Transfer molding systems for semiconductor device packaging
Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.
1 . A molding system, comprising:
a first mold-forming structure;
a second mold-forming structure comprising a mold cavity, wherein:
the mold cavity comprises a gate region, a component region, and a vent region,
the component region is configured to enclose an electrical component mounted on a substrate,
the vent region comprises:
a channel region overlapping with the first mold-forming structure, and
a reservoir region non-overlapping with the first mold-forming structure, and
a volume of the vent region is adjustable; and
an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the molding system.
2 . The molding system of claim 1 , wherein the second mold-forming structure further comprises a piston or a spring-loaded box disposed in the vent region and configured to adjust the volume of the vent region.
3 . The molding system of claim 1 , wherein second mold-forming structure further comprises removable inserts disposed in the vent region and configured to adjust the volume of the vent region.
4 . The molding system of claim 1 , wherein
the reservoir region is coupled to the component region through the channel region.
5 . The molding system of claim 1 , wherein the second mold-forming structure further comprises a piston, a spring-loaded box, or removable inserts disposed in the reservoir region; and
wherein a width of the reservoir region is adjustable with the piston, the spring-loaded box, or the removable inserts.
6 . The molding system of claim 1 , wherein the reservoir region is non-overlapping with the substrate.
7 . The molding system of claim 1 , wherein the reservoir region is disposed below the substrate.
8 . The molding system of claim 1 , wherein the reservoir region comprises a volume of about 5% to about 50% of a volume of the component region.
9 . The molding system of claim 1 , wherein the first mold-forming structure comprises an other vent region coupled to the vent region of the second mold-forming structure, and
wherein the other vent region is non-overlapping with the substrate.
10 . The molding system of claim 1 , wherein the first mold-forming structure comprises an other mold cavity with an other component region and an other vent region.
11 . A molding system, comprising:
a first mold-forming structure;
a second mold-forming structure comprising a cavity, wherein the cavity comprises:
a gate region,
a component region adjacent to the gate region and configured to enclose an electrical component mounted on a substrate, and
a vent region comprising a channel region positioned on the substrate and an adjustable reservoir region; and
an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the cavity.
12 . The molding system of claim 11 , wherein the adjustable reservoir region comprises a piston, a spring-loaded box, or removable inserts.
13 . The molding system of claim 11 , wherein the adjustable reservoir region is non-overlapping with the substrate.
14 . The molding system of claim 11 , wherein the adjustable reservoir region comprises a volume of about 5% to about 50% of a volume of the component region.
15 . The molding system of claim 11 , wherein the channel region is positioned between the component region and the adjustable reservoir region.
16 . The molding system of claim 11 , wherein the cavity further comprises a reservoir region on the substrate and positioned between the component region and the channel region.
17 . A molding system, comprising:
a first mold-forming structure on a first side of a substrate;
a second mold-forming structure comprising a cavity, wherein the cavity comprises:
a gate region on a second side of the substrate,
a component region configured to enclose an electrical component mounted on the second side of the substrate, and
a vent region comprising an adjustable reservoir region non-overlapping with the substrate and a non-adjustable reservoir region overlapping with the substrate; and
an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the cavity.
18 . The molding system of claim 17 , wherein the first mold-forming structure comprises an other cavity with an other component region and an other vent region.
19 . The molding system of claim 17 , wherein the adjustable reservoir region comprises a piston, a spring-loaded box, or removable inserts.
20 . The molding system of claim 17 , wherein the vent region further comprises a channel region positioned on the second side of the substrate.