IP Library › Granted Patent US 12684730
Granted Patent B2
US 12684730 · App. 17/980,187 · Granted Jul 14, 2026

Silicon-controlled rectifier water-cooling heat dissipation device

Inventors: Honggang Li (Shanghai, CN); Yingfeng Wang (Shanghai, CN); Xiaolan Hu (Shanghai, CN)
Assignee: Shanghai KOHLER Electronics, Ltd
H05K7/20254H05K7/20272H05K7/20281
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Quick Facts
Patent No.
US 12684730
App. No.
17/980,187
Granted
Jul 14, 2026
Kind
B2
Abstract

The present disclosure relates to a silicon-controlled rectifier water-cooling heat dissipation device, including: a water-cooling cavity body; a silicon-controlled rectifier; and a heat dissipation plate. The heat dissipation plate includes: a first heat dissipation part configured to contact the water-cooling cavity body; and a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier. A preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located. The heat of the silicon-controlled rectifier is transferred to the water-cooling cavity body through the heat dissipation plate. An occupied volume can be effectively reduced because the first heat dissipation part and the second heat dissipation part form the included angle. The cooling water takes away the heat by the flowability of the water to improve heat dissipation efficiency.

Claims (55)

1 . A silicon-controlled rectifier water-cooling heat dissipation device, comprising:

a water-cooling cavity body;

a silicon-controlled rectifier; and

a heat dissipation plate, comprising:

a first heat dissipation part configured to contact the water-cooling cavity body; and

a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier,

wherein a preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located.

2 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 1 ,

wherein the water-cooling cavity body comprises:

a water-cooling cavity comprising an opening;

a cavity inlet pipe connected to the water-cooling cavity; and

a cavity outlet pipe connected to the water-cooling cavity; and

wherein the first heat dissipation part covers the opening.

3 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 2 ,

wherein when cooling water is supplied to the water-cooling cavity body via the cavity inlet pipe, heat generated by the silicon-controlled rectifier is transferred to the cooling water in the water-cooling cavity body via the second heat dissipation part and the first heat dissipation part, and

wherein the cooling water after the heat exchange with the silicon-controlled rectifier is discharged by the cavity outlet pipe.

4 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 2 , further comprising a sealing ring disposed between the first heat dissipation part and the opening.

5 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 2 , wherein the opening is directed upward.

6 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 5 , wherein the first heat dissipation part is perpendicular to the second heat dissipation part.

7 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 2 , further comprising a water pump connected to the cavity inlet pipe or the cavity outlet pipe.

8 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 1 , wherein the plane where the first heat dissipation part is located is perpendicular to the plane where the second heat dissipation part is located.

9 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 1 , wherein the heat dissipation plate further comprises a grounding symbol and a grounding mounting hole.

10 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 1 , further comprising a circuit board accommodation cavity connected with the water-cooling cavity body,

wherein the silicon-controlled rectifier is electrically coupled to a circuit board, and

wherein the circuit board and the silicon-controlled rectifier are disposed in the circuit board accommodation cavity.

11 . The silicon-controlled rectifier water-cooling heat dissipation device according to claim 1 ,

wherein the water-cooling cavity body is configured to house cooling liquid, and

wherein heat generated by the silicon-controlled rectifier is transferred to the cooling liquid in the water-cooling cavity body via the second heat dissipation part and the first heat dissipation part.

12 . A waterway system, comprising:

an inlet water temperature sensor connected to the waterway inlet end;

a silicon-controlled rectifier water-cooling heat dissipation device, connected to an output end of the inlet water temperature sensor;

an outlet water temperature sensor, connected to an output end of the silicon-controlled rectifier water-cooling heat dissipation device; and

wherein the silicon-controlled rectifier water-cooling heat dissipation device comprises:

a water-cooling cavity body;

a silicon-controlled rectifier; and

a heat dissipation plate, comprising:

a first heat dissipation part configured to contact the water-cooling cavity body; and

a second heat dissipation part connected to the first heat dissipation part and configured to contact the silicon-controlled rectifier,

wherein a preset included angle is formed between a plane where the first heat dissipation part is located and a plane where the second heat dissipation part is located.

13 . The waterway system according to claim 12 ,

wherein the water-cooling cavity body comprises:

a water-cooling cavity comprising an opening;

a cavity inlet pipe connected to the water-cooling cavity;

a cavity outlet pipe connected to the water-cooling cavity, and

wherein the first heat dissipation part covers the opening.

14 . The waterway system according to claim 13 ,

wherein when cooling water is supplied to the water-cooling cavity body via the cavity inlet pipe, heat generated by the silicon-controlled rectifier is transferred to the cooling water in the water-cooling cavity body via the second heat dissipation part and the first heat dissipation part, and

wherein the cooling water after the heat exchange with the silicon-controlled rectifier is discharged by the cavity outlet pipe.

15 . The waterway system according to claim 13 ,

wherein the water-cooling cavity body is configured to house cooling liquid, and

wherein heat generated by the silicon-controlled rectifier is transferred to the cooling liquid in the water-cooling cavity body via the second heat dissipation part and the first heat dissipation part.

16 . The waterway system according to claim 13 , further comprising:

a waterway inlet end, connected to an input end of the inlet water temperature sensor; and

a waterway outlet end, connected to an output end of the outlet water temperature sensor.

17 . The waterway system according to claim 13 , further comprising a nozzle flushing assembly, disposed between the outlet water temperature sensor and the waterway outlet end.