Display device comprising semiconductor light emitting element
A display device including a semiconductor light emitting device according to an embodiment includes a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other, a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening, a semiconductor light emitting device disposed inside the first opening and having a first electrode overlapping the first assembled wiring and the second assembled wiring, and an assembly wiring connection pattern that electrically connects the first assembly wiring and the second assembly wiring. And first electrode can be electrically connected to one of the first assembly wiring and the second assembly wiring.
1 . A display device comprising:
a substrate;
a first and second assembly wirings alternately arranged on the substrate and spaced apart from each other;
a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening;
a semiconductor light emitting device disposed inside the first opening, wherein a first electrode thereof overlaps the first assembly wiring and the second assembly wiring; and
an assembly wiring connection pattern that is spaced apart from the first opening and electrically connects the first assembly wiring and the second assembly wiring,
wherein the first electrode is electrically connected to one of the first assembly wiring or the second assembly wiring.
2 . The display device according to claim 1 , wherein the first assembly wiring and the second assembly wiring extend in a column direction, and the assembly wiring connection pattern extends in a row direction, so that the first assembly wiring and the second assembly wiring are electrically connected to each other.
3 . The display device according to claim 1 , wherein the first assembly wiring is separated from the first electrode within the first opening, and the second assembly wiring is in contact with the first electrode.
4 . The display device according to claim 3 , wherein the first assembly wiring is electrically connected to the first electrode through the assembly wiring connection pattern and the second assembly wiring.
5 . The display device according to claim 1 , further comprising an insulating layer covering the first assembly wiring,
wherein the assembly wiring connection pattern is in contact with the first assembly wiring through the planarization layer and a contact hole of the insulating layer, and is in contact with the second assembly wiring through a contact hole of the planarization layer.
6 . The display device according to claim 1 , further comprising a pixel electrode disposed on the semiconductor light emitting device and the planarization layer,
wherein the pixel electrode is disposed on the same plane as the assembly wiring connection pattern.
7 . The display device according to claim 1 , wherein the first assembly wiring, the second assembly wiring, and the assembly wiring connection pattern have the same potential.
8 . The display device according to claim 1 , wherein the second assembly wiring extends beyond a center of the first opening and is disposed on a different plane from the first assembly wiring.
9 . The semiconductor light emitting device of claim 1 , wherein the first assembly wiring vertically overlaps the second assembly wiring, and the second assembly wiring includes an electrode hole in a region that vertically overlaps the first assembly wiring.
10 . The display device according to claim 1 , wherein the second assembly wiring includes an electrode hole in a region that vertically overlaps the first assembly wiring.
11 . A display device comprising:
a substrate having a plurality of sub-pixels defined;
a first assembly wiring arranged along a plurality of sub-pixels arranged in a same column among the plurality of sub-pixels;
a second assembly wiring arranged along the plurality of sub-pixels arranged in the same column among the plurality of sub-pixels, the second assembly wiring being disposed adjacent to the first assembly wiring;
a planarization layer including a first opening overlapping the first assembly wiring and the second assembly wiring;
a semiconductor light emitting device disposed in the first opening of each of the plurality of sub-pixels and electrically connected to the second assembly wiring; and
an assembly wiring connection pattern disposed on the planarization layer and electrically connected to the first assembly wiring and the second assembly wiring.
12 . The display device according to claim 11 , wherein the first assembly wiring is electrically connected to the semiconductor light emitting device through the assembly wiring connection pattern and the second assembly wiring, and
the first assembly wiring in the first opening is spaced apart from the semiconductor light emitting device.
13 . The display device according to claim 11 , wherein the assembly wiring connection pattern electrically connects the first assembly wiring and the second assembly wiring disposed in a sub-pixel.
14 . The semiconductor device of claim 11 , wherein the assembly wiring connection pattern is disposed along a plurality of sub-pixels arranged in a same row among the plurality of sub-pixels to electrically connect the first assembly wiring and the second assembly wiring.
15 . The display device according to claim 14 , wherein the first assembly wiring, the second assembly wiring, and the assembly wiring connection pattern form a mesh shape.
16 . The display device according to claim 11 , wherein the second assembly wiring is disposed to extend beyond a center of the first opening.
17 . The display device according to claim 16 , wherein the second assembly wiring is disposed on a different plane from the first assembly wiring.
18 . The display device according to claim 11 , wherein the first assembly wiring vertically overlaps the second assembly wiring.