Electronic assembly with a compressive electrical connection between a circuit board and housing
An electronic assembly includes a first housing portion having one or more recesses along at least a portion of a perimeter of the first housing portion. A second housing portion has one or more arms extending from a body of the second housing portion to engage the recesses in a snap-fit connection. A cavity is formed between the first housing portion and the second portion. A circuit board resides in the cavity. The circuit board has a conductive trace that faces the first housing portion at a metallic conductive region. The snap-fit connection forms an electrical and mechanical connection between the conductive trace and the metallic conductive region.
1 . An electronic assembly comprising:
a first housing portion having one or more recesses along at least a portion of a perimeter of the first housing portion;
a second housing portion having one or more arms extending from a body of the second housing portion to engage the one or more recesses in a snap-fit connection;
a cavity formed between the first housing portion and the second housing portion; and
a circuit board residing in the cavity, the circuit board having a conductive trace facing the first housing portion having a metallic conductive region, wherein the snap-fit connection forms an electrical and mechanical connection between the conductive trace and the metallic conductive region, the circuit board including:
a first power electronics module region;
a second power electronics module region; and
a third power electronics module region, each of the first power electronics module region, the second power electronics module region, and the third power electronics module region including an inverter, each inverter including a set of alternating current terminals that are mounted on the circuit board and that extend through the second housing portion, and wherein the first power electronics module region, the second power electronics module region, and the third power electronics module region share a common set of direct current terminals on an exterior of the second housing portion.
2 . The electronic assembly according to claim 1 wherein the snap-fit connection provides a compressive force between the conductive trace and the metallic conductive region.
3 . The electronic assembly according to claim 1 wherein the first housing portion includes a metallic base.
4 . The electronic assembly according to claim 1 wherein the second housing portion includes a lid, the lid composed of a plastic, a polymer or a composite material.
5 . The electronic assembly according to claim 1 wherein the second housing portion includes a lid and wherein the one or more arms are composed of a plastic, a polymer or a composite material.
6 . The electronic assembly according to claim 1 wherein the first housing portion is formed of extruded metal or an alloy and has set of longitudinal ridges.
7 . The electronic assembly according to claim 1 wherein the first housing portion is formed of a extruded metal or an alloy and has a set of longitudinal ridges and a foot portion.
8 . The electronic assembly according to claim 1 wherein the one or more recesses include a first groove in a first exterior side of the first housing portion and a second groove in a second exterior side of the first housing portion, where the first exterior side is opposite the second exterior side.
9 . The electronic assembly according to claim 8 wherein the one or more arms include (a) a first array of arms extending downward from the second housing portion to engage the first groove and (b) a second array of arms extending downward from the second housing portion to engage the second groove.
10 . The electronic assembly according to claim 1 wherein the conductive trace on the circuit board and the first housing portion are electrically grounded through the electrical and mechanical connection.
11 . The electronic assembly according to claim 1 wherein the second housing portion has a post that contacts an opposite side of the circuit board opposite the conductive trace, and wherein the first housing portion has conductive ridge associated with the metallic conductive region to contact the conductive trace on the circuit board.
12 . The electronic assembly according to claim 11 wherein the conductive ridge includes a solder bump.
13 . The electronic assembly according to claim 11 wherein the conductive ridge includes a wavy, stippled, or grooved surface.
14 . The electronic assembly according to claim 1 wherein the first and second power electronics module regions share common control terminals and wherein the first and second power electronics module regions are adjacent to each other.
15 . The electronic assembly according to claim 14 wherein the third power electronics module region is separable from the first power electronics module region and the second power electronics module region and wherein the third power electronics module region has separate secondary control terminals from the common control terminals.