Power semiconductor module and drivetrain for a vehicle comprising such a power semiconductor module
Various embodiments of the teachings herein include a power semiconductor module. An example may include: a substrate; an electric circuit arranged on the substrate; a conductor frame including a DC+ busbar and a DC− busbar for external contacts; and an encapsulation material at least partially encapsulating the power semiconductor module. The electric circuit includes a power semiconductor component and a capacitor fastened on the busbars in thermal contact with a heat dissipator extending through the substrate.
1 . A power semiconductor module comprising:
a substrate;
an electric circuit arranged on the substrate;
wherein the electric circuit includes a power semiconductor component and a capacitor;
a conductor frame including a DC+ busbar and a DC− busbar for external contacts; and
an encapsulation material at least partially encapsulating the power semiconductor module;
wherein the capacitor is fastened on the DC+ busbar and the DC− busbar and in thermal contact with a heat dissipator extending through the substrate.
2 . The power semiconductor module as claimed in claim 1 , wherein the heat dissipator is in thermal contact with the power semiconductor component.
3 . The power semiconductor module as claimed in claim 2 , wherein the heat dissipator or a part connected thereto cools the power semiconductor component from a side approximating the substrate.
4 . The power semiconductor module as claimed in claim 1 , wherein:
the heat dissipator comprises a plurality of holes through the substrate, and
individual holes of the plurality of holes are filled with a heat dissipation material.
5 . The power semiconductor module as claimed in claim 4 , wherein the heat dissipation material comprises a metal and/or a plastic.
6 . The power semiconductor module as claimed in claim 1 , wherein the power semiconductor component is cooled by a cooling channel for a cooling fluid, and the cooling channel is positioned opposite to the power semiconductor component with respect to the substrate.
7 . The power semiconductor module as claimed in claim 6 , wherein the cooling channel is defined within the encapsulation material and is open toward the substrate.
8 . The power semiconductor module as claimed in claim 6 , further comprising structures to generate turbulence in the cooling fluid while flowing through the cooling channel.
9 . The power semiconductor module as claimed in claim 8 , wherein the structures are embossed into a delimitation of the cooling channel.
10 . The power semiconductor module as claimed in claim 1 , wherein the encapsulation material includes external cooling structures.
11 . The power semiconductor module as claimed in claim 10 , wherein the external cooling structures are adjacent to the power semiconductor component and opposite to a cooling channel so the external cooling structures cool the power semiconductor component from its upper side.
12 . The power semiconductor module as claimed in claim 1 , wherein the thermal contact between the capacitor and the heat dissipator includes a thermally conductive intermediate material.
13 . The power semiconductor module as claimed in claim 1 , wherein the capacitor is welded to the DC+ busbar and to the DC− busbar.
14 . A drivetrain for an electrically driven vehicle, the drivetrain comprising:
a voltage source;
a power semiconductor module connected to the voltage source; and
an electric motor energized by the power semiconductor module;
wherein the power semiconductor module comprises:
a substrate;
an electric circuit arranged on the substrate;
wherein the electric circuit includes a power semiconductor component and a capacitor;
a conductor frame including a DC+ busbar and a DC− busbar for external contact; and
an encapsulation material at least partially encapsulating the power semiconductor module;
wherein the capacitor is fastened on the DC+ busbar and the DC− busbar in thermal contact with a heat dissipator extending through the substrate.
15 . An electrically drivable vehicle comprising:
a wheel;
a voltage source;
a power semiconductor module connected to the voltage source; and
an electric motor driving the wheel by converting power delivered by the power semiconductor module;
wherein the power semiconductor module comprises:
a substrate;
an electric circuit arranged on the substrate;
wherein the electric circuit includes a power semiconductor component and a capacitor;
a conductor frame including a DC+ busbar and a DC− busbar for external contact; and
an encapsulation material at least partially encapsulating the power semiconductor module;
wherein the capacitor is fastened on the DC+ busbar and the DC− busbar in thermal contact with a heat dissipator extending through the substrate.