IP Library Granted Patent US 12685152
Granted Patent B2
US 12685152 · App. 18/471,979 · Granted Jul 14, 2026

Mesh inductors and antennas of electronic assemblies

Inventors: Manhtien V. Phan (San Jose, CA); Chih-Hao Lee (New Taipei City, TW)
Assignee: Super Micro Computer, Inc.
H10W20/497H01F27/2804H01Q1/2283H10W44/20H10W44/248
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Quick Facts
Patent No.
US 12685152
App. No.
18/471,979
Granted
Jul 14, 2026
Kind
B2
Abstract

An electronic assembly has a substrate and an inductor. The inductor has a wire that turns several times through the substrate by way of through holes. The wire, by way of the through holes, winds for several turns along a dimension and winds for several turns along another dimension. The wire in turns along a dimension crosses the wire in turns along the other dimension. The inductor is electrically connected to an electrical circuit and can be used as a discrete component or antenna of the electrical circuit.

Claims (24)

1 . An electronic assembly comprising:

a substrate;

an inductor comprising a wire that is wound a first plurality of turns and a second plurality of turns through the substrate by way of a plurality of through holes that go through the substrate, the second plurality of turns crosses over the first plurality of turns, and the wire extends a length on an outermost surface of the substrate between through holes of the plurality of through holes; and

an electrical circuit that is electrically connected to the inductor.

2 . The electronic assembly of claim 1 , wherein the substrate is a printed circuit board, and the electrical circuit is mounted on the printed circuit board.

3 . The electronic assembly of claim 1 , wherein the substrate is a layer of semiconductor material in an integrated circuit (IC).

4 . The electronic assembly of claim 1 , further comprising:

a magnetic material,

wherein the wire is wound the first plurality of turns around the magnetic material, and the wire is wound the second plurality of turns around the first plurality of turns and around the magnetic material.

5 . The electronic assembly of claim 4 , wherein the magnetic material is disposed within a cutout that is cut through the substrate.

6 . The electronic assembly of claim 5 , wherein the magnetic material partially fills the cutout.

7 . The electronic assembly of claim 5 , wherein the magnetic material fully fills the cutout.

8 . The electronic assembly of claim 1 , wherein the inductor serves as an antenna of the electrical circuit.

9 . The electronic assembly of claim 1 , wherein the inductor has a rectangular box shape.

10 . An electronic assembly comprising:

a substrate having a plurality of through holes that go through the substrate and a cutout that is cut through the substrate;

an inductor comprising a wire that is disposed through the plurality of through holes, the wire winds a first plurality of turns around the cutout along a first dimension, the wire winds a second plurality of turns around the cutout and the first plurality of turns along a second dimension, and the wire in the second plurality of turns crosses over the wire in the first plurality of turns; and

an electrical circuit that is electrically connected to the inductor.

11 . The electronic assembly of claim 10 , wherein the substrate is a printed circuit board.

12 . The electronic assembly of claim 10 , further comprising a magnetic core that is disposed in the cutout.

13 . The electronic assembly of claim 12 , wherein the magnetic core fully fills the cutout.

14 . The electronic assembly of claim 12 , wherein the magnetic core partially fills the cutout.

15 . The electronic assembly of claim 10 , wherein the inductor has a rectangular box shape.

16 . The electronic assembly of claim 10 , wherein the inductor is an antenna of the electrical circuit.