IP Library › Granted Patent US 12683265
Granted Patent B2
US 12683265 · App. 17/791,257 · Granted Jul 14, 2026

Electronic element connection structure and electronic device

Inventors: Yan Wang (Shenzhen, CN); Jiuliang Gao (Shenzhen, CN)
Assignee: HONOR DEVICE CO., LTD.
H01Q1/243H01Q1/38H01Q1/52H04B1/3816
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Quick Facts
Patent No.
US 12683265
App. No.
17/791,257
Granted
Jul 14, 2026
Kind
B2
Abstract

An electronic element connection structure includes a connecting board, a first element, and a second element. The first element is connected to one side of the connecting board, and the second element is connected to an other side of the connecting board. A vertical projection of the first element on a preset plane overlaps with a vertical projection of the second element on the preset plane, where the preset plane is parallel to a plane on which one of the sides of the connecting board is located. A distance between the first element and the second element in a direction perpendicular to the preset plane is greater than or equal to a threshold distance.

Claims (39)

1 . An electronic element connection structure, comprising:

a connecting board;

a first element, which is an antenna elastic piece, connected to one side of the connecting board; and

a second element, which is a SIM card holder, connected to an other side of the connecting board;

wherein a vertical projection of the first element on a preset plane overlaps with a vertical projection of the second element on the preset plane, wherein the preset plane is parallel to a plane on which at least one of the one side or the other side of the connecting board is located;

wherein a distance between the first element and the second element in a direction perpendicular to the preset plane is greater than or equal to a threshold distance; and

wherein a protrusion of a part of the connecting board is arranged on the one side of the connecting board, and the first element is connected to the protrusion.

2 . The electronic element connection structure according to claim 1 , wherein the connecting board comprises a first sub-connecting board and a second sub-connecting board, the first element is connected to a first side of the first sub-connecting board, and the second element is connected to a second side of the second sub-connecting board;

wherein a second side of the first sub-connecting board is connected to a first side of the second sub-connecting board, and an area of the first sub-connecting board is less than that of the second sub-connecting board; and

wherein the first side of the first sub-connecting board is opposite to the second side of the first sub-connecting board, and the first side of the second sub-connecting board is opposite to the second side of the second sub-connecting board.

3 . The electronic element connection structure according to claim 2 , wherein the first element is sunk into the first sub-connecting board, and the distance between the first element and the second sub-connecting board in the direction perpendicular to the preset plane is greater than or equal to a preset distance.

4 . The electronic element connection structure according to claim 2 , wherein the first sub-connecting board and the second sub-connecting board are connected to each other by welding.

5 . The electronic element connection structure according to claim 3 , wherein the first sub-connecting board and the second sub-connecting board are connected to each other by welding.

6 . The electronic element connection structure according to claim 2 , wherein a thickness of the first sub-connecting board is 0.4 mm to 1.0 mm, and a thickness of the second sub-connecting board is 0.4 mm to 1.0 mm.

7 . The electronic element connection structure according to claim 3 , wherein a thickness of the first sub-connecting board is 0.4 mm to 1.0 mm, and a thickness of the second sub-connecting board is 0.4 mm to 1.0 mm.

8 . The electronic element connection structure according to claim 2 , wherein a thickness of the first sub-connecting board is less than 0.3 mm, and a thickness of the second sub-connecting board is less than 0.3 mm.

9 . The electronic element connection structure according to claim 1 , wherein the connecting board is a PCB.

10 . The electronic element connection structure according to claim 1 , wherein the threshold distance is a minimum distance that prevents mutual interference between the first element and the second element.

11 . An electronic device, comprising:

a housing; and

the electronic element connection structure according to claim 1 ,

wherein the electronic element connection structure is connected to the housing.

12 . An electronic element connection structure, comprising:

a connecting board;

a first element, which is an antenna elastic piece, connected to one side of the connecting board; and

a second element, which is a SIM card holder, connected to an other side of the connecting board;

a distance between a vertical projection of the first element on a preset plane and a vertical projection of the second element on the preset plane is less than a threshold distance, wherein the preset plane is parallel to a plane on which at least one of the one side or the other side of the connecting board is located;

wherein a distance between the first element and the second element in a direction perpendicular to the preset plane is greater than or equal to the threshold distance; and

wherein a protrusion is arranged on the one side of the connecting board, and the first element is connected to the protrusion.

13 . The electronic element connection structure according to claim 12 , wherein the connecting board comprises a first sub-connecting board and a second sub-connecting board, the first element is connected to a first side of the first sub-connecting board, and the second element is connected to a second side of the second sub-connecting board;

wherein a second side of the first sub-connecting board is connected to a first side of the second sub-connecting board, and an area of the first sub-connecting board is less than that of the second sub-connecting board; and

wherein the first side of the first sub-connecting board is opposite to the second side of the first sub-connecting board, and the first side of the second sub-connecting board is opposite to the second side of the second sub-connecting board.

14 . The electronic element connection structure according to claim 13 , wherein the first element is sunk into the first sub-connecting board, and the distance between the first element and the second sub-connecting board in the direction perpendicular to the preset plane is greater than or equal to a preset distance.

15 . The electronic element connection structure according to claim 13 , wherein the first sub-connecting board and the second sub-connecting board are connected to each other by welding.

16 . The electronic element connection structure according to claim 14 , wherein the first sub-connecting board and the second sub-connecting board are connected to each other by welding.

17 . The electronic element connection structure according to claim 13 , wherein a thickness of the first sub-connecting board is 0.4 mm to 1.0 mm, and a thickness of the second sub-connecting board is 0.4 mm to 1.0 mm.

18 . The electronic element connection structure according to claim 13 , wherein a thickness of the first sub-connecting board is less than 0.3 mm, and a thickness of the second sub-connecting board is less than 0.3 mm.

19 . The electronic element connection structure according to claim 12 , wherein the connecting board is a PCB.

20 . The electronic element connection structure according to claim 12 , wherein the threshold distance is a minimum distance that prevents mutual interference between the first element and the second element.