IP Library › Granted Patent US 12685167
Granted Patent B2
US 12685167 · App. 18/169,609 · Granted Jul 14, 2026

Heatsink for ring type integrated circuits

Inventors: Yongguo Chen (Shanghai, CN); Kai Cao (Fremont, CA); Hua Yang (Tracy, CA); Vic Hong Chia (Sunnyvale, CA); Paul Ton (San Jose, CA)
Assignee: Cisco Technology, Inc.
H10W40/735H10W72/07355H10W72/351H10W72/9415H10W80/743H10W90/736
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Quick Facts
Patent No.
US 12685167
App. No.
18/169,609
Granted
Jul 14, 2026
Kind
B2
Abstract

The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

Claims (69)

1 . A cold plate assembly comprising:

a cold plate comprising a pedestal portion on a first side of the cold plate;

a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;

a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove; and

the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

2 . The cold plate assembly of claim 1 , wherein the groove comprises:

a recessed surface recessed from the surface of the pedestal portion; and

a first sidewall between the recessed surface and the surface of the pedestal portion,

wherein the first rounded groove edge is formed at an intersection of the surface of the pedestal portion and the first sidewall.

3 . The cold plate assembly of claim 2 , wherein a recess depth between the surface of the pedestal portion and the recessed surface comprises 0.2 millimeters.

4 . The cold plate assembly of claim 2 , wherein the groove further comprises:

an open side opposite the first sidewall, wherein the recessed surface extends in a first direction from the first sidewall to a recessed outer sidewall of the pedestal portion.

5 . The cold plate assembly of claim 2 , wherein the groove further comprises:

a second sidewall between the recessed surface and the surface of the pedestal portion; and

a second rounded groove edge formed at an intersection of the second sidewall and the surface of the pedestal portion.

6 . The cold plate assembly of claim 2 , wherein a width of the recessed surface comprises a measurement between 3 to 4 millimeters.

7 . The cold plate assembly of claim 6 ,

wherein the cold plate assembly is attached to an integrated circuit (IC),

wherein a surface of the PCM layer opposite the surface of the pedestal portion is attached to a surface of the IC,

wherein the surface of the IC comprises a side edge,

wherein the cold plate assembly is attached to the IC such that 70% of the width of the recessed surface is in a facing relationship with the surface of the IC on a first side of the side edge of the IC, and

wherein 30% of the width the recessed surface is positioned in a facing relationship with an open space on a second side of the side edge of the IC.

8 . The cold plate assembly of claim 1 , wherein the thermal pad layer comprises a thermal interface layer (TIM) comprising a thermal conductivity of at least 10 Watts per meter-Kelvin.

9 . The cold plate assembly of claim 1 , wherein the PCM layer comprises a thickness of 0.25 millimeters.

10 . A system for cooling a heat source, comprising:

cold plate assembly thermally connected to the heat source, the cold plate assembly comprising:

a cold plate comprising a pedestal portion on a first side of the cold plate;

a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;

a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove; and

the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

11 . The system of claim 10 , wherein the groove comprises:

a recessed surface recessed from the surface of the pedestal portion; and

a first sidewall between the recessed surface and the surface of the pedestal portion,

wherein the first rounded groove edge is formed at an intersection of the surface of the pedestal portion and the first sidewall.

12 . The system of claim 11 , wherein the groove further comprises:

an open side opposite the first sidewall, wherein the recessed surface extends in a first direction from the first sidewall to a recessed outer sidewall of the pedestal portion.

13 . The system of claim 11 , wherein the groove further comprises:

a second sidewall between the recessed surface and the surface of the pedestal portion; and

a second rounded groove edge formed at an intersection of the second sidewall and the surface of the pedestal portion.

14 . The system of claim 11 , wherein a width of the recessed surface comprises a measurement between 3 to 4 millimeters,

wherein the heat source is an integrated circuit (IC),

wherein a surface of the PCM layer opposite the surface of the pedestal portion is attached to a surface of the IC,

wherein the surface of the IC comprises a side edge,

wherein the cold plate assembly is attached to the IC such that 70% of the width of the recessed surface is in a facing relationship with the surface of the IC on a first side of the side edge of the IC, and

wherein 30% of the width the recessed surface is positioned in a facing relationship with an open space on a second side of the side edge of the IC.

15 . A system for cooling a heat source, comprising:

a heatsink disposed remotely from the heat source;

a cold plate assembly connected to the heatsink via a plurality of thermal pipes,

wherein the cold plate assembly comprises:

a cold plate comprising a pedestal portion on a first side of the cold plate;

a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;

a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove; and

the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

16 . The system of claim 15 , wherein the groove comprises:

a recessed surface recessed from the surface of the pedestal portion; and

a first sidewall between the recessed surface and the surface of the pedestal portion,

wherein the first rounded groove edge is formed at an intersection of the surface of the pedestal portion and the first sidewall.

17 . The system of claim 16 , wherein the groove further comprises:

an open side opposite the first sidewall, wherein the recessed surface extends in a first direction from the first sidewall to a recessed outer sidewall of the pedestal portion.

18 . The system of claim 16 , wherein the groove further comprises:

a second sidewall between the recessed surface and the surface of the pedestal portion; and

a second rounded groove edge formed at an intersection of the second sidewall and the surface of the pedestal portion.

19 . The system of claim 16 , wherein a width of the recessed surface comprises a measurement between 3 to 4 millimeters,

wherein the heat source is an integrated circuit (IC),

wherein a surface of the PCM layer opposite the surface of the pedestal portion is attached to a surface of the IC,

wherein the surface of the IC comprises a side edge,

wherein the cold plate assembly is attached to the IC such that 70% of the width of the recessed surface is in a facing relationship with the surface of the IC on a first side of the side edge of the IC, and

wherein 30% of the width the recessed surface is positioned in a facing relationship with an open space on a second side of the side edge of the IC.

20 . The system of claim 15 , wherein the thermal pad layer comprises a thermal interface layer (TIM) comprising a thermal conductivity of at least 10 Watts per meter-Kelvin.