IP Library › Granted Patent US 12683276
Granted Patent B2
US 12683276 · App. 18/694,811 · Granted Jul 14, 2026

Method of improved power integrity for mmWave phased array antennas using microvias

Inventors: Ian Jeffery Timmins (St. Petersburg, FL); Babak Zarrin Rafie (St. Petersburg, FL); Youssef Faltone (St. Petersburg, FL); John Finnell (St. Petersburg, FL)
Assignee: Jabil Inc.
H01Q3/36H05K1/115H05K1/0366H05K2201/10098
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Quick Facts
Patent No.
US 12683276
App. No.
18/694,811
Granted
Jul 14, 2026
Kind
B2
Abstract

A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer. Microvias extend through the first prepreg layer that electrically couple the thick copper layer to the signal layer and microvias extend through the second prepreg layer that electrically couple the thin copper layer to the signal layer, where the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

Claims (31)

1 . An antenna comprising:

a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick conductive power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin conductive power layer formed on a side of second prepreg layer opposite to the signal layer; and

a plurality of microvias extending through the first prepreg layer that electrically couple the thick conductive layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin conductive layer to the signal layer, wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

2 . The antenna according to claim 1 further comprising a beamforming integrated circuit (IC) formed on the thick conductive layer.

3 . The antenna according to claim 2 further comprising an antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

4 . The antenna according to claim 3 wherein the antenna radiating element is a patch antenna radiating element.

5 . The antenna according to claim 1 wherein the thick and thin conducting layers are copper layers.

6 . The antenna according to claim 1 wherein the antenna is a phased array antenna.

7 . The antenna according to claim 6 wherein the antenna is part of a 5G radio.

8 . A phased array antenna comprising:

a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer; and

a plurality of microvias extending through the first prepreg layer that electrically couple the thick copper layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin copper layer to the signal layer, wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.

9 . The antenna according to claim 8 further comprising a beamforming integrated circuit (IC) formed on the thick copper layer.

10 . The antenna according to claim 9 further comprising an antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

11 . The antenna according to claim 10 wherein the antenna radiating element is a patch antenna radiating element.

12 . The antenna according to claim 8 wherein the antenna is part of a 5G radio.

13 . A phased array antenna comprising:

a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer;

a plurality of microvias extending through the first prepreg layer that electrically couple the thick copper layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin copper layer to the signal layer, wherein the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer;

a beamforming integrated circuit (IC) formed on the thick copper layer; and

a patch antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

14 . The antenna according to claim 13 wherein the antenna is part of a 5G radio.

15 . An antenna comprising:

a printed circuit board (PCB) structure including a plurality of layers, said plurality of layers including a thick conductive power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin conductive power layer formed on a side of second prepreg layer opposite to the signal layer;

a plurality of microvias extending through the first prepreg layer that electrically couple the thick conductive layer to the signal layer and a plurality of microvias extending through the second prepreg layer that electrically couple the thin conductive layer to the signal layer;

a beamforming integrated circuit (IC) formed on the thick conductive layer; and

an antenna radiating element formed on a dielectric layer at an opposite side of the PCB structure from the beamforming IC.

16 . The antenna according to claim 3 wherein the antenna radiating element is a patch antenna radiating element.

17 . The antenna according to claim 1 wherein the thick and thin conducting layers are copper layers.

18 . The antenna according to claim 1 wherein the antenna is a phased array antenna.

19 . The antenna according to claim 18 wherein the antenna is part of a 5G radio.