Light-emitting chip, manufacturing method thereof and electronic device

1 . A light-emitting chip, comprising:

a first substrate; and

at least one reflector and a light-emitting pixel layer sequentially located on the first substrate;

wherein the light-emitting pixel layer comprises at least one light-emitting pixel; the light-emitting pixel comprises a first semiconductor layer, a light-emitting layer and a second semiconductor layer sequentially located on the first substrate; the reflector is arranged corresponding to the light-emitting pixel;

a first surface, close to the light-emitting pixel, of the reflector is a bowl-shaped surface, the bowl-shaped surface is concave in a direction close to the first substrate; the reflector is configured to reflect light emitted by a corresponding light-emitting pixel and adjust an emission direction and/or an emission angle of the light;

the light-emitting chip further comprises a first electrode and a second electrode;

the first electrode is located on a side, away from the light-emitting pixel layer, of the reflector, and the first electrode is electrically connected with the first semiconductor layer;

the second electrode is located on a side, away from the first substrate, of the second semiconductor layer, and the second electrode is electrically connected with the second semiconductor layer;

a side, away from the light-emitting pixel layer, of the first electrode is provided with a driving circuit board;

the first electrode is electrically connected with the driving circuit board through a first connector; the first connector penetrates a film layer between the first electrode and the driving circuit board; and

the second electrode is electrically connected with the driving circuit board through a second connector; the second connector penetrates a film layer between the second electrode and the driving circuit board.

2 . The light-emitting chip according to claim 1 , wherein the first surface close to the light-emitting pixel and a second surface away from the light-emitting pixel of the reflector are bowl-shaped surfaces, and the reflector is configured as a bowl-shaped structure.

3 . The light-emitting chip according to claim 1 , wherein a second surface, away from the light-emitting pixel, of the reflector is a flat surface.

4 . The light-emitting chip according to claim 1 , wherein a side, facing the first substrate, of the light-emitting pixel layer is provided with at least one bowl-shaped protrusion;

the bowl-shaped protrusion is protruded in a direction close to the first substrate; and

the bowl-shaped protrusion is arranged corresponding to the reflector, and a shape of the bowl-shaped surface of the reflector is consistent with that of the bowl-shaped protrusion.

5 . The light-emitting chip according to claim 4 , wherein a material of the bowl-shaped protrusion is the same as that of the first semiconductor layer.

6 . The light-emitting chip according to claim 4 , wherein a material of the bowl-shaped protrusion is a transparent conductive material.

7 . The light-emitting chip according to claim 1 , wherein a film layer between the first electrode and the first semiconductor layer is a conductive film layer, and the first electrode is electrically connected with the first semiconductor layer through the conductive film layer; the conductive film layer at least comprises the reflector.

8 . The light-emitting chip according to claim 1 , wherein the first electrode is electrically connected with the first semiconductor layer through an electrical conductor, the electrical conductor penetrates a film layer between the first electrode and the first semiconductor layer.

9 . The light-emitting chip according to claim 1 , wherein an isolation structure is provided between adjacent light-emitting pixels, and the isolation structure is configured to isolate light of the adjacent light-emitting pixels.

10 . The light-emitting chip according to claim 9 , wherein the second connector is located inside the isolation structure, and the second connector is configured to realize electrical connection between the second electrode of the light-emitting pixel and the driving circuit board.

11 . The light-emitting chip according to claim 1 , wherein the reflector is arranged in one-to-one correspondence with the light-emitting pixel, and an orthographic projection, on the first substrate, of one reflector covers an orthographic projection, on the first substrate, of one light-emitting pixel.

12 . The light-emitting chip according to claim 1 , wherein a plurality of reflectors are arranged corresponding to one light-emitting pixel, and orthographic projections, on the first substrate, of the plurality of reflectors cover an orthographic projection, on the first substrate, of one light-emitting pixel.

13 . A manufacturing method of a light-emitting chip, comprising:

forming a light-emitting pixel layer on a second substrate, the light-emitting pixel layer comprising at least one light-emitting pixel, and the light-emitting pixel comprising a second semiconductor layer, a light-emitting layer and a first semiconductor layer sequentially located on the second substrate;

forming at least one reflector on a side, away from the second substrate, of the light-emitting pixel layer, the reflector being arranged corresponding to the light-emitting pixel, and a first surface, close to the light-emitting pixel, of the reflector being a bowl-shaped surface, the bowl-shaped surface being protruded in a direction away from the second substrate; and

transferring the light-emitting pixel layer and the at least one reflector onto a first substrate and peeling off the second substrate, wherein the at least one reflector and the light-emitting pixel layer are sequentially located on the first substrate, and the light-emitting pixel comprises the first semiconductor layer, the light-emitting layer and the second semiconductor layer sequentially located on the first substrate, the bowl-shaped surface is concave in a direction close to the first substrate; the reflector is configured to reflect light emitted by a corresponding light-emitting pixel and adjust an emission direction and/or an emission angle of the light,

wherein the manufacturing method further comprises forming a first electrode, a second electrode and a driving circuit board;

the first electrode is located on a side, away from the light-emitting pixel layer, of the reflector, and the first electrode is electrically connected with the first semiconductor layer;

the second electrode is located on a side, away from the first substrate, of the second semiconductor layer, and the second electrode is electrically connected with the second semiconductor layer;

a side, away from the light-emitting pixel layer, of the first electrode is provided with the driving circuit board;

the first electrode is electrically connected with the driving circuit board through a first connector; the first connector penetrates a film layer between the first electrode and the driving circuit board; and

the second electrode is electrically connected with the driving circuit board through a second connector; the second connector penetrates a film layer between the second electrode and the driving circuit board.

14 . The manufacturing method of the light-emitting chip according to claim 13 , wherein the forming at least one reflector on a side, away from the second substrate, of the light-emitting pixel layer comprises:

forming at least one bowl-shaped protrusion on the side, away from the second substrate, of the light-emitting pixel layer, the bowl-shaped protrusion being protruded in a direction away from the second substrate; and

forming the at least one reflector on a surface of the at least one bowl-shaped protrusion, and a shape of the bowl-shaped surface of the reflector is consistent with that of the bowl-shaped protrusion.

15 . The manufacturing method of the light-emitting chip according to claim 14 , wherein the forming at least one bowl-shaped protrusion on a side, away from the second substrate, of the light-emitting pixel layer comprises:

forming a transparent conductive layer on the side, away from the second substrate, of the light-emitting pixel layer, and etching the transparent conductive layer, to form at least one first bowl-shaped protrusion.

16 . The manufacturing method of the light-emitting chip according to claim 14 , wherein the forming at least one bowl-shaped protrusion on a side, away from the second substrate, of the light-emitting pixel layer comprises:

etching the first semiconductor layer on the side, away from the second substrate, of the light-emitting pixel layer, to form at least one second bowl-shaped protrusion.

17 . An electronic device, comprising the light-emitting chip according to claim 1 .

18 . The electronic device according to claim 17 , wherein the electronic device comprises a near-eye display device, and the near-eye display device comprises a near-eye display or augmented reality glasses.