Endoscopic light source-imaging module
An endoscopic light source-imaging module including a substrate, an image sensor, and a light-emitting element is provided. The top surface of the substrate is provided with a cavity. The cavity has a first surface and a second surface neighboring each other and having a preset height drop therebetween. A first conductive route and a second conductive route of the substrate extend from the top surface penetrating through the substrate to a bottom surface. The image sensor is disposed on the first surface and is electrically connected to the first conductive route. The light-emitting element is disposed on the second surface, neighboring one side of the image sensor and electrically connected to the second conductive route. The present invention improves the image quality of the endoscope, reduces the module size, decreases the fabrication stages, increases the productivity, and lowers the cost.
1 . An endoscopic light source-imaging module comprising: a substrate comprising a top surface, a bottom surface, a first conductive route, and a second conductive route, wherein a cavity is provided on the top surface, the cavity has a first surface and a second surface, the first surface and the second surface neighbor each other and have a preset height drop therebetween, a height of the first surface is less than a height of the second surface, and the height of the second surface is less than a height of the top surface, and the first conductive route and the second conductive route extend from the top surface penetrating through the substrate to the bottom surface; an image sensor disposed on the first surface and electrically connected with the first conductive route; and a light-emitting element disposed on the second surface, neighboring one side of the image sensor, and electrically connected with the second conductive route, wherein a height of a surface of the image sensor is higher than a height of a top surface of the light-emitting element; and a filling material, the filling material is filled into the cavity to cover the first surface and the second surface of the cavity and is cured to form an encapsulation resin layer, wherein the filling material includes an opaque filling material, a transparent filling material, or combinations thereof, and wherein a height of the encapsulation resin layer is configured relative to a height of a top surface of the light emitting element and a height of a surface of the image sensor, wherein, the substrate has a plurality of cut grooves around the cavity, and a light source image module is formed by cutting along a plurality of cutting grooves.
2 . The endoscopic light source-imaging module according to claim 1 , wherein one end of the first conductive route has a first connection point, and the other end of the first conductive route has a second connection point; the first connection point is disposed on the first surface; the second connection point is disposed on the bottom surface.
3 . The endoscopic light source-imaging module according to claim 2 , wherein the second connection point is configured for an image signal output point of the image sensor.
4 . The endoscopic light source-imaging module according to claim 1 , wherein one end of the second conductive route has a third connection point, and the other end of the second conductive route has a fourth connection point; the third connection point is disposed on the second surface; the fourth connection point is disposed on the bottom surface.
5 . The endoscopic light source-imaging module according to claim 4 , wherein the fourth connection point is connected with an external power source to make the light-emitting element emit light.
6 . The endoscopic light source-imaging module according to claim 1 , wherein the filling material is an opaque resin material, and a height of the encapsulation resin layer is lower than or equal to a height of a top surface of the light-emitting element.
7 . The endoscopic light source-imaging module according to claim 1 , wherein the filling material is a transparent resin material, and a height of the encapsulation resin layer is higher than a height of a top surface of the light-emitting element and lower than or equal to a height of a surface of the image sensor.
8 . The endoscopic light source-imaging module according to claim 1 , wherein the cavity has two second surfaces, and the endoscopic light source-imaging module has two light-emitting elements; the second surfaces are respectively arranged on two sides of the cavity; a region between the second surfaces sinks to form the first surface; the light-emitting elements are respectively arranged on the second surfaces.
9 . The endoscopic light source-imaging module according to claim 1 , wherein the substrate has a plurality of cavities, which are arranged in array; each of the cavities has the first surface, the second surface, the first conductive route, and the second conductive route.
10 . The endoscopic light source-imaging module according to claim 9 , wherein the endoscopic light source-imaging module has a plurality of image sensors and a plurality of light-emitting elements; a count of the light-emitting elements is greater than or equal to a count of the image sensors; the plurality of image sensors are respectively disposed on the first surfaces of the plurality of cavities; the plurality of light-emitting elements are respectively disposed on the second surface of the plurality of cavities.
11 . The endoscopic light source-imaging module according to claim 1 , wherein when the filling material comprises an opaque filling material and a transparent filling material, the opaque filling material being filled within the cavity to cover the first surface and the second surface of the cavity, and the transparent filling material being filled within the cavity and on top of the opaque filling material, and a height of the transparent filling material is higher than a height of the opaque filling material.
12 . The endoscopic light source-imaging module according to claim 11 , wherein the opaque filling material partially covers the light-emitting element and the image sensor, and the transparent filling material covers a remaining portion of the light-emitting element and partially covers the image sensor.