Method for manufacturing wiring board

1 . A method of manufacturing a wiring board, the method comprising:

(a) covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material;

(b) covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and

(c) removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material, wherein

step (c) includes peeling the separation layer from the base material while pressing a portion of the cover lay other than the removal portion by a presser, and removing the removal portion by cutting a portion where the separation layer is not laminated on the cover lay.

2 . The method according to claim 1 , wherein

the separation layer is a slightly adhesive film having a peel strength with respect to the base material smaller than a peel strength of the cover lay with respect to the base material, and

step (a) includes attaching the slightly adhesive film on the base material.

3 . The method according to claim 1 , further comprising:

(d) exposing the separation layer from an end portion of the wiring board by cutting the cover lay, the separation layer, and the base material before step (c).

4 . The method according to claim 1 , further comprising:

(e) covering an edge portion of the cover lay from which the removal portion has been removed with a resin material after step (c).