Atmospheric pressure plasma for substrate annealing
Methods and apparatus for contacting a substrate with a plasma at a pressure from about 300 Torr to about 1000 Torr for a period of time sufficient to heat a top portion of the substrate having a depth of less than about 200 nm, to a temperature high enough for annealing, and the temperature of the substrate at a depth of greater than or equal to about 200 nm is less than or equal to about 450° C.
1 . A method comprising:
implanting a substrate to create an ion implanted layer; and
annealing the ion implanted layer comprising contacting a top surface of the substrate with a plasma at a pressure from about 300 Torr to about 1000 Torr for a period of time sufficient to heat a first portion of the substrate comprising the ion implanted layer to a maximum temperature of less than or equal to about 950° C., wherein the first portion of the substrate has a depth of less than about 200 nm determined from the top surface,
wherein a second portion of the substrate, having a depth of greater than or equal to about 200 nm is heated to a maximum temperature of less than about 450° C.
2 . The method of claim 1 , wherein the pressure is from about 700 Torr to about 800 Torr.
3 . The method of claim 1 , wherein the first portion of the substrate comprises an ion implanted silicon on insulator layer and wherein the second portion of the substrate comprised at least one annealed ion implanted silicon layer.
4 . The method of claim 3 , wherein the second portion of the substrate comprises an annealed ion implanted silicon on insulator layer disposed below the first portion of the substrate.
5 . The method of claim 1 , wherein the contacting the top surface of the substrate with the plasma comprises contacting a portion of the top surface of the substrate with the plasma while moving the substrate, a plasma source, or both.
6 . The method of claim 1 , wherein the contacting the top surface of the substrate with the plasma comprises contacting essentially all of the top surface of the substrate with the plasma at the same time.
7 . The method of claim 1 , wherein the maximum temperature is from about 850° C. to about 950° C.
8 . The method of claim 1 , wherein the plasma is generated using an Rf energy at a power of less than or equal to about 1000 watts;
wherein the plasma is at a bombardment energy of less than or equal to about 5 eV;
wherein the plasma comprises helium, neon, and/or argon; or
a combination thereof.
9 . The method of claim 1 , wherein the plasma is formed via dielectric barrier discharge.