IP Library Granted Patent US 12684682
Granted Patent B2
US 12684682 · App. 18/501,089 · Granted Jul 14, 2026

Electronic apparatus and image pickup apparatus

Inventors: Honkai Tomimoto (Tokyo, JP); Hideki Kawashima (Tokyo, JP)
Assignee: CANON KABUSHIKI KAISHA
H05K1/0203H04N23/52H04N23/53H04N23/54H05K1/14H05K7/20272H05K2201/042
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Quick Facts
Patent No.
US 12684682
App. No.
18/501,089
Granted
Jul 14, 2026
Kind
B2
Abstract

An electronic apparatus includes a first board having a heat generating element, a second board, a support member having a fixing part to which the second board is fixed, and which supports the second board so as to overlap with the first board separated by a distance, and a heat dissipation member on an opposite side of the first board across the second board and the support member, so as to overlap with the second board separated by a distance. The support member includes a heat receiving part thermally connected to the heat generating element, a first heat transfer part which transfers heat received by the heat receiving part to the heat dissipation member, and a second heat transfer part which transfers heat received by the fixing part to the heat dissipation member. The support member has a shape which reduces heat transfer from the heat receiving part to the fixing part.

Claims (43)

1 . An electronic apparatus comprising:

a first board on which a heat generating element is mounted;

a second board;

a support member which includes a fixing part to which the second board is fixed, and which supports the second board so as to overlap with the first board separated by a distance; and

a heat dissipation plate which is arranged on an opposite side of the first board across the second board and the support member, so as to overlap with the second board separated by a distance,

wherein the support member includes a heat receiving part which is thermally connected to the heat generating element, a first heat transfer part which transfers heat received by the heat receiving part to the heat dissipation plate, and a second heat transfer part which transfers heat received by the fixing part to the heat dissipation plate, and

wherein the support member has a shape which reduces heat transfer from the heat receiving part to the fixing part.

2 . The electronic apparatus according to claim 1 , wherein the support member includes a portion disposed between the heat receiving part and the fixing part, the portion having a heat transfer cross-sectional area smaller than a heat transfer cross-sectional area of the heat receiving part and a heat transfer cross-sectional area of the fixing part.

3 . The electronic apparatus according to claim 2 ,

wherein the support member is formed from a sheet metal, and has a step between the heat receiving part and the fixing part, and

wherein a thickness of a connecting part of the step is smaller than a thickness of each of the heat receiving part, the fixing part, the first heat transfer part, and the second heat transfer part.

4 . The electronic apparatus according to claim 2 , wherein a through hole is provided at a position on a side of the heat receiving part in the fixing part or between the heat receiving part and the fixing part in the support member.

5 . The electronic apparatus according to claim 1 , wherein the support member has a shape that does not contact the second board in an area of the second board where a non-heat resistant element is mounted.

6 . The electronic apparatus according to claim 1 , wherein the first board and the second board are arranged so that the heat generating element, the second board, and a part of the first heat transfer part that is thermally connected to the heat dissipation plate overlap with one another separated by a distance.

7 . The electronic apparatus according to claim 1 ,

wherein the heat dissipation plate forms at least a part of a duct through which a cooling medium flows, and

wherein the first heat transfer part is thermally connected to the heat dissipation plate at a position closer to an inlet through which the cooling medium flows into the duct than an outlet through which the cooling medium flows out from the duct.

8 . The electronic apparatus according to claim 7 , wherein the first heat transfer part is thermally connected to the heat dissipation plate on an upstream side of the second heat transfer part in a direction in which the cooling medium flows in the duct.

9 . The electronic apparatus according to claim 7 ,

wherein a first area where a flow velocity of the cooling medium is fast and a second area where the flow velocity is slower than that in the first area are provided in the duct, and

wherein the first heat transfer part and the second heat transfer part are thermally connected to the heat dissipation plate in the first area.

10 . The electronic apparatus according to claim 1 , wherein the electronic apparatus is an image pickup apparatus which has an image sensor, and where the heat generating element performs image processing on a signal output from the image sensor.

11 . An image pickup apparatus comprising:

a finder into which a user looks;

a board on which a heat generating element is mounted; and

a heat dissipation member to which the heat generating element is thermally connected, and which forms at least a part of a duct through which a cooling medium flows,

wherein the duct includes an inlet into which the cooling medium flows, and a first outlet and second outlet though which the cooling medium flows out,

wherein the inlet is provided on a bottom surface of the image pickup apparatus,

wherein the first outlet is provided on a side surface of the image pickup apparatus,

wherein the second outlet is provided on a side of a back surface of the image pickup apparatus where the finder is located,

such that the second outlet does not overlap with the view finder in short-side direction of the finder.

12 . The image pickup apparatus according to claim 11 , wherein in a rear view of the image pickup apparatus, the inlet, an area of the heat dissipation member to which the heat generating element is thermally connected, and the second outlet are arranged in an up-and down direction of the image pickup apparatus.

13 . The image pickup apparatus according to claim 11 ,

wherein two outlets are provided on both sides of the finder as the second outlet, and

wherein opening areas of the two outlets are different from each other.

14 . The image pickup apparatus according to claim 11 ,

wherein the duct includes a third outlet which opens toward a side opposite to the first outlet, and

wherein in a rear view of the image pickup apparatus, the third outlet and an area of the heat dissipation member to which the heat generating element is thermally connected are lined up in a lateral direction of the image pickup apparatus.

15 . The image pickup apparatus according to claim 14 , wherein an opening area of the third outlet is smaller than an opening area of the first outlet.

16 . The image pickup apparatus according to claim 14 , wherein an opening area of the second outlet is smaller than an opening area of the first outlet.

17 . The image pickup apparatus according to claim 11 , further comprising an image sensor,

wherein the heat generating element performs image processing on a signal output from the image sensor.

18 . The image pickup apparatus according to claim 11 , wherein an opening area of the second outlet is smaller than an opening area of the first outlet.