Split-gate MOSFET and manufacturing method thereof
Disclosed is a split-gate MOSFET and a manufacturing method, including: forming a first trench in a semiconductor layer; forming a second trench communicated with the first trench by using the first trench; forming a first dielectric layer in the second trench, a second dielectric layer in the first trench; forming a first conductor, located in the second trench, isolated from the semiconductor layer by the first dielectric layer; forming a third dielectric layer covering the first conductor; forming a second conductor, located in the first trench, isolated from the semiconductor layer by the second dielectric layer, the first conductor being isolated from the second conductor by the third dielectric layer; forming a body region adjacent to the first trench, the first trench has an inner diameter greater than that of the second trench. Thus, process window is expanded and beneficial to forming the third dielectric layer.
1 . A manufacturing method of a split-gate MOSFET, wherein the manufacturing method comprises:
forming a cavity extending from an upper surface of a semiconductor layer of a first dopant type to an interior of the semiconductor layer;
forming a molding layer covering a sidewall of the cavity, wherein an inner diameter of a portion, which is close to a lower part of the cavity, of the molding layer is smaller than an inner diameter of a portion, which is close to a top of the cavity, of the molding layer, and a first trench is formed at a portion, which is free of the molding layer, of the cavity,
forming a second trench communicated with the first trench by using the first trench, the first trench and the second trench extending in a same extension;
forming a first dielectric layer covering an inner surface of the second trench and a second dielectric layer covering an inner surface of the first trench;
forming a first conductor located in the second trench, the first conductor being isolated from the semiconductor layer by the first dielectric layer;
forming a third dielectric layer covering a surface of the first conductor;
forming a second conductor located in the first trench, the second conductor being isolated from the semiconductor layer by the second dielectric layer, the first conductor being isolated from the second conductor by the third dielectric layer; and
forming a body region of a second dopant type that is located in the semiconductor layer and is adjacent to the first trench,
wherein an inner diameter of the first trench is greater than an inner diameter of the second trench, and an inner diameter of a bottom of the first trench is smaller than an inner diameter of a top of the first trench.
2 . The manufacturing method according to claim 1 , wherein the inner diameter of the second trench is consistent with the inner diameter of the bottom of the first trench.
3 . The manufacturing method according to claim 2 , wherein an inner diameter of the molding layer gradually increases from bottom to top, such that the inner diameter of the first trench gradually increases from bottom to top.
4 . The manufacturing method according to claim 2 , wherein step of forming the molding layer comprises:
forming a dielectric material covering the sidewall of the cavity; and
removing part of the dielectric material to form the molding layer.
5 . The manufacturing method according to claim 1 , wherein a thickness of the first dielectric layer is greater than a thickness of the second dielectric layer.
6 . The manufacturing method according to claim 1 , wherein the manufacturing method further comprises:
forming a source region located in the body region, the source region being of the first dopant type;
forming an interlayer dielectric layer located on the source region; and
forming a source electrode located on the interlayer dielectric layer.
7 . The manufacturing method according to claim 1 , wherein the manufacturing method further comprises:
forming a body contact region of the second dopant type located in the body region; and
forming a conductive channel that penetrates the interlayer dielectric layer and the source region to reach the body contact region, the source electrode being connected to the body contact region via the conductive channel.
8 . The manufacturing method according to claim 1 , wherein the semiconductor layer is formed on a semiconductor substrate, the semiconductor substrate is located on a lower surface of the semiconductor layer, and the upper surface of the semiconductor layer is opposite to the lower surface of the semiconductor layer; and the manufacturing method further comprises:
forming a drain electrode located on a lower surface of the semiconductor substrate.