Filter, multiplexer, and multilayer electronic component
A filter includes a multilayer body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked in a stack direction, an inductor including a first conductor pattern formed of at least one of the plurality of conductor layers, and a second conductor pattern provided in the multilayer body, the second conductor pattern being not connected to other conductors in the multilayer body, X≤7.5×10 7 /(fc×√{square root over (εr)}) being satisfied where a maximum width of the second conductor pattern is X (m), a frequency at a high-frequency end of a passband is fc (Hz), and a relative permittivity of the plurality of dielectric layers is εr.
1 . A filter comprising:
a multilayer body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked in a stack direction;
an inductor including a first conductor pattern formed of at least one of the plurality of conductor layers; and
a second conductor pattern provided in the multilayer body, the second conductor pattern being not connected to other conductors in the multilayer body, X≤7.5×10 7 /(fc×√{square root over (εr)}) being satisfied where a maximum width of the second conductor pattern is X (m), a frequency at a high-frequency end of a passband of the filter is fc (Hz), and a relative permittivity of the plurality of dielectric layers is εr.
2 . The filter according to claim 1 , wherein the second conductor pattern is formed of a via conductor layer penetrating through at least one of the plurality of dielectric layers.
3 . The filter according to claim 1 , wherein the frequency at the high-frequency end of the passband is 1 GHz or higher.
4 . The filter according to claim 1 , wherein the second conductor pattern does not overlap the first conductor pattern when viewed from the stack direction.
5 . The filter according to claim 1 , wherein the plurality of conductor layers and the second conductor pattern are mainly composed of the same element.
6 . The filter according to claim 1 , wherein the plurality of conductor layers and the second conductor pattern contain silver.
7 . The filter according to claim 6 , wherein the second conductor pattern is formed of a via conductor layer that penetrates through at least one of adjacent dielectric layers with the first conductor pattern interposed therebetween among the plurality of dielectric layers.
8 . The filter according to claim 6 , wherein the second conductor pattern is formed of at least one of the following: a conductor layer on which the first conductor pattern is formed, and a conductor layer provided on a first surface of a first dielectric layer adjacent to the conductor layer of the plurality of dielectric layers, the first surface being opposite from a second surface, on which the first conductor pattern is provided, of the first dielectric layer.
9 . The filter according to claim 1 , wherein the filter is a low-pass filter or a bandpass filter.
10 . A multiplexer comprising the filter according to claim 1 .
11 . A multilayer electronic component comprising:
a multilayer body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked in a stack direction;
an inductor including a first conductor pattern formed of at least one of the plurality of conductor layers; and
a second conductor pattern provided in the multilayer body, the second conductor pattern being not connected to other conductors in the multilayer body, X≤10×10 7 /(fs×√{square root over (εr)}) being satisfied where a maximum width of the second conductor layer is X (m), a self-resonant frequency of the inductor is fs (Hz), and a relative permittivity of the plurality of dielectric layers is εr.