Manufacturing method of light-emitting device, and light-emitting device

1 . A manufacturing method of a light-emitting device, comprising:

preparing a mounting substrate having a flat upper surface including a mounting surface, the mounting substrate including a first metal pattern arranged on the upper surface, a second metal pattern arranged on the upper surface inward of the first metal pattern in a plan view, and a third metal pattern arranged on the upper surface outward of the first metal pattern in the plan view;

arranging a light-emitting element over the mounting surface of the mounting substrate;

applying a bonding material to the first metal pattern; and

joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than a width of the first metal pattern, an outer side of the fourth metal pattern being arranged inward of an outer side of the third metal patten in the plan view, and an inner side of the fourth metal pattern being arranged outward of an inner side of the second metal pattern in the plan view.

2 . The manufacturing method according to claim 1 , wherein

the preparing of the mounting substrate includes preparing the mounting substrate including the first metal pattern with the width in a range greater than or equal to 100 μm and less than 200 μm, the second metal pattern with a width in a range of greater than 50 μm and less than or equal to 100 μm, and the third metal pattern with a width in a range of greater than 50 μm and less than or equal to 100 μm.

3 . The manufacturing method according to claim 2 , wherein

the preparing of the mounting substrate includes preparing the mounting substrate in which a sum of the width of the first metal pattern, the width of the second metal pattern, the width of the third metal pattern, a distance from the first metal pattern to the second metal pattern, and a distance from the first metal pattern to the third metal pattern is less than or equal to 500 μm.

4 . The manufacturing method according to claim 1 , wherein

the preparing of the mounting substrate includes preparing the mounting substrate including the second metal pattern and the third metal pattern having the same width.

5 . The manufacturing method according to claim 1 , wherein

the preparing of the mounting substrate includes preparing the mounting substrate in which the second metal pattern is spaced apart from the first metal pattern by a distance in a range from 30 μm to 200 μm, and the third metal pattern is spaced apart from the first metal pattern by a distance in a range from 30 μm to 200 μm.

6 . The manufacturing method according to claim 1 , wherein

the preparing of the mounting substrate includes preparing the mounting substrate in which a sum of the width of the first metal pattern, a width of the second metal pattern, a width of the third metal pattern, a distance from the first metal pattern to the second metal pattern, and a distance from the first metal pattern to the third metal pattern is less than or equal to 500 μm.

7 . The manufacturing method according to claim 1 , wherein

the joining of the sealing member includes joining the sealing member and the mounting substrate such that the fourth metal pattern overlaps all of the first metal pattern, a portion of the second metal pattern, and a portion of the third metal pattern in the plan view.

8 . A light-emitting device comprising:

a mounting substrate having a flat upper surface including a mounting surface, the mounting substrate including a first metal pattern arranged on the upper surface, a second metal pattern arranged on the upper surface inward of the first metal pattern in a plan view, and a third metal pattern arranged on the upper surface outward of the first metal pattern in the plan view;

a light-emitting element arranged over the mounting surface; and

a sealing member joined to at least the first metal pattern of the mounting substrate via a joining member, the sealing member including a fourth metal pattern with a width greater than a width of the first metal pattern, an outer side of the fourth metal pattern being arranged inward of an outer side of the third metal patten in the plan view, and an inner side of the fourth metal pattern being arranged outward of an inner side of the second metal pattern in the plan view.

9 . The light-emitting device according to claim 8 , wherein

the mounting substrate includes the first metal pattern with the width in a range greater than or equal to 100 μm and less than 200 μm, the second metal pattern with a width in a range of greater than 50 μm and less than or equal to 100 μm, and the third metal pattern with a width in a range of greater than 50 μm and less than or equal to 100 μm.

10 . The light-emitting device according to claim 9 , wherein

a sum of the width of the first metal pattern, the width of the second metal pattern, the width of the third metal pattern, a distance from the first metal pattern to the second metal pattern, and a distance from the first metal pattern to the third metal pattern is less than or equal to 500 μm.

11 . The light-emitting device according to claim 8 , wherein

a width of the second metal pattern and a width of the third metal pattern are the same.

12 . The light-emitting device according to claim 8 , wherein

the second metal pattern is spaced apart from the first metal pattern by a distance in a range from 30 μm to 200 μm, and the third metal pattern is spaced apart from the first metal pattern by a distance in a range from 30 μm to 200 μm.

13 . The light-emitting device according to claim 8 , wherein

a sum of the width of the first metal pattern, a width of the second metal pattern, a width of the third metal pattern, a distance from the first metal pattern to the second metal pattern, and a distance from the first metal pattern to the third metal pattern is less than or equal to 500 μm.

14 . The light-emitting device according to claim 8 , wherein

the fourth metal pattern overlaps all of the first metal pattern, a portion of the second metal pattern, and a portion of the third metal pattern in the plan view.

15 . The light-emitting device according to claim 14 , wherein

the joining member is a cured bonding material, and

the joining member is arranged between the first metal pattern and the fourth metal pattern, between the first metal pattern and the second metal pattern, and between the first metal pattern and the third metal pattern.

16 . The light-emitting device according to claim 15 , wherein

the sealing member includes a joint surface,

the fourth metal pattern is provided at the joint surface, the fourth metal pattern having a width smaller than a width of the joint surface, and

the joining member does not protrude beyond the joint surface in the plan view.

17 . A manufacturing method of a light-emitting device, comprising:

preparing a mounting substrate having a flat upper surface including a mounting surface, the mounting substrate including a first metal pattern arranged on the upper surface, a second metal pattern arranged on the upper surface inward of the first metal pattern in a plan view, and a third metal pattern arranged on the upper surface outward of the first metal pattern in the plan view:

arranging a light-emitting element over the mounting surface of the mounting substrate;

applying a bonding material to the first metal pattern; and

joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than a width of the first metal pattern, wherein

the joining of the sealing member includes preparing the sealing member so that the fourth metal pattern includes a thin portion with a smaller thickness than other portions of the fourth metal pattern.

18 . A light-emitting device comprising:

a mounting substrate having a flat upper surface including a mounting surface, the mounting substrate including a first metal pattern arranged on the upper surface, a second metal pattern arranged on the upper surface inward of the first metal pattern in a plan view, and a third metal pattern arranged on the upper surface outward of the first metal pattern in the plan view:

a light-emitting element arranged over the mounting surface; and

a sealing member joined to at least the first metal pattern of the mounting substrate via a joining member, the sealing member including a fourth metal pattern with a width greater than a width of the first metal pattern, wherein

the fourth metal pattern includes a thin portion with a smaller thickness than other portions of the fourth metal pattern.