Alignment pad of display panel and display device having the same

1 . A display device comprising:

a display panel including:

a display area, and

a non-display area including a first driving pad portion at which the display panel is connected to an integrated circuit chip by solder bumps of the integrated circuit chip, each of the solder bumps having a width,

wherein

the first driving pad portion includes:

a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip via a solder bump among the solder bumps;

a second pad which is electrically floating and by which alignment between the first driving pad portion and the integrated circuit chip is determined; and

the second pad of the first driving pad portion including:

a (2-1)-th pad having a width which is the same as the width of the solder bump; and

a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad; and

the first pad, the (2-1)-th pad and the 2-2)-th pad respectively corresponding to the solder bumps of the integrated circuit.

2 . The display device of claim 1 , wherein within the second pad of the display panel:

the (2-1)-th pad includes a (2-1)-th line portion including portions spaced apart from each other which define a (2-1)-th opening of the (2-1)-th pad the (2-1)-th opening being an enclosed opening having a polygonal shape, and

the (2-2)-th pad includes a (2-2)-th line portion including portions spaced apart from each other which define a (2-2)-th opening of the (2-2)-th pad, the (2-2)-th opening being an enclosed opening having the polygonal shape.

3 . The display device of claim 2 , wherein

the (2-1)-th opening of the (2-1)-th pad has a width between the portions of the (2-1)-th line portion which are spaced apart from each other in a width direction of the polygonal shape, and

along the width direction of the polygonal shape, the width of the of the (2-1)-th opening of the (2-1)-th pad and the width of the solder bump of the integrated circuit chip are the same-.

4 . The display device of claim 3 , wherein

the (2-2)-th opening of the (2-2)-th pad has a width between the portions of the (2-2)-th line portion which are spaced apart from each other in the width direction of the polygonal shape, and

along the width direction of the polygonal shape, the width of the (2-2)-th opening of the (2-2)-th pad is larger than the width of the solder bump.

5 . The display device of claim 4 , wherein

the first driving pad portion further includes a first distance corresponding to the width direction of the polygonal shape, the first distance being a reference value by which the alignment between the first driving pad portion and the integrated circuit chip is determined,

along the width direction of the polygonal shape, the width of the (2-2)-th opening of the (2-2)-th pad is a sum of the width of the solder bump of the integrated circuit chip and twice the first distance, and

the solder bump of the integrated circuit chip within the (2-2)-th opening of the (2-2)-th pad and spaced apart from the (2-2)-th line portion of the (2-2)-th pad by a maximum distance along the width direction of the polygonal shape which is:

less than or equal to twice the first distance, determines alignment between the first driving pad portion and the integrated circuit chip, and

by more than twice the first distance, determines misalignment between the first driving pad portion and the integrated circuit chip.

6 . The display device of claim 1 , wherein the solder bump of the integrated circuit chip which completely overlaps the (2-2)-th pad portion determines alignment between the first driving pad portion and the integrated circuit chip.

7 . The display device of claim 1 , wherein within the first driving pad portion:

the second pad has a polygonal shape defining a minor dimension along a first direction, and a major dimension along a second direction crossing the first direction,

the second pad is provided in plural including a plurality of the second pads arranged along the first direction, and

the plurality of the second pads includes the (2-1)-th pad and the (2-2)-th pad adjacent along the first direction.

8 . The display device of claim 7 , wherein the plurality of the second pads includes:

each of the (2-1)-th pad and the (2-2)-th pad provided in plural, and

n of the (2-2)-th pads and (n-1) of the (2-1)-th pads arranged alternating along the first direction.

9 . The display device of claim 1 , wherein within the first driving pad portion:

the second pad has a polygonal shape defining a minor dimension along a first direction, and a major dimension along a second direction crossing the first direction,

the second pad is provided in plural including a plurality of the second pads arranged along the second direction, and

the (2-1)-th pad and the (2-2)-th pad are alternately disposed.

10 . The display device of claim 9 , wherein the plurality of the second pads includes:

each of the (2-1)-th pad and the (2-2)-th pad provided in plural, and

n pieces of the (2-2)-th pads and (n-1) pieces of the (2-1)-th pads arranged alternating along the second direction.

11 . A display device comprising:

a display panel including:

a display area, and

a non-display area including a first driving pad portion at which the display panel is connected to an integrated circuit chip by solder bumps of the integrated circuit chip, each of the solder bumps having a width defining a width direction,

wherein the first driving pad portion includes:

a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip via a solder bump among the solder bumps;

a second pad which is electrically floating and by which alignment between the first driving pad portion and the integrated circuit chip is determined; and

the second pad of the first driving pad portion including:

 a first area having a width along the width direction which is the same as the width of the solder bump; and

 a second area extending from the first area in a direction crossing the width direction, the second area having a width along the width direction which is larger than the width of the first area; and

the first pad and the second pad respectively corresponding to the solder bumps of the integrated circuit.

12 . The display device of claim 11 , wherein the second pad further includes:

the first area provided in plural including two first areas, and

one of the second area between the two first areas along the direction crossing the width direction.

13 . The display device of claim 11 , wherein along the width direction, the width of the first area of the second pad and the width of the solder bump of the integrated circuit chip are the same.

14 . The display device of claim 11 , wherein along the width direction, the width of the second area of the second pad is larger than the width of the solder bump of the integrated circuit chip.

15 . The display device of claim 11 , wherein

the second pad includes a line portion including portions spaced apart from each other which define an opening at the first area and the second area the opening being enclosed by the line portion,

the opening of the second pad at the first area defines the width of the first area and the opening of the second pad at the second area defines the width of the second area, and

along the width direction:

the first driving pad portion further includes a first distance as a reference value by which the alignment between the first driving pad portion and the integrated circuit chip is determined, and

the width at the second area is a sum of the width of the solder bump of the integrated circuit chip and twice the first distance.

16 . The display device of claim 11 , wherein

the second pad includes a line portion including portions spaced apart from each other which define an opening at the first area and the second area, the opening being enclosed by the line portion,

the opening of the second pad at the first area defines the width of the first area and the opening of the second pad at the second area defines the width of the second area, and

along the width direction, the solder bump of the integrated circuit chip within the line portion at the second area determines alignment between the first driving pad portion and the integrated circuit chip.

17 . The display device of claim 11 , wherein the second pad further includes:

the second area provided in plural including two second areas, and

one of the first area between the two second areas.

18 . The display device of claim 11 , wherein the second pad further includes:

one of the second area and one of the first area.

19 . The display device of claim 11 , wherein the second pad is providing in plural along a first direction or along a second direction which crosses the first direction.

20 . The display device of claim 11 , wherein

each of the first pad and the second pad has a planar shape of a rectangle or a parallelogram, and

the planar shape defines a minor dimension along the width direction of the solder bump to define a first direction, and a major direction along a second direction crossing the first direction.