Electronic package and substrate structure thereof
An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation structure is bonded on the electronic element via a heat dissipation material, so that the flow stopper limits an overflow range of the heat dissipation material to prevent the heat dissipation material from contaminating a circuit layer on the substrate body.
1 . A substrate structure, comprising:
a substrate body having a first side and a second side opposing the first side, a packaging area, a concentrating area adjacent to the packaging area and a functional area adjacent to the concentrating area being defined on the first side, wherein the first side has a circuit layer formed thereon, and the circuit layer has a plurality of conductive parts located on the functional area; and
a flow stopper disposed on the concentrating area of the first side of the substrate body, wherein the flow stopper has a discontinuous ring shape to form a plurality of dams or recesses, and a gap is formed between adjacent ones of the dams or recesses, wherein an arrangement of the plurality of dams or recesses corresponds to positions of the plurality of conductive parts, so that a position of a single dam or recess corresponds to a position of a single conductive part.
2 . The substrate structure of claim 1 , wherein the packaging area is surrounded by the flow stopper.
3 . The substrate structure of claim 1 , wherein each of the dams is a protrusion disposed on the first side of the substrate body.
4 . The substrate structure of claim 1 , wherein each of the dams is a wall-shaped insulator.
5 . The substrate structure of claim 1 , wherein each of the recesses is formed on the first side of the substrate body.
6 . The substrate structure of claim 1 , wherein the flow stopper is located at a boundary of the concentrating area and the packaging area.
7 . An electronic package, comprising:
a substrate structure including a substrate body and a flow stopper, wherein the substrate body has a first side and a second side opposing the first side, wherein a packaging area, a concentrating area adjacent to the packaging area, and a functional area adjacent to the concentrating area are defined on the first side, wherein the first side has a circuit layer formed thereon, wherein the circuit layer has a plurality of conductive parts located on the functional area, and wherein the flow stopper is disposed on the concentrating area of the first side of the substrate body;
an electronic element disposed on the packaging area of the first side of the substrate body and electrically connected to the circuit layer; and
a heat dissipation structure bonded on the electronic element via a heat dissipation material, wherein the heat dissipation material is further formed on the concentrating area.
8 . The electronic package of claim 7 , wherein the electronic element is electrically connected to the circuit layer via a plurality of conductive bumps.
9 . The electronic package of claim 8 , further comprising a cladding layer formed on the first side of the substrate body and covering the plurality of conductive bumps.
10 . The electronic package of claim 9 , wherein the cladding layer is adjacent to the flow stopper.
11 . The electronic package of claim 7 , wherein the heat dissipation material is used as a thermal interface material.
12 . The electronic package of claim 7 , wherein the heat dissipation structure is a heat sink.
13 . The electronic package of claim 7 , wherein the heat dissipation structure comprises a sheet-shaped heat dissipation body and a plurality of supporting legs erected on the heat dissipation body, wherein the heat dissipation body is in contact with and bonded to the heat dissipation material, and the plurality of supporting legs are disposed on the plurality of conductive parts.
14 . The electronic package of claim 13 , wherein the plurality of supporting legs are disposed on the plurality of conductive parts via a plurality of conductive elements.
15 . The electronic package of claim 7 , further comprising a plurality of conductive elements disposed on the plurality of conductive parts.