Semiconductor device and manufacturing method thereof
A semiconductor device includes a FEOL structure and a BEOL structure. The BEOL structure is formed over the FEOL structure and includes a conductive layer, an etching stop layer (ESL) structure, a through via and a barrier layer. The ESL structure is formed over the conductive layer and has a first recess and a lateral surface. The through via passes through the ESL structure to form the first recess and the lateral surface. The barrier layer covers the lateral surface and the first recess. The first recess is recessed with respect to the lateral surface, and the first recess has a first depth ranging between 1 nm and 7 nm.
1 . A manufacturing method for a semiconductor device, comprising:
forming a FEOL structure; and
forming a BEOL structure over the FEOL structure, comprising:
forming an ESL structure over a conductive layer;
forming a first hole to pass through a portion of the ESL structure, wherein the ESL structure forms a lateral surface and a first recess recessed with respect to the lateral surface;
forming a barrier layer over the lateral surface and the first recess;
forming a filling portion within the first recess;
forming a second hole to pass through another portion of the ESL structure, wherein at least one portion of the filling portion is removed, and the second hole exposes the conductive layer.
2 . The manufacturing method as claimed in claim 1 , wherein in forming the ESL structure over the conductive layer, the ESL structure comprises a first ESL, a second ESL, a third ESL and a fourth ESL, wherein the second ESL is formed between the first ESL and the third ESL, the third ESL is formed between the second ESL and the fourth ESL, the fourth ESL is formed between the conductive layer and the third ESL, and the first recess is formed corresponding to the second ESL;
wherein the first ESL is formed from a material the same as that of the third ESL, and the second ESL is formed from a material the same as that of the fourth ESL.
3 . The manufacturing method as claimed in claim 2 , wherein in forming the filling portion within the first recess, the first ESL and the third ESL are bombarded by using a dry etching, wherein the filling portion is formed by a sputtered material of the first ESL and/or a sputtered material of the third ESL.
4 . The manufacturing method as claimed in claim 3 , wherein the dry etching is accomplished by Argon ion plasma.
5 . The manufacturing method as claimed in claim 3 , further comprising:
removing a portion of the third ESL, wherein at least one portion of the filling portion is removed.
6 . The manufacturing method as claimed in claim 1 , wherein in forming the filling portion within the first recess, the filling portion has a second recess having a second depth less than a first depth of the first recess.
7 . The manufacturing method as claimed in claim 1 , wherein after forming the second hole to pass through another portion of the ESL structure, the first recess has a first depth equal to or less than 3 nm.
8 . The manufacturing method as claimed in claim 1 , wherein in forming the barrier layer to cover the lateral surface and the first recess, the barrier layer comprises a continuous portion corresponding to the first recess.
9 . A manufacturing method for a semiconductor device, comprising:
forming a FEOL structure; and
forming a BEOL structure over the FEOL structure, comprising:
forming an ESL structure over a conductive layer;
forming a first hole to pass through a portion of the ESL structure, wherein the ESL structure forms a lateral surface and a first recess recessed with respect to the lateral surface;
forming a barrier layer over the lateral surface and the first recess;
forming a filling portion within the first recess;
forming a second hole to pass through another portion of the ESL structure, wherein at least one portion of the filling portion is removed, and the second hole exposes the conductive layer; and
wherein the first recess has a first depth ranging between 1 nm and 7 nm.
10 . The manufacturing method as claimed in claim 9 , wherein in forming the ESL structure over the conductive layer, the ESL structure comprises a first ESL, a second ESL, a third ESL and a fourth ESL, wherein the second ESL is formed between the first ESL and the third ESL, the third ESL is formed between the second ESL and the fourth ESL, the fourth ESL is formed between the conductive layer and the third ESL, and the first recess is formed corresponding to the second ESL;
wherein the first ESL is formed from a material the same as that of the third ESL, and the second ESL is formed from a material the same as that of the fourth ESL.
11 . The manufacturing method as claimed in claim 10 , wherein in forming the filling portion within the first recess, the first ESL and the third ESL are bombarded by using a dry etching, wherein the filling portion is formed by a sputtered material of the first ESL and/or a sputtered material of the third ESL.
12 . The manufacturing method as claimed in claim 11 , wherein the dry etching is accomplished by Argon ion plasma.
13 . The manufacturing method as claimed in claim 11 , further comprising:
removing a portion of the third ESL, wherein at least one portion of the filling portion is removed.
14 . The manufacturing method as claimed in claim 9 , wherein in forming the filling portion within the first recess, the filling portion has a second recess having a second depth less than a first depth of the first recess.
15 . The manufacturing method as claimed in claim 9 , wherein after forming the second hole to pass through another portion of the ESL structure, the first recess has a first depth equal to or less than 3 nm.
16 . A manufacturing method for a semiconductor device, comprising:
forming a FEOL structure; and
forming a BEOL structure over the FEOL structure, comprising:
forming an ESL structure over a conductive layer;
forming a first hole to pass through a portion of the ESL structure, wherein the ESL structure forms a lateral surface and a first recess recessed with respect to the lateral surface;
forming a barrier layer over the lateral surface and the first recess;
forming a filling portion within the first recess;
forming a second hole to pass through another portion of the ESL structure, wherein at least one portion of the filling portion is removed, and the second hole exposes the conductive layer; and
wherein the barrier layer is a single and contiguous layer.
17 . The manufacturing method as claimed in claim 16 , wherein in forming the ESL structure over the conductive layer, the ESL structure comprises a first ESL, a second ESL, a third ESL and a fourth ESL, wherein the second ESL is formed between the first ESL and the third ESL, the third ESL is formed between the second ESL and the fourth ESL, the fourth ESL is formed between the conductive layer and the third ESL, and the first recess is formed corresponding to the second ESL;
wherein the first ESL is formed from a material the same as that of the third ESL, and the second ESL is formed from a material the same as that of the fourth ESL.
18 . The manufacturing method as claimed in claim 17 , wherein in forming the filling portion within the first recess, the first ESL and the third ESL are bombarded by using a dry etching, wherein the filling portion is formed by a sputtered material of the first ESL and/or a sputtered material of the third ESL.
19 . The manufacturing method as claimed in claim 18 , wherein the dry etching is accomplished by Argon ion plasma.
20 . The manufacturing method as claimed in claim 18 , further comprising:
removing a portion of the third ESL, wherein at least one portion of the filling portion is removed.