Integration of systems comprising standard electronic components in satellites

1 . A spacecraft comprising a system comprising a sealed enclosure (Enc), the sealed enclosure comprising:

an inner layer (Lay 23 ) configured to maintain a pressure difference between the inside and the outside of the sealed enclosure (Enc);

an outer layer (Lay 21 ) comprising a metallic foam;

a radiation shielding layer (Lay 22 );

one or more heat transfer elements (HT 21 , HT 22 , HT 23 , HT 3 , HT 41 , HT 42 , HT 43 ) comprising one or more active heat transfer element disposed on one or more inner faces of the sealed enclosure, and configured or configurable to extract heat from the interior of the sealed enclosure; and

one or more electronic related components (El 3 , El 41 , El 42 , El 43 ) inside the sealed enclosure.

2 . The spacecraft of claim 1 , wherein the one or more heat transfer elements comprise one or more active heat transfer elements disposed on one or more inner faces of the inner layer (Lay 23 ) of the sealed enclosure, and configured to provide heat to the inside of the sealed enclosure.

3 . The spacecraft of claim 1 , wherein said one or more electronic related components comprise one or more electronic components that actively dissipate heat, and each of said one or more electronic components that actively dissipate heat is physically attached to the sealed enclosure from the electronic component to the sealed enclosure, by:

a thermally conductive attachment (Pl 3 , Pl 41 , Pl 42 , Pl 43 ); and

at least one of said one or more heat transfer elements.

4 . The spacecraft of claim 3 , further comprising one or more heat conductive and shock absorbing elements (S 3 , S 41 , S 42 , S 43 ) between said thermally conductive attachment and said at least one of said one or more heat transfer elements.

5 . The spacecraft of claim 4 , wherein said one or more heat conductive and shock absorbing elements comprise one or more metal springs.

6 . The spacecraft of claim 5 , herein, wherein at least one of said one or more electronic components that actively dissipate heat belongs to an electronic board or internal element (B 3 , B 41 , B 43 ) which is tied to the sealed enclosure by one or more screws through said one or more metal springs.

7 . The spacecraft of claim 4 , wherein said one or more heat conductive and shock absorbing elements comprise thermal paste.

8 . The spacecraft of claim 4 , wherein said one or more heat conductive and shock absorbing elements comprise a flexible metal blade (Bl 43 ) physically attached by one of its extremities to one of said one or more heat transfer elements (HT 43 ), and substantially parallel to one of said one or more electronic components that actively dissipate heat (El 43 ), a flexible metal blade (Bl 43 ) being is in heat conductive contact with said one of said one or more electronic components that actively dissipate heat.

9 . The spacecraft of claim 3 , comprising a plurality of electronic components that actively dissipate heat on a plurality of electronic boards.

10 . The spacecraft of claim 1 , wherein said radiation shielding layer is a gold layer.

11 . The spacecraft of claim 1 , wherein at least one of the inner layer (Lay 23 ) and the radiation shielding layer (Lay 22 ) has a heterogeneous structure.

12 . The spacecraft of claim 11 , wherein at least one of said one or more heat transfer element is located in front of the most thermally conductive part of said at least one of the inner layer (Lay 23 ) and the radiation shielding layer (Lay 22 ).

13 . The spacecraft of claim 1 , wherein the one or more heat transfer elements comprise one or more passive heat transfer element.