IP Library Granted Patent US 12684927
Granted Patent B2
US 12684927 · App. 18/318,126 · Granted Jul 14, 2026

Method for manufacturing image display device and image display device

Inventor: Hajime Akimoto (Anan, JP)
Assignee: NICHIA CORPORATION
H10H29/142H10H20/851H10H20/856H10H20/0361H10H20/0363
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Quick Facts
Patent No.
US 12684927
App. No.
18/318,126
Granted
Jul 14, 2026
Kind
B2
Abstract

A method for manufacturing an image display device according to an embodiment includes forming a graphene layer on a first substrate, forming a semiconductor layer including a light-emitting layer on the graphene layer, forming the light-emitting element by patterning the semiconductor layer so that the light-emitting element includes a bottom surface on the graphene layer and a light-emitting surface at a side opposite to the bottom surface, forming a first insulating film that covers the first substrate, the graphene layer, and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film that covers the first insulating film and the circuit element, exposing the light-emitting surface by removing a portion of the first insulating film and a portion of the second insulating film, forming a via extending through the first and second insulating films, and forming a wiring layer on the second insulating film.

Claims (32)

1 . A method for manufacturing an image display device, the method comprising:

forming a graphene-including layer on a first substrate;

forming a semiconductor layer on the graphene-including layer, the semiconductor layer comprising a light-emitting layer;

forming a light-emitting element by patterning the semiconductor layer, the light-emitting element comprising:

a bottom surface on the graphene-including layer, and

a light-emitting surface at a side opposite to the bottom surface;

forming a first insulating film that covers the first substrate, the graphene-including layer, and the light-emitting element;

forming a circuit element on the first insulating film;

forming a second insulating film that covers the first insulating film and the circuit element,

exposing a surface that includes the light-emitting surface by removing a portion of the first insulating film and a portion of the second insulating film;

forming a via that extends through the first and second insulating films; and

forming a wiring layer on the second insulating film; wherein:

the light-emitting element comprises a connection part formed on the graphene-including layer; and

the via is located between the wiring layer and the connection part and electrically connects the wiring layer and the connection part.

2 . The method for manufacturing the image display device according to claim 1 , wherein:

in the step of forming the semiconductor layer, the semiconductor layer is formed by sputtering.

3 . The method for manufacturing the image display device according to claim 1 , further comprising:

before the step of forming the graphene-including layer, forming a first part on the first substrate, the first part being light-reflective, wherein:

in a plan view, an outer perimeter of the light-emitting element is located within an outer perimeter of the first part.

4 . The method for manufacturing the image display device according to claim 1 , wherein:

the first substrate comprises a light-transmitting substrate.

5 . The method for manufacturing the image display device according to claim 4 , wherein:

the first substrate further comprises a second substrate located on the light-transmitting substrate, the second substrate being flexible, and

the method further comprises, after the step of forming the wiring layer, removing the light-transmitting substrate.

6 . The method for manufacturing the image display device according to claim 5 , further comprising:

before the step of forming the graphene-including layer, forming a layer including a silicon compound on the second substrate.

7 . The method for manufacturing the image display device according to claim 1 , further comprising:

forming a light-transmitting electrode on the light-emitting surface.

8 . The method for manufacturing the image display device according to claim 1 , wherein:

the semiconductor layer comprises a gallium nitride compound semiconductor.

9 . The method for manufacturing the image display device according to claim 1 , further comprising:

forming a wavelength conversion member on the light-emitting element.