Circuit board, chip on film, display apparatus and bonding method
The present disclosure provides a circuit board, a chip on film, a display apparatus and a bonding method. The circuit board has a plurality of bonding regions for bonding with a chip on film, each bonding region includes: a plurality of first pins extending along a first direction and sequentially arranged along a second direction; and at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged and configured to be aligned with a second alignment mark group of the chip on film in a buckled way, so that the plurality of first pins are bonded and attached to second pins of the chip on film in one-to-one correspondence.
1 . A circuit board, having a plurality of bonding regions for bonding with a chip on film, wherein each bonding region comprises:
a plurality of first pins extending along a first direction and sequentially arranged along a second direction; and
at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged and configured to be aligned with a second alignment mark group of the chip on film in a buckled way, so that the plurality of first pins are bonded and attached to second pins of the chip on film in one-to-one correspondence.
2 . The circuit board according to claim 1 , wherein each first alignment mark group comprises a fixture block and strip groups respectively located on two sides of the fixture block along the first direction; each strip group comprises at least one first strip extending along the first direction.
3 . The circuit board according to claim 2 , wherein the circuit board comprises two first alignment mark groups respectively on two edge regions of the bonding region in the second direction.
4 . The circuit board according to claim 2 , wherein the fixture block has a first symmetry axis parallel to the second direction and passing through a center of the fixture block; first strips on two sides of the fixture block are symmetrically distributed about the first symmetry axis; and
wherein the fixture block has a second symmetry axis parallel to the first direction and passing through a center of the fixture block; the first strips of a same strip group are symmetrically distributed about the second symmetry axis.
5 . The circuit board according to claim 2 , wherein in a same strip group, ends of the first strips away from the fixture block are substantially flush with each other; in a same strip group, ends of the first strips close to the fixture block are substantially flush with each other; and
wherein in a same strip group, an end of each first strip away from the fixture block is substantially flush with an end of each first pin.
6 . The circuit board according to claim 2 , wherein each strip group comprises two first strips; in a same strip group, an extension line of an outer edge of one of the first strips away from the other first strip and parallel to the first direction is substantially coincident with an extension line of an outer edge of the fixture block parallel to the first direction; and
wherein in a same strip group, lengths of the first strips along the first direction are substantially the same; in a same strip group, lengths of the first strips along the second direction are substantially the same.
7 . The circuit board according to claim 6 , wherein a length of the fixture block in the first direction is substantially the same as a length of each first strip in the first direction; and
the length of the fixture block in the first direction is in a range from one fifth to one third of the length of each first pin in the first direction.
8 . The circuit board according to claim 1 , wherein the circuit board further comprises extension regions on both two sides of the bonding region; each extension region comprises: a plurality of floating pins extending along the first direction and sequentially arranged along the second direction, and at least one auxiliary mark group on an arrangement path along which the plurality of floating pins are arranged.
9 . The circuit board according to claim 8 , wherein the circuit board comprises two auxiliary mark groups respectively on two sides of the bonding region; the auxiliary mark groups are used as glue coating mark groups, and conductive glue is coated between the two auxiliary mark groups.
10 . The circuit board according to claim 9 , wherein each auxiliary mark group comprises two auxiliary mark blocks arranged in the first direction which are rectangular; and
wherein a length of each auxiliary mark block in the first direction is in a range from one fifth to one third of the length of each first pin in the first direction; a width of each auxiliary mark block in the second direction is greater than a width of each first pin in the second direction.
11 . A chip on film for bonding with a circuit board having a plurality of bonding regions, wherein each bonding region comprises: a plurality of first pins extending along a first direction and sequentially arranged along a second direction; and at least one first alignment mark group on an arrangement path along which the plurality of first pins are arranged, and the chip on film comprises:
a plurality of second pins extending along the first direction and sequentially arranged along the second direction; and
at least one second alignment mark group on an arrangement path along which the plurality of second pins are arranged,
wherein the at least one first alignment mark group is configured to be aligned with the at least one second alignment mark group in a buckled way, so that the plurality of first pins are bonded and attached to the plurality of second pins in one-to-one correspondence.
12 . The chip on film according to claim 11 , wherein each second alignment mark group comprises two second strips extending along the second direction, and one end of each second strip is connected to a same second pin; and
wherein the other end of each second strip is substantially flush with an edge of the chip on film.
13 . The chip on film according to claim 12 , wherein the chip on film comprises two second alignment mark groups respectively in two edge regions of the chip on film in the second direction; and
wherein the second strips are connected to a second pin at an edge of the chip on film, and the second pin and the second strips form a notch with an opening towards a side edge of the chip on film.
14 . The chip on film according to claim 12 , wherein each second alignment mark group comprises two second strips; and
a width of each second strip in the first direction is substantially the same as a width of each second pin in the second direction.
15 . A display apparatus, comprising the circuit board according to claim 1 and a chip on film, which comprises: a plurality of second pins extending along the first direction and sequentially arranged along the second direction; and at least one second alignment mark group on an arrangement path along which the plurality of second pins are arranged; and
wherein the first alignment mark group of the circuit board and the second alignment mark group of the chip on film are aligned with each other in a buckled way, so that the plurality of first pins of the circuit board are bonded and attached to the plurality of second pins of the chip on film in one-to-one correspondence.
16 . The display apparatus according to claim 15 , wherein each first alignment mark group comprises a fixture block and strip groups respectively located on two sides of the fixture block along the first direction; each strip group comprises at least one first strip extending along the first direction;
each second alignment mark group comprises two second strips extending along the second direction, and one end of each second strip is connected to a same second pin; and
when the first alignment mark group and the second alignment mark group are aligned with each other in a buckled way, the fixture block is between the two second strips which are adjacent to each other, and each second strip is between the fixture block and the corresponding first strip.
17 . The display apparatus according to claim 16 , wherein a length of each second strip in the second direction is greater than a length of the fixture block in the second direction; and
a distance of a gap between the two second strips in the first direction is greater than a length of the fixture block in the first direction; and
wherein a width of a gap between the first strip and the fixture block in the first direction is greater than a width of each second strip in the first direction.
18 . The display apparatus according to claim 15 , wherein every adjacent N chip on films are bonded to a same circuit board, where N is a positive integer greater than 0; and
wherein the display apparatus further comprises a display panel, and a flexible circuit board; the display panel is connected to one end of each chip on film; and two adjacent circuit boards are connected to each other through the flexible circuit board.
19 . A bonding method for the display apparatus according to claim 15 , comprising:
providing the circuit board;
providing the chip on film; and
aligning the first alignment mark group of the circuit board with the second alignment mark group of the chip on film in a buckled way, so that the plurality of first pins of the circuit board are bonded and attached to the plurality of second pins of the chip on film in one-to-one correspondence.
20 . The bonding method according to claim 19 , wherein the circuit board further comprises two auxiliary mark groups; before the aligning the first alignment mark group of the circuit board with the second alignment mark group of the chip on film in a buckled way, the bonding method further comprises: coating conductive glue on an extension region and the bonding region between the two auxiliary mark groups;
after the aligning the first alignment mark group of the circuit board with the second alignment mark group of the chip on film in a buckled way, the bonding method further comprises: attaching the circuit board to the chip on film.