Method for manufacturing a multilayer circuit board

1 . A method for manufacturing a multilayer circuit board, comprising:

providing an inner circuit substrate, wherein the inner circuit substrate is provided with a first surface and a second surface opposite to the first surface;

forming a through hole penetrating the first surface and the second surface;

attaching a support plate to the second surface to seal an opening of the through hole;

providing an electronic module, wherein the electronic module is provided with a main body, at least one electronic component, a first adhesive layer, and a second adhesive layer, the main body defining a groove, the at least one electronic component is fixed to a bottom wall of the groove through the first adhesive layer, the second adhesive layer infilling the groove, and the first adhesive layer and the second adhesive layer jointly encapsulates the at least one electronic component;

placing the electronic module in the through hole, wherein the electronic module is bonded to the support plate;

pressing a first substrate onto the first surface;

removing the support plate;

pressing a second substrate onto the second surface, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; and

forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate; wherein a surface of the second adhesive layer exposed from the groove is flush with a surface of the main body having the groove.

2 . The method of claim 1 , wherein providing the electronic module further comprises:

providing the main body;

forming the groove on the main body;

forming the first adhesive on the bottom wall of the groove;

mounting the at least one electronic component on the first adhesive layer; and

infilling a glue in the groove to form the second adhesive layer.

3 . The method of claim 1 , wherein when the electronic module is placed in the through hole, the second adhesive layer is boned to the support plate.

4 . The method of claim 1 , wherein a height of the electronic module is equal to a height of the through hole.

5 . The method of claim 1 , further comprising:

forming a third circuit substrate on a surface of the first conductive wiring layer; and

forming a fourth circuit substrate on a surface of the second conductive wiring layer.

6 . The method of claim 5 , wherein the third circuit substrate is provided with a third substrate and a third conductive wiring layer laminated on the third substrate, the third substrate covers the first conductive wiring layer and is connected to the first substrate; the fourth circuit substrate is provided with a fourth substate and a fourth conductive wiring layer laminated on the fourth substrate, the fourth substrate covers the second conductive wiring layer and is connected to the second substate.

7 . The method of claim 6 , further comprising:

forming a plurality of conductive structures, a portion of the plurality of conductive structures electrically connecting the second conductive wiring layer and the fourth conductive wiring layer, and another portion of the plurality of conductive structures electrically connecting the first conductive wiring layer and the third conductive wiring layer.

8 . The method of claim 1 , wherein forming the first conductive wiring layer on the surface of the first substrate facing away from the first surface to obtain the first circuit substrate further comprises:

forming a metal layer on the surface of the first substrate facing away from the first surface; and

forming the first conductive wiring layer from the metal layer to obtain the first circuit substrate.

9 . The method of claim 1 , wherein forming the second conductive wiring layer on the surface of the second substrate facing away from the second surface to obtain the second circuit substrate further comprises:

forming a metal layer on the surface of the second substrate facing away from the second surface; and

forming the second conductive wiring layer from the metal layer to obtain the second circuit substrate.

10 . The method of claim 1 , further comprising:

forming a blind hole penetrating the second substrate and the second adhesive layer to expose a portion of the at least one electronic component;

forming a first conductive structure in the blind hole, the first conductive structure electrically connecting the at least one electronic component and the second conductive wiring layer.

11 . The method of claim 1 , further comprising:

forming a blind hole penetrating the first substrate, the main body, and the first adhesive layer to expose a portion of the at least one electronic component;

forming a first conductive structure in the blind hole, the first conductive structure electrically connecting the at least one electronic component and the first conductive wiring layer.