Transparent package for use with printed circuit boards
A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.
1 . A package for mimicking an electronic component package that includes a plurality of leads, the package comprising:
a body formed from electrically insulating material that is transparent to visible light, the body having a top surface, a bottom surface, and a plurality of side surfaces;
a plurality of conductive pads formed from electrically conductive material and positioned on one or more of the surface(s);
a plurality of solder pads formed from solder, each solder pad positioned on and connected to a respective one of the conductive pads; and
a plurality of leads formed from electrically conductive material, each lead corresponding to a respective one of the leads of the electronic component package, being positioned in a location corresponding to a location of a corresponding one of the leads of the electronic component package, and attached only to a respective one of the solder pads.
2 . The package of claim 1 , wherein the conductive pads and the solder pads are formed on the top surface of the body.
3 . The package of claim 1 , wherein the conductive pads and the solder pads are formed on the bottom surface of the body.
4 . The package of claim 1 , wherein a first portion of the conductive pads and the solder pads is formed on a first side surface of the body, a second portion of the conductive pads and the solder pads is formed on a second side surface of the body, a third portion of the conductive pads and the solder pads is formed on a third side surface of the body, and a fourth portion of the conductive pads and the solder pads is formed on a fourth side surface of the body.
5 . The package of claim 1 , wherein the body is formed from borosilicate glass.
6 . The package of claim 1 , wherein each conductive pad is formed from a plurality of layers of metal.
7 . The package of claim 3 , wherein the layers of metal include a layer of titanium in contact with the body, a layer of nickel on top of the layer of titanium, and a layer of gold on top of the layer of nickel.
8 . The package of claim 1 , wherein the leads are formed from a lead frame.
9 . A method of forming a package for mimicking an electronic component package that includes a plurality of leads, the method comprising:
forming a body of the package, the body formed from electrically insulating material that is transparent to visible light, the body having a top surface, a bottom surface, and a plurality of side surfaces;
forming a plurality of conductive pads on one or more surface(s) of the body, each conductive pad formed from electrically conductive material;
forming a respective one of a plurality of solder pads on each of the conductive pads, each solder pad formed from solder; and
attaching a respective one of a plurality of leads to each of the solder pads, each lead corresponding to a respective one of the leads of the electronic component package, being positioned in a location corresponding to a location of a corresponding one of the leads of the electronic component package, and attached only to a respective one of the solder pads.
10 . The method of claim 9 , wherein the leads are formed from a lead frame.
11 . The method of claim 9 , further comprising
forming a lead frame that includes the leads held together by a frame;
aligning the lead frame with the body such that each lead is aligned with a respective one of the solder pads; and
removing the frame from the leads.
12 . The method of claim 11 , wherein attaching the leads to the solder pads includes heating the solder pads and the lead frame.
13 . The method of claim 9 , wherein the solder that forms the solder pads melts at a temperature greater than or equal to approximately 700 degrees Fahrenheit.