Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus
A manufacturing method of a semiconductor package includes the following steps. A semiconductor device is picked up from a carrier by a pick and place device, wherein the pick and place device includes a flexible head having a bonding portion configured to be in contact with the semiconductor device, a neck portion connecting the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion. The semiconductor device is placed and pressed onto a substrate by the pick and place device. An encapsulating material is formed over the substrate to laterally encapsulating the semiconductor device. A redistribution structure is formed over the semiconductor device and the encapsulating material. The substrate is removed.
1 . A pick and place device, comprising:
a holder coupled to a vacuum pump; and
a flexible head comprising a plurality of channels extending through the flexible head and in fluid communication with the vacuum pump, a base portion connecting the holder, a bonding portion configured to be in contact with a workpiece, a neck portion connecting between the base portion and the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion, the neck portion has a curvy profile, and a width of the neck portion is gradually increases from a center of the neck portion to two opposite ends of the neck portion.
2 . The pick and place device as claimed in claim 1 , wherein a difference between the maximum width of the bonding portion and the minimum width of the neck portion substantially ranges from 0.4 mm to 0.8 mm.
3 . The pick and place device as claimed in claim 1 , wherein a thickness of the bonding portion substantially ranges from 0.1 mm to 0.4 mm.
4 . The pick and place device as claimed in claim 1 , wherein the minimum width of the neck portion is substantially smaller than a maximum width of the base portion.
5 . The pick and place device as claimed in claim 1 , wherein a maximum width of the base portion is substantially greater than the maximum width of the bonding portion.
6 . A workpiece handling apparatus, comprising:
a chuck table for carrying a workpiece; and
a pick and place device disposed over the chuck table and configured to move relatively to the chuck table, wherein the pick and place device comprises a flexible head having a bonding portion configured to be in contact with the workpiece, a neck portion further away from the workpiece, wherein a width of the neck portion is gradually increases from a center of the neck portion toward an outer region of the neck portion.
7 . The workpiece handling apparatus as claimed in claim 6 , wherein the pick and place device further comprises a vacuum pump in fluid communication with the flexible head, and the vacuum pump is configured to provide a vacuum between the flexible head and the workpiece for picking up the workpiece.
8 . The workpiece handling apparatus as claimed in claim 7 , wherein the vacuum pump is configured to provide an air flow toward the flexible head after the flexible head places the workpiece to a destination.
9 . The workpiece handling apparatus as claimed in claim 6 , wherein a material of the flexible head comprises rubber, or silicone.
10 . The workpiece handling apparatus as claimed in claim 6 , wherein the neck portion has a curvy profile, and the width of the neck portion gradually increases from the center of the neck portion to two opposite ends of the neck portion.
11 . The workpiece handling apparatus as claimed in claim 6 , wherein the neck portion comprises a groove surrounding a perimeter of the neck portion.
12 . The workpiece handling apparatus as claimed in claim 11 , wherein an angle included between adjacent sidewalls of the groove ranges from 85 to 95°.
13 . The workpiece handling apparatus as claimed in claim 6 , wherein the chuck table further comprises a plurality of ejector pins disposed within the chuck table and configured to be lifted upwardly and protruded from a carrying surface of the chuck table.
14 . A pick and place device, comprising:
a holder coupled to a vacuum pump; and
a flexible head in fluid communication with the vacuum pump and comprises a base portion coupled to the holder, a bonding portion configured to be coupled to a workpiece, and a neck portion connecting between the base portion and the bonding portion, wherein a minimum width of the neck portion is substantially smaller than a maximum width of the bonding portion, and the neck portion comprises a groove surrounding a perimeter of the neck portion.
15 . The pick and place device as claimed in claim 14 , wherein an angle included between adjacent sidewalls of the groove ranges from 85 to 95°.
16 . The pick and place device as claimed in claim 14 , wherein the groove extends from a center of the neck portion toward two opposite ends of the neck portion, and comprises a curvy sidewall.
17 . The pick and place device as claimed in claim 14 , wherein a difference between the maximum width of the bonding portion and the minimum width of the neck portion substantially ranges from 0.4 mm to 0.8 mm.
18 . The pick and place device as claimed in claim 14 , wherein a thickness of the bonding portion substantially ranges from 0.1 mm to 0.4 mm.
19 . The pick and place device as claimed in claim 14 , wherein a maximum width of the base portion is substantially greater than the maximum width of the bonding portion.
20 . The pick and place device as claimed in claim 14 , wherein a material of the flexible head comprises rubber, or silicone.