Semiconductor device
Heat from a semiconductor device is effectively dissipated while the height of the semiconductor device is kept low. A semiconductor device includes a cooler configured to cool a semiconductor module. The semiconductor module includes: a metal block, a semiconductor element, a terminal connected to the semiconductor element, and a resin covering a part of the terminal, the metal block, and the semiconductor element. The cooler includes: a metal base including the semiconductor module in a plan view while being in contact with a lower surface of the semiconductor module, and a cooling pipe disposed on an upper surface of the metal base and configured to cool the semiconductor module. The cooling pipe at least partially surrounds the semiconductor module in a plan view.
1 . A semiconductor device comprising:
a semiconductor module; and
a cooler configured to cool the semiconductor module,
wherein the semiconductor module includes:
a metal block,
a semiconductor element provided on an upper surface of the metal block,
a terminal connected to the semiconductor element, and
a resin covering a part of the terminal, the metal block, and the semiconductor element,
wherein the cooler includes:
a metal base provided in a region including the semiconductor module in a plan view while being in contact with a lower surface of the semiconductor module, and
a cooling pipe disposed on an upper surface of the metal base, the cooling pipe being configured to circulate a refrigerant for cooling the semiconductor module, and
wherein the cooling pipe is provided to at least partially surround the semiconductor module in a plan view, the cooling pipe being provided on a lateral side surface of the semiconductor module, and
wherein the terminal extends out of the lateral side surface of the semiconductor module and contacts and covers an upper surface of the cooling pipe.
2 . The semiconductor device according to claim 1 ,
wherein a lower surface of the metal block is covered with the resin, and
wherein the metal base is in contact with a lower surface of the resin.
3 . The semiconductor device according to claim 1 ,
wherein the semiconductor module further includes:
an insulating material provided on a lower surface of the metal block, and
a metal plate provided on a lower surface of the insulating material,
wherein a lower surface of the metal plate is exposed from the resin, and
wherein the metal base is in contact with a lower surface of the metal plate.
4 . The semiconductor device according to claim 3 ,
wherein at least a part of a side surface of the metal plate is exposed from the resin, and
wherein the cooling pipe is in contact with a side surface of the metal plate exposed from the resin.
5 . The semiconductor device according to claim 1 , wherein the terminal extends from an upper surface of the resin.
6 . The semiconductor device according to claim 5 , wherein the terminal has a portion extending in a state of being flush with the upper surface of the resin on the upper surface of the resin.
7 . The semiconductor device according to claim 5 , wherein the terminal has a portion extending in a state of being flush with a side surface of the resin on an upper surface of the resin.
8 . The semiconductor device according to claim 1 , wherein the cooling pipe is in contact with the lateral side surface of the semiconductor module.
9 . The semiconductor device according to claim 1 , wherein the cooling pipe is provided to surround an entire periphery of the semiconductor module in a plan view.
10 . The semiconductor device according to claim 1 , wherein the cooling pipe is provided to surround only a part of a side surface of the semiconductor module in a plan view.
11 . The semiconductor device according to claim 10 , wherein the cooling pipe has nipples at both ends in a longitudinal direction of the cooling pipe.
12 . The semiconductor device according to claim 1 , wherein the cooling pipe is provided to surround only a pair of facing side surfaces of the semiconductor module in a plan view.
13 . The semiconductor device according to claim 1 , wherein a wide band gap semiconductor is used for the semiconductor element.
14 . The semiconductor device according to claim 1 , wherein the cooling pipe is provided above the lower surface of the semiconductor module.
15 . The semiconductor device according to claim 1 , wherein the cooler further includes:
an introduction nipple configured to introduce the refrigerant to the semiconductor module in a first direction, and
a drainage nipple configured to discharge the refrigerant from the semiconductor device in the first direction,
wherein the refrigerant is configured to pass the semiconductor module to cool the semiconductor module within the cooling pipe at a position outside of the semiconductor module in a second direction perpendicular to the first direction in plan view.
16 . The semiconductor device according to claim 2 , wherein a portion of the resin is directly below the lower surface of the metal block.
17 . The semiconductor device according to claim 1 , wherein the cooling pipe is configured to laterally circulate the refrigerant for cooling the semiconductor module.
18 . The semiconductor device according to claim 1 , wherein a height of the cooling pipe is smaller than a height of the semiconductor module in cross-sectional view.
19 . The semiconductor device according to claim 1 , wherein the terminal extends out of the lateral side surface of the semiconductor module at a position above the cooling pipe.
20 . The semiconductor device according to claim 18 , wherein the terminal extends out of the lateral side surface of the semiconductor module at a position above the cooling pipe.