Micro speaker structure with acoustic mesh
A micro speaker structure is provided. The micro speaker structure includes a substrate, a diaphragm, a coil, a circuit board, and at least one acoustic mesh. The substrate has a hollow chamber. The diaphragm is disposed over the substrate and covers the hollow chamber. The coil is embedded in the diaphragm. The circuit board is attached to the substrate, wherein at least one vent hole passes through the top surface and the bottom surface of the circuit board. The acoustic mesh is disposed on the bottom surface of the circuit board to cover the vent hole. The acoustic mesh has a plurality of pores to allow sound to pass through, and the pores are smaller than the vent hole.
1 . A micro speaker structure, comprising:
a substrate having a hollow chamber;
a diaphragm disposed over the substrate and covering the hollow chamber;
a coil embedded in the diaphragm;
a circuit board attached to the substrate, wherein at least one vent hole passes through a top surface and a bottom surface of the circuit board; and
at least one acoustic mesh disposed on the bottom surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, and the pores are smaller than the at least one vent hole, wherein an average open area percentage of the pores is greater than 0.1% and less than 20%.
2 . The micro speaker structure as claimed in claim 1 , wherein a size of each of the pores is greater than 0.1 μm and less than 20 μm.
3 . The micro speaker structure as claimed in claim 1 , wherein the at least one acoustic mesh comprises a plurality of acoustic meshes, and the acoustic meshes are stacked on top of each other on the bottom surface of the circuit board.
4 . The micro speaker structure as claimed in claim 3 , wherein the acoustic meshes have the same spore size and the same average open area percentage.
5 . The micro speaker structure as claimed in claim 3 , wherein the acoustic meshes have different pore sizes and different average open area percentages.
6 . The micro speaker structure as claimed in claim 1 , wherein the at least one acoustic mesh comprises a plurality of acoustic meshes, and the acoustic meshes are arranged side by side on the bottom surface of the circuit board.
7 . The micro speaker structure as claimed in claim 6 , wherein the acoustic meshes have different pore sizes and different average open area percentages.
8 . The micro speaker structure as claimed in claim 1 , further comprising:
a first permanent magnetic element disposed on the top surface of the circuit board and in the hollow chamber.
9 . The micro speaker structure as claimed in claim 8 , wherein the circuit board has a cavity recessed from the top surface of the circuit board, wherein the cavity is configured to accommodate the first permanent magnetic element.
10 . The micro speaker structure as claimed in claim 8 , wherein the at least one vent hole comprises a plurality of vent holes, and the vent holes are disposed around the first permanent magnetic element.
11 . The micro speaker structure as claimed in claim 1 , further comprising:
a lid wrapped around the substrate and the diaphragm, wherein the lid has an air opening that exposes a portion of the top surface of the diaphragm.
12 . The micro speaker structure as claimed in claim 11 , wherein the lid is made of a metal material having a magnetic permeability that is lower than 1.25×10 −4 H/m.
13 . The micro speaker structure as claimed in claim 11 , further comprising:
a second permanent magnetic element disposed on the lid, wherein the second permanent magnetic element is located below or above the air opening.
14 . The micro speaker structure as claimed in claim 1 , wherein the coil comprises a first metal layer and a second metal layer, and
wherein the first metal layer has a spiral structure surrounding a central axis of the diaphragm, and the second metal layer crosses over the spiral structure of the first metal layer and is electrically connected to the first metal layer.
15 . A micro speaker structure, comprising:
a substrate having a hollow chamber;
a diaphragm disposed over the substrate and covering the hollow chamber;
a coil embedded in the diaphragm;
a circuit board attached to the substrate and having at least one vent hole, wherein the at least one vent hole is configured to allow the hollow chamber to communicate with an external environment;
at least one acoustic mesh disposed on a surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, wherein a size of each of the pores is greater than 0.1 μm and less than 20 μm; and
a lid wrapped around the substrate and the diaphragm, wherein the lid has an air opening that exposes a portion of the top surface of the diaphragm.
16 . The micro speaker structure as claimed in claim 15 , wherein an average open area percentage of the pores is greater than 0.1% and less than 20%.
17 . The micro speaker structure as claimed in claim 15 , further comprising:
a first permanent magnetic element disposed on the circuit board and in the hollow chamber; and
a second permanent magnetic element disposed on the lid, wherein the first permanent magnetic element and the second permanent magnetic element are aligned in a vertical direction.
18 . The micro speaker structure as claimed in claim 15 , wherein the at least one acoustic mesh is disposed on the surface of the circuit board opposite the lid.
19 . A micro speaker structure, comprising:
a substrate having a hollow chamber;
a diaphragm disposed over the substrate and covering the hollow chamber;
a coil embedded in the diaphragm;
a circuit board attached to the substrate and having at least one vent hole, wherein the at least one vent hole is configured to allow the hollow chamber to communicate with an external environment;
a permanent magnetic element disposed on a top surface of the circuit board facing the diaphragm and in the hollow chamber, wherein the circuit board further has a cavity recessed from the top surface of the circuit board for accommodating the permanent magnetic element;
at least one acoustic mesh disposed on a surface of the circuit board to cover the at least one vent hole, wherein the at least one acoustic mesh has a plurality of pores to allow sound to pass through, wherein a size of each of the pores is greater than 0.1 μm and less than 20 μm; and
a lid wrapped around the substrate and the diaphragm, wherein the lid has an air opening that exposes a portion of the top surface of the diaphragm.