electrically isolated and positioned on the first plurality of connecting wings.
9 . The device of claim 8 , wherein the device has a bottom surface comprising the first plurality of folded connecting wings alternately positioned with the second plurality of folded connecting wings, the bottom surface comprising the mounting pads and the portion of the middle ground layer.
10 . The device of claim 1 , further comprising a magnet over the top ferrite layer for providing magnetic bias.
11 . The device of claim 1 , wherein at least one of the first circuit portion or the second circuit portion comprises Y-junction conductors, wherein at least one of the second circuit portion or the first circuit portion comprises one or more shunt capacitors coupled to the Y-junction conductors and configured to tune the device to a reduced frequency of operation.
12 . The device of claim 11 , wherein the reduced frequency of operation is in a range from 2300 MHz to 2700 MHZ.
13 . The device of claim 1 , further comprising three or more ports, wherein one or more ports are coupled to the first circuit portion and the second circuit portion.
14 . The device of claim 13 , wherein at least one of the first circuit portion and the second circuit portion comprises a resistive element configured to terminate at least one of the three or more ports of the device to form an isolator, wherein the termination is built inside the circulator device on either the top or bottom sides of the first dielectric layer.
15 . The device of claim 1 , wherein the first dielectric layer and the bottom ferrite layer are side metallized to provide signal paths for the circulator circuit to a mounting surface.
16 . The device of claim 1 , wherein the first and second dielectric layers and the top and bottom ferrite layers are side metallized to provide electrical paths for the top ground layer to a bottom ground layer at a bottom of the device.
17 . A device comprising:
a top ferrite layer;
a bottom ferrite layer;
a first circuit stack between the top ferrite layer and the bottom ferrite layer, wherein the first circuit stack comprises a first dielectric layer and a circulator circuit comprising a first circuit portion on a first side of the first dielectric layer and a second circuit portion on a second side of the first dielectric layer opposite the first side, wherein the first circuit portion is different from the second circuit portion; and
a second circuit stack comprising a second dielectric layer and a top ground layer disposed over the second dielectric layer, wherein the second circuit stack is disposed over the top ferrite layer,
wherein the first dielectric layer and the bottom ferrite layer are side metallized to provide signal paths for the circulator circuit to a mounting surface.
18 . A device comprising:
a top ferrite layer;
a bottom ferrite layer;
a first circuit stack between the top ferrite layer and the bottom ferrite layer, wherein the first circuit stack comprises a first dielectric layer and a circulator circuit comprising a first circuit portion on a first side of the first dielectric layer and a second circuit portion on a second side of the first dielectric layer opposite the first side, wherein the first circuit portion is different from the second circuit portion; and
a second circuit stack comprising a second dielectric layer and a top ground layer disposed over the second dielectric layer, wherein the second circuit stack is disposed over the top ferrite layer,
wherein the first and second dielectric layers and the top and bottom ferrite layers are side metallized to provide electrical paths for the top ground layer to a bottom ground layer at a bottom of the device.
19 . A method for fabricating a circulator device, the method comprising:
forming a first circuit stack comprising a first circuit portion of a circulator circuit on a first side of a first dielectric layer and a second circuit portion of the circulator circuit on a second side of the first dielectric layer opposite to the first side, wherein the second circuit portion is different from the first circuit portion, the first circuit stack comprising a first plurality of connecting wings configured to be foldable;
forming a second circuit stack comprising a second dielectric layer and a top ground layer disposed over the second dielectric layer, the second circuit stack comprising a second plurality of connecting wings configured to be foldable;
forming a device stack comprising a bottom ferrite layer, the first circuit stack disposed over the bottom ferrite layer, a top ferrite layer disposed over the first circuit stack, and the second circuit stack disposed over the top ferrite layer;
folding the first plurality of connecting wings of the first circuit stack to a bottom of the bottom ferrite layer; and
folding the second plurality of connecting wings of the second circuit stack to the bottom of the bottom ferrite layer to form the circulator device having a bottom surface.
20 . The method of claim 19 , further comprising attaching a magnet to the top ground layer by adhesive.
21 . The method of claim 19 , wherein the first and second dielectric layers comprise one of polymer, fiber-reinforced polymer, or ceramic material.
22 . The method of claim 19 , wherein one of the first circuit portion and the second circuit portion comprises Y-junction conductors, wherein the first circuit stack comprises a middle ground layer and mounting pads on a same side as the one of the first circuit portion and the second circuit portion, wherein another one of the first circuit portion and the second circuit portion comprises tuning elements comprising a shunt capacitor configured to tune the circulator device to a reduced frequency.
23 . The method of claim 22 , wherein each of the top ground layer, the middle ground layer, and the circulator circuit comprises a metal selected from one or more of gold, silver, copper, aluminum, or tin.
24 . The method of claim 22 , wherein the bottom surface comprises the first plurality of folded connecting wings alternately positioned with the second plurality of folded connecting wings, the bottom surface comprising the mounting pads and the portion of the middle ground layer.
25 . A method for fabricating a circulator device, the method comprising:
forming a first circuit stack comprising a first circuit portion of a circulator circuit on a first side of a first dielectric layer and a second circuit portion of the circulator circuit on a second side of the first dielectric layer opposite to the first side, wherein the second circuit portion is different from the first circuit portion;
forming a second circuit stack comprising a second dielectric layer and a top ground layer disposed over the second dielectric layer;
plating a first edge portion of a bottom ferrite layer to provide signal paths from the first circuit portion and the second circuit portion to a mounting surface of the circulator device; and
forming a device stack comprising the bottom ferrite layer, the first circuit stack disposed over the bottom ferrite layer, a top ferrite layer disposed over the first circuit stack, and the second circuit stack disposed over the top ferrite layer.
26 . The method of claim 25 , further comprising plating an edge portion of the top ferrite layer and a second edge portion of the bottom ferrite layer to provide an electrical path from the top ground layer or a middle ground layer to a bottom ground layer.