Sensor module

1 . A sensor module comprising:

three axes orthogonal to each other being defined as an X axis, a Y axis, and a Z axis;

a base portion having a plurality of lead frames and made of a mold resin;

a circuit board arranged in a plane of the base portion perpendicular to the Z axis;

a first inertial sensor and a second inertial sensor respectively mounted on a surface of the circuit board perpendicular to the Z axis; and

a cap covering the first inertial sensor, the second inertial sensor, and the circuit board, the cap being joined to the base portion,

wherein the first inertial sensor includes:

a first sensor element having a detection axis; and

a first sensor package accommodating the first sensor element, wherein the first inertial sensor is a Y-axis angular velocity sensor element that detects an angular velocity around the Y axis,

the first sensor package is rectangular in a plan view and includes:

a first main surface and a second main surface outwardly opposite to each other along the Y axis;

a pair of first side surfaces outwardly opposite to each other along the Z axis, the pair of first side surfaces connecting the first main surface and the second main surface; and

a pair of second side surfaces outwardly opposite to each other along the X axis, the pair of second side surfaces connecting the first main surface and the second main surface,

one of the pair of first side surfaces is a mounting surface mounted on the surface of the circuit board, and the other of the pair of first side surfaces is an opposite surface,

a first castellation extends from the first main surface to the second main surface and is provided on the mounting surface,

a second castellation extends from the first main surface to the second main surface and is provided on the opposite surface,

a first package electrode of the first sensor package is provided on a first curved inner surface of the first castellation,

a second package electrode of the first sensor package is provided on a second curved inner surface of the second castellation,

a board land pattern is provided on the surface of the circuit board,

the mounting surface of the first sensor package is mounted on the surface of the circuit board along the X axis by soldering between the board land pattern and the first package electrode at a joined location,

Xp<X1, in which

Xp is a width of the board land pattern along the X axis at the joined location, and X1 is a width of the first package electrode along the X axis at the joined location,

an entirety of the first curved inner surface of the first castellation directly faces the board land pattern along the Z axis,

the second castellation and the second package electrode are not directly connected to the board land pattern and do not face is not located directly adjacent to the board land pattern,

wherein the second inertial sensor includes:

a second sensor element having a detection axis; and

a second sensor package accommodating the second sensor element, wherein the second inertial sensor is a Z-axis angular velocity sensor element that detects an angular velocity around the Z axis,

the second sensor package is rectangular in the plan view and includes:

a third main surface and a fourth main surface outwardly opposite to each other along the Z axis;

a pair of third side surfaces outwardly opposite to each other along the Y axis, the pair of third side surfaces connecting the third main surface and the fourth main surface; and

a pair of fourth side surfaces outwardly opposite to each other along the X axis, the pair of fourth side surfaces connecting the third main surface and the fourth main surface,

one of the third and fourth surfaces is a mounting surface mounted on the surface of the circuit board, and the other of the third and fourth surfaces is an opposite surface,

a third castellation extends from the third main surface to the fourth main surface and is provided on the mounting surface,

a fourth castellation extends from the third main surface to the fourth main surface,

a third package electrode of the second sensor package is provided on a third curved inner surface of the third castellation,

a fourth package electrode of the second sensor package is provided on a fourth curved inner surface of the fourth castellation,

another board land pattern is provided on the surface of the circuit board, and

the mounting surface of the second sensor package is mounted on the surface of the circuit board along the X axis by soldering between the another board land pattern and the third and fourth package electrodes at a joined location.

2 . The sensor module according to claim 1 , further comprising:

a first board land pattern provided on the surface of the circuit board,

wherein the first sensor package includes the first package electrode joined to the board land pattern and another package electrode joined to the first board land pattern, and

at least one of the board land pattern and the first package electrode or the first board land pattern and the another package electrode satisfies Xp<X1.

3 . The sensor module according to claim 1 , further comprising:

a first board land pattern provided on the surface of the circuit board,

wherein the first sensor package includes the first package electrode joined to the board land pattern and another package electrode joined to the first board land pattern, and

the board land pattern and the first package electrode, as well as the first board land pattern and the another package electrode satisfy Xp<X1.

4 . The sensor module according to claim 1 , wherein

Yp>Y1, in which

Yp is a width of the board land pattern along the Y-axis, and

Y1 is a width of the first package electrode along the Y-axis.