Method of manufacturing electronic device, and substrate for element transfer

1 . A method of manufacturing an electronic device, comprising steps of:

(a) preparing a substrate for element transfer including a first substrate having a first surface, and an elastic deformation portion fixed on the first surface of the first substrate and made of an elastically deformable material;

(b) bonding a plurality of elements and a plurality of element holding portions of the elastic deformation portion of the substrate for element transfer to hold the plurality of elements by the substrate for element transfer;

(c) preparing a second substrate having a second surface having a plurality of bump electrodes arranged thereon, and bringing the plurality of bump electrodes and electrodes of the plurality of elements held by the substrate for element transfer into contact with each other; and

(d) irradiating with laser a plurality of contact portions at which the plurality of bump electrodes and the electrodes of the plurality of element are in contact with each other to bond the bump electrodes and the element electrodes irradiated with the laser,

wherein the elastic deformation portion includes:

the plurality of element holding portions; and

a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions in a plan view, and protruding higher than the plurality of element holding portions when the first surface of the first substrate is a reference plane, and

wherein at the step (c), the first substrate and the second substrate are brought close to each other until each of the plurality of protrusions of the elastic deformation portion is in contact with the second surface of the second substrate.

2 . The method of manufacturing the electronic device according to claim 1 ,

wherein each of the first substrate and the elastic deformation portion is made of a visible light transmitting material, and

wherein at the step (c), each of tips of the plurality of protrusions is elastically deformed to adjust a spacing distance between the first substrate and the second substrate, based on a degree of the elastic deformation of the tips.

3 . The method of manufacturing the electronic device according to claim 2 ,

wherein each of the plurality of protrusions has a conical or pyramidal shape.

4 . The method of manufacturing the electronic device according to claim 2 ,

wherein two or more protrusions are arranged around each of the plurality of element holding portions in a plan view.

5 . The method of manufacturing the electronic device according to claim 2 ,

wherein each of the plurality of element holding portions includes:

an element support portion protruding lower than each of the plurality of protrusions when the first surface of the first substrate is the reference plane; and

an element holding surface arranged at a tip of the element support portion and capable of holding the element.

6 . The method of manufacturing the electronic device according to claim 5 ,

wherein the plurality of element holding portions and the plurality of protrusions are bonded to the first substrate while being spaced from each other.

7 . The method of manufacturing the electronic device according to claim 5 ,

wherein the plurality of element holding portions are bonded to the first substrate while being spaced from each other, and

wherein the plurality of element holding portions and one or more of the protrusions are unified.