Electronic component embedded substrate and manufacturing method therefor

1 . An electronic component embedded substrate comprising:

a plurality of conductor layers; and

a plurality of insulating layers each of which is positioned between two of the plurality of conductor layers that are adjacent in a stacking direction,

wherein the plurality of insulating layers include a first insulating layer embedding therein an electronic component and being made of a resin material not containing a core,

wherein the plurality of conductor layers include first, second, and third conductor layers stacking on one surface side of the first insulating layer and fourth, fifth, and sixth conductor layers stacking on other surface side of the first insulating layer,

wherein the plurality of insulating layers further include a second insulating layer positioned between the first and second conductor layers, a third insulating layer positioned between the second and third conductor layers a fourth insulating layer positioned between the fourth and fifth conductor layers, and a fifth insulating layer positioned between the fifth and sixth conductor layers,

wherein the first conductor layer includes a plurality of terminal electrodes exposed to one surface side of the electronic component embedded substrate,

wherein the sixth conductor layer includes a plurality of terminal electrodes exposed to other surface side of the electronic component embedded substrate,

wherein each of the third and fourth insulating layers includes a core material and the resin material,

wherein at least one of the second and fifth insulating layers is made of the resin material not containing the core,

wherein the fourth conductor layer is formed on one surface of the fourth insulating layer such that the fourth conductor layer is embedded in the first insulating layer without embedded in the fourth insulating layer, and

wherein the fifth conductor layer is formed on another surface of the fourth insulating layer such that the fifth conductor layer is embedded in the fifth insulating layer without embedded in the fourth insulating layer.

2 . The electronic component embedded substrate as claimed in claim 1 , wherein both the second and fifth insulating layers are made of a resin material not containing a core.

3 . The electronic component embedded substrate as claimed in claim 1 ,

wherein each of the second and third conductor layers includes a plurality of signal wiring patterns connected to the electronic component,

wherein the third insulating layer locally includes a non-core area not containing a core,

wherein the non-core area has an overlap with the electronic component in a plan view, and

wherein the plurality of signal wiring patterns included in the second conductor layer and the plurality of signal wiring patterns included in the third conductor layer are connected to each other through a plurality of via conductors each penetrating the non-core area.

4 . The electronic component embedded substrate as claimed in claim 1 ,

wherein each of the first and third conductor layers includes a plurality of signal wiring patterns connected to the electronic component,

wherein the third insulating layer includes an opening,

wherein the opening has an overlap with the electronic component in a plan view, and

wherein the plurality of signal wiring patterns included in the first conductor layer and the plurality of signal wiring patterns included in the third conductor layer are connected to each other through a plurality of via conductors each penetrating the opening.

5 . The electronic component embedded substrate as claimed in claim 2 ,

wherein each of the second and third conductor layers includes a plurality of signal wiring patterns connected to the electronic component,

wherein the third insulating layer locally includes a non-core area not containing a core,

wherein the non-core area has an overlap with the electronic component in a plan view, and

wherein the plurality of signal wiring patterns included in the second conductor layer and the plurality of signal wiring patterns included in the third conductor layer are connected to each other through a plurality of via conductors each penetrating the non-core area.

6 . The electronic component embedded substrate as claimed in claim 2 ,

wherein each of the first and third conductor layers includes a plurality of signal wiring patterns connected to the electronic component,

wherein the third insulating layer includes an opening,

wherein the opening has an overlap with the electronic component in a plan view, and

wherein the plurality of signal wiring patterns included in the first conductor layer and the plurality of signal wiring patterns included in the third conductor layer are connected to each other through a plurality of via conductors each penetrating the opening.

7 . The electronic component embedded substrate as claimed in claim 1 , wherein one of the second and fifth insulating layers includes a core material and a resin material.

8 . The electronic component embedded substrate as claimed in claim 1 , further comprising a via conductor connected between the fourth conductor layer and the fifth conductor layer,

wherein the via conductor is a same in thickness as the fourth insulating layer.

9 . The electronic component embedded substrate as claimed in claim 1 , wherein the third insulating layer is divided into a core area including a core and a non-core area not containing a core.

10 . The electronic component embedded substrate as claimed in claim 9 , wherein the non-core area at least partially overlaps the electronic component.

11 . The electronic component embedded substrate as claimed in claim 10 , wherein a part of the non-core area does not overlap the electronic component.

12 . The electronic component embedded substrate as claimed in claim 9 , further comprising:

a first via conductor connected between the second conductive layer and the third conductive layer to penetrate the non-core area of the third insulating layer; and

a second via conductor connected between the second conductive layer and the third conductive layer to penetrate the core area of the third insulating layer.

13 . The electronic component embedded substrate as claimed in claim 12 , wherein the first via conductor is smaller in diameter than the second via conductor.

14 . The electronic component embedded substrate as claimed in claim 1 , wherein the third insulating layer includes an opening filled with a resin material of the second insulating layer.

15 . The electronic component embedded substrate as claimed in claim 14 , further comprising:

a first via conductor connected between the first conductive layer and the third conductive layer to penetrate the second insulating layer and the opening of the third insulating layer; and

a second via conductor connected between the second conductive layer and the third conductive layer to penetrate the third insulating layer.

16 . The electronic component embedded substrate as claimed in claim 15 , wherein the first via conductor is smaller in diameter than the second via conductor.

17 . An electronic component embedded substrate comprising:

a plurality of conductor layers; and

a plurality of insulating layers each of which is positioned between two of the plurality of conductor layers that are adjacent in a stacking direction,

wherein the plurality of insulating layers include a first insulating layer embedding therein an electronic component,

wherein the plurality of conductor layers include first, second, and third conductor layers stacking on one surface side of the first insulating layer and fourth, fifth, and sixth conductor layers stacking on other surface side of the first insulating layer,

wherein the plurality of insulating layers further include a second insulating layer positioned between the first and second conductor layers, a third insulating layer positioned between the second and third conductor layers, a fourth insulating layer positioned between the fourth and fifth conductor layers, and a fifth insulating layer positioned between the fifth and sixth conductor layers,

wherein the first conductor layer includes a plurality of terminal electrodes exposed to one surface side of the electronic component embedded substrate,

wherein the sixth conductor layer includes a plurality of terminal electrodes exposed to other surface side of the electronic component embedded substrate,

wherein each of the third, fourth, and fifth insulating layers includes a core material and a resin material, and

wherein the second insulating layer is made of a resin material not containing a core,

wherein the electronic component embedded substrate further comprises:

a first via conductor connected between the first conductive layer and the second layer to penetrate the second insulating layer; and

a second via conductor connected between the fifth conductive layer and the sixth conductive layer to penetrate the fifth insulating layer, and

wherein the first via conductor is smaller in diameter than the second via conductor.

18 . An electronic component embedded substrate comprising:

a plurality of conductor layers; and

a plurality of insulating layers each of which is positioned between two of the plurality of conductor layers that are adjacent in a stacking direction,

wherein the plurality of insulating layers include a first insulating layer embedding therein an electronic component and being made of a resin material not containing a core,

wherein the plurality of conductor layers include first, second, and third conductor layers stacking on one surface side of the first insulating layer and fourth, fifth, and sixth conductor layers stacking on other surface side of the first insulating layer,

wherein the plurality of insulating layers further include a second insulating layer positioned between the first and second conductor layers, a third insulating layer positioned between the second and third conductor layers, a fourth insulating layer positioned between the fourth and fifth conductor layers, and a fifth insulating layer positioned between the fifth and sixth conductor layers,

wherein the first conductor layer includes a plurality of terminal electrodes exposed to one surface side of the electronic component embedded substrate,

wherein the sixth conductor layer includes a plurality of terminal electrodes exposed to other surface side of the electronic component embedded substrate,

wherein each of the third and fourth insulating layers includes a core material and the resin material,

wherein at least one of the second and fifth insulating layers is made of the resin material not containing the core,

wherein the third insulating layer is divided into a core area including a core and a non-core area not containing a core,

wherein the electronic component embedded substrate further comprises:

a first via conductor connected between the second conductive layer and the third conductive layer to penetrate the non-core area of the third insulating layer; and

a second via conductor connected between the second conductive layer and the third conductive layer to penetrate the core area of the third insulating layer.

19 . An electronic component embedded substrate comprising:

a plurality of conductor layers; and

a plurality of insulating layers each of which is positioned between two of the plurality of conductor layers that are adjacent in a stacking direction,

wherein the plurality of insulating layers include a first insulating layer embedding therein an electronic component and being made of a resin material not containing a core,

wherein the plurality of conductor layers include first, second, and third conductor layers stacking on one surface side of the first insulating layer and fourth, fifth, and sixth conductor layers stacking on other surface side of the first insulating layer,

wherein the plurality of insulating layers further include a second insulating layer positioned between the first and second conductor layers, a third insulating layer positioned between the second and third conductor layers, a fourth insulating layer positioned between the fourth and fifth conductor layers, and a fifth insulating layer positioned between the fifth and sixth conductor layers,

wherein the first conductor layer includes a plurality of terminal electrodes exposed to one surface side of the electronic component embedded substrate,

wherein the sixth conductor layer includes a plurality of terminal electrodes exposed to other surface side of the electronic component embedded substrate,

wherein each of the third and fourth insulating layers includes a core material and the resin material,

wherein at least one of the second and fifth insulating layers is made of the resin material not containing the core, and

wherein the third insulating layer includes an opening filled with a resin material of the second insulating layer.