Electronic devices and methods of manufacturing electronic devices
In one example, an electronic device includes a substrate, an electronic component disposed over the substrate, and an encapsulant disposed over the substrate and the electronic component. A molded heat spreader can be disposed over the encapsulant and can comprise a heat spreader and a mold compound disposed around a lateral side of the heat spreader. A lateral side of the mold compound is coplanar with a lateral side of the encapsulant. Other examples and related methods are also disclosed herein.
1 . An electronic device, comprising:
a substrate;
an electronic component disposed over the substrate;
an encapsulant disposed over the substrate and the electronic component;
a molded heat spreader disposed over the encapsulant, wherein the molded heat spreader comprises:
a heat spreader; and
a mold compound disposed around a lateral side of the heat spreader, wherein a lateral side of the mold compound is coplanar with a lateral side of the encapsulant.
2 . The electronic device of claim 1 , wherein the heat spreader comprises a first side subjected to a surface treatment to increase a roughness, wherein the first side is oriented towards the encapsulant.
3 . The electronic device of claim 2 , further comprising a plating layer disposed over a second side of the heat spreader opposite the first side.
4 . The electronic device of claim 1 , further comprising:
a bond pad of the electronic component oriented away from the substrate; and
a component interconnect coupling the bond pad to the substrate.
5 . The electronic device of claim 1 , wherein the mold compound is disposed over a portion of the heat spreader, around the lateral side of the heat spreader, and over the encapsulant.
6 . The electronic device of claim 1 , wherein a lower side of the heat spreader extends below a lower side of the mold compound.
7 . The electronic device of claim 1 , wherein the substrate comprises a redistribution layer (RDL) substrate.
8 . The electronic device of claim 1 , wherein the lateral side of the encapsulant comprises a step, wherein a first portion of the lateral side of the encapsulant is coplanar with the lateral side of the mold compound, wherein a second portion of the lateral side of the encapsulant protrudes from the first portion.
9 . The electronic device of claim 1 , wherein the lateral side of the heat spreader comprises a step.
10 . An electronic device, comprising:
a substrate;
an electronic component disposed over the substrate;
an interposer disposed over the substrate and defining a cavity;
a heat spreader disposed over the electronic component and in the cavity defined by the interposer; and
an encapsulant disposed between the heat spreader and the electronic component and disposed between the heat spreader and the interposer.
11 . The electronic device of claim 10 , further comprising:
a bond pad of the electronic component oriented away from the substrate; and
a component interconnect coupling the bond pad to the substrate.
12 . The electronic device of claim 10 , wherein the substrate comprises a redistribution layer (RDL) substrate.
13 . The electronic device of claim 10 , further comprising an internal interconnect coupling the substrate to the interposer.
14 . The electronic device of claim 10 , further comprising a component interconnect disposed between the electronic component and the substrate, wherein the component interconnect couples the electronic component to the substrate.