Bonding apparatus and bonding method
A bonding apparatus includes a first holder, a second holder, a moving unit, a first transforming unit, a second transforming unit and a controller. The first holder holds a first substrate from above. The second holder is provided below the first holder, and holds a second substrate from below. The moving unit moves the first holder and the second holder relative to each other. The first transforming unit makes a central portion of the first substrate held by the first holder protruded downwards. The second transforming unit makes a central portion of the second substrate held by the second holder protruded upwards. The controller performs a control of bringing the central portions into contact with each other. The controller performs a control of changing a protruding amount of the central portion of the first substrate according to a protruding amount of the central portion of the second substrate.
1 . A bonding apparatus configured to bond a first substrate and a second substrate, comprising:
a first holder configured to attract and hold the first substrate from above;
a second holder provided below the first holder, and configured to attract and hold the second substrate under the first holder;
a moving unit configured to move the first holder and the second holder relative to each other;
a first transforming unit configured to make a central portion of the first substrate held by the first holder protrude downward;
a second transforming unit configured to make a central portion of the second substrate held by the second holder protrude upward; and
a controller and a storage storing a computer program, wherein the storage and the computer program are configured, with the controller, to control the moving unit, the first transforming unit, and the second transforming unit to perform a control of bringing the central portions of the first substrate and the second substrate into contact with each other such that the central portions of the first substrate and the second substrate are bonded to each other,
wherein the controller performs:
a control of changing a protruding amount of the central portion of the first substrate according to a protruding amount of the central portion of the second substrate,
a control of decreasing the protruding amount of the central portion of the first substrate as the protruding amount of the central portion of the second substrate increases; and
a control of changing a sum of the protruding amount of the central portion of the first substrate and the protruding amount of the central portion of the second substrate according to the protruding amount of the central portion of the second substrate.
2 . The bonding apparatus of claim 1 , wherein the controller performs a control of increasing the sum of the protruding amount of the central portion of the first substrate and the protruding amount of the central portion of the second substrate as the protruding amount of the central portion of the second substrate increases.
3 . The bonding apparatus of claim 1 ,
wherein the controller acquires data of bending of the first substrate under no load, and changes the protruding amount of the central portion of the second substrate according to the bending of the first substrate under no load.
4 . The bonding apparatus of claim 1 ,
wherein the controller acquires data of a position deviation of a reference point formed on a bonding surface of the first substrate or the second substrate, and changes the protruding amount of the central portion of the second substrate according to the position deviation of the reference point.
5 . A bonding method of bonding a first substrate and a second substrate,
the bonding method being performed by a controller in communication with a storage storing a computer program, the controller being configured to control steps of the bonding method comprising:
attracting and holding the first substrate from above with a first holder;
attracting and holding the second substrate from below with a second holder under the first holder;
moving the first holder and the second holder relative to each other; and
making a central portion of the second substrate held by the second holder protruded upwards while making a central portion of the first substrate held by the first holder protruded downwards, to thereby bring the central portions of the first substrate and the second substrate into contact with each other such that the central portions of the first substrate and the second substrate are bonded to each other,
wherein a protruding amount of the central portion of the first substrate is changed according to a protruding amount of the central portion of the second substrate, and
decreasing the protruding amount of the central portion of the first substrate as the protruding amount of the central portion of the second substrate increases;
changing a sum of the protruding amount of the central portion of the first substrate and the protruding amount of the central portion of the second substrate according to the protruding amount of the central portion of the second substrate.
6 . The bonding method of claim 5 , further comprising:
increasing the sum of the protruding amount of the central portion of the first substrate and the protruding amount of the central portion of the second substrate as the protruding
amount of the central portion of the second substrate increases.
7 . The bonding method of claim 5 , further comprising:
acquiring data of bending of the first substrate under no load, and changing the protruding amount of the central portion of the second substrate according to the bending of the first substrate under no load.
8 . The bonding method of claim 5 , further comprising:
acquiring data of a position deviation of a reference point formed on a bonding surface of the first substrate or the second substrate, and changing the protruding amount of the central portion of the second substrate according to the position deviation of the reference point.