Cooling assembly with dampened oscillation response
An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.
1 . A semiconductor chip package assembly comprising:
a cooling mass;
a bolster plate at least partially around a semiconductor chip package;
a spring to be coupled between a base of the cooling mass and the bolster plate to apply a loading force that pulls the base and the bolster plate toward each other in the assembly's nominal assembled state; and
a rectangular block of viscous material to reduce an oscillation amplitude of the cooling mass, the rectangular block having a first end in contact with the base and a second end, opposite the first end, in contact with the bolster plate, the rectangular block spaced apart from the semiconductor chip package.
2 . The semiconductor chip package assembly of claim 1 wherein the cooling mass includes a heat sink.
3 . The semiconductor chip package assembly of claim 1 wherein the cooling mass includes a cold plate.
4 . The semiconductor chip package assembly of claim 1 wherein the cooling mass includes a vapor chamber.
5 . The semiconductor chip package assembly of claim 1 wherein the dampener rectangular block is one of a plurality of dampeners that are outside a periphery of a semiconductor chip package socket.
6 . A semiconductor chip package assembly comprising:
a cooling mass;
a bolster plate at least partially around a semiconductor chip package;
a spring between a base of the cooling mass and the bolster plate to apply a loading force that pulls the base and the bolster plate toward each other in a nominal assembled state of the semiconductor chip package assembly; and
a first dampener to reduce an amplitude of oscillation of the cooling mass, the first dampener having a first end in contact with the base and a second end, opposite the first end, the second end in contact with the bolster plate, the first dampener spaced apart from the semiconductor chip package, the first dampener secured to one of the base and the bolster plate; and
a second dampener secured to the other but not the one of the base and the bolster plate.
7 . An apparatus, comprising:
a printed circuit board;
a socket mounted to the printed circuit board;
a semiconductor chip package within the socket;
a back plate;
a bolster plate mounted to the back plate, the printed circuit board between the back plate and the bolster plate, the bolster plate at least partially around the semiconductor chip package;
a cooling mass having a base mounted to the bolster plate with a spring that applies a loading force to the base of the cooling mass and the bolster plate that pulls the base of the cooling mass and the bolster plate toward one another; and
a dampener between the base of the cooling mass and the bolster plate that is coupled to at least one of the base of the cooling mass and the bolster plate to reduce oscillation amplitude of the cooling mass, the dampener having a first end in contact with the base and a second end, opposite the first end, in contact with the bolster plate, the dampener spaced apart from the semiconductor chip package.
8 . The apparatus of claim 7 wherein the cooling mass is a heat sink.
9 . The apparatus of claim 7 wherein the cooling mass is a cold plate.
10 . The apparatus of claim 7 wherein the cooling mass is a vapor chamber.
11 . The apparatus of claim 7 wherein the dampener is one of a plurality of dampeners that are outside a periphery of the socket.
12 . The apparatus of claim 7 wherein the dampener is a first dampener, the first dampener coupled to one of the base and the bolster plate, the apparatus including a second dampener that is coupled to the other but not the one of the base of the cooling mass and the bolster plate.
13 . A data center, comprising:
a plurality of computing systems that are mechanically integrated into a plurality of racks, the plurality of computing systems communicatively coupled by one or more networks, a computing system of the plurality of computing systems including the apparatus of claim 7 .
14 . The semiconductor chip package assembly of claim 1 , wherein the rectangular block is epoxied to the base and the bolster plate.
15 . The apparatus of claim 7 , wherein the dampener includes a viscous material.
16 . The apparatus of claim 7 , wherein the dampener includes at least one of a rectangular block of viscous material or a cylindrical block of viscous material.
17 . The apparatus of claim 7 , wherein the dampener is epoxied to the base and the bolster plate.
18 . The apparatus of claim 7 , wherein the dampener is one of at least two dampeners, the at least two dampeners diagonally from each other on opposite sides of the semiconductor chip package.