Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structure
A production method for an adhesive sheet for semiconductor device production including: preparing a backing material-attached laminated body including a laminated body and a backing material; a laminated body cutting step of making an incision in the laminated body along any cut-out shape; and a backing material peeling step of peeling the backing material from the laminated body, wherein in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed.
1 . A production method for an adhesive sheet for semiconductor device production comprising a release film and an adhesive film provided on the release film, the production method comprising:
a preparation step of preparing a backing material-attached laminated body comprising a laminated body and a backing material, the laminated body comprising the release film and an adhesive film layer provided on the release film, and the backing material being stuck to the release film side of the laminated body;
a laminated body cutting step of making an incision in the laminated body along any cut-out shape; and
a backing material peeling step of peeling the backing material from the laminated body,
wherein in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed.
2 . The production method for an adhesive sheet according to claim 1 , further comprising:
an adhesive film layer cutting step of making an incision in the adhesive film layer along an outline forming an outer shape of the adhesive film; and
a margin peeling step of peeling, from the release film, a portion other than the portion removed in the backing material peeling step, in a margin portion constituting a portion other than the adhesive film in the adhesive film layer.
3 . The production method for an adhesive sheet according to claim 1 , wherein the adhesive film is a conductive adhesive film comprising conductive particles.
4 . The production method for an adhesive sheet according to claim 1 , wherein the incision in the laminated body along any cut-out shape is made to cut through the laminated body comprising the adhesive film and the release film, but not completely through the backing material.
5 . A production method for a connected structure, the production method comprising:
a preparation step of preparing an adhesive sheet, the adhesive sheet comprising a release film having a through-hole penetrating in a thickness direction, and an adhesive film provided on one principal surface of the release film, wherein the adhesive film is formed around an opening on the principal surface side of the through-hole such that the opening is exposed when viewed from the thickness direction, wherein the preparation step comprises:
preparing a backing material-attached laminated body comprising a laminated body and a backing material, the laminated body comprising the release film and an adhesive film layer provided on the release film, and the backing material being stuck to the release film side of the laminated body, wherein the laminated body has an incision along any cut-out shape; and
a backing material peeling step of peeling the backing material from the laminated body, wherein, in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed;
a transfer step of sticking the adhesive film of the adhesive sheet to a first adhesive surface of a first member; and
a connection step of connecting the first adhesive surface of the first member and a second adhesive surface of a second member, with the adhesive film interposed therebetween,
wherein the first member has a protruding part on the first adhesive surface, and
in the transfer step, positioning of the adhesive sheet is performed such that the opening in the release film and the protruding part in the first member are superposed when viewed in a plan view, and sticking the adhesive film to the first adhesive surface of the first member such that the adhesive film is not attached to the protruding part.
6 . The production method for a connected structure according to claim 5 , wherein the incision in the laminated body along any cut-out shape is made to cut through the laminated body comprising the adhesive film and the release film, but not completely through the backing material.
7 . The production method for a connected structure according to claim 5 , wherein the adhesive film is a conductive adhesive film comprising conductive particles.
8 . A production method for a connected structure, the production method comprising:
a preparation step of preparing an adhesive sheet, the adhesive sheet comprising a release film having a notch part in a part of a peripheral edge portion, and an adhesive film provided on one principal surface of the release film, wherein the adhesive film is formed around the notch part when viewed from the thickness direction, wherein the preparation step comprises:
preparing a backing material-attached laminated body comprising a laminated body and a backing material, the laminated body comprising the release film and an adhesive film layer provided on the release film, and the backing material being stuck to the release film side of the laminated body, wherein the laminated body has an incision along any cut-out shape; and
a backing material peeling step of peeling the backing material from the laminated body, wherein, in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed;
a transfer step of sticking the adhesive film of the adhesive sheet to a first adhesive surface of a first member; and
a connection step of connecting the first adhesive surface of the first member and a second adhesive surface of a second member, with the adhesive film interposed therebetween,
wherein the first member has a protruding part on the first adhesive surface, and
in the transfer step, positioning of the adhesive sheet is performed such that the notch part in the release film is located around the protruding part in the first member when viewed in a plan view, and sticking the adhesive film to the first adhesive surface of the first member such that the adhesive film is not attached to the protruding part.
9 . The production method for a connected structure according to claim 8 , wherein the incision in the laminated body along any cut-out shape is made to cut through the laminated body comprising the adhesive film and the release film, but not completely through the backing material.
10 . The production method for a connected structure according to claim 8 , wherein the adhesive film is a conductive adhesive film comprising conductive particles.