Radio-frequency module and communication device

1 . A radio-frequency module comprising:

a mounting substrate including a first main surface and a second main surface opposite to the first main surface,

a first electronic component disposed on the first main surface of the mounting substrate;

a second electronic component disposed on the second main surface of the mounting substrate;

a plurality of connection terminals disposed on the second main surface of the mounting substrate; and

a wiring layer that faces the second main surface of the mounting substrate, wherein

the wiring layer includes a plurality of external connection electrodes each connected to at least one of the second electronic component and the plurality of connection terminals, and

at least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate, and

wherein each of the plurality of connection terminals is greater in diameter than each of the plurality of external connection electrodes.

2 . The radio-frequency module according to claim 1 , wherein the plurality of external connection electrodes are greater in number than the plurality of connection terminals.

3 . The radio-frequency module according to claim 2 , wherein each of the plurality of connection terminals is not equal in diameter to each of the plurality of external connection electrodes.

4 . The radio-frequency module according to claim 1 , wherein each of the plurality of external connection electrodes is greater in diameter than each of the plurality of connection terminals.

5 . A communication device comprising:

the radio-frequency module according to claim 1 ; and

a signal processing circuit that processes signals flowing through the radio-frequency module.

6 . The radio-frequency module according to claim 1 , wherein

the wiring layer further includes a substrate having a third main surface and a fourth main surface opposite to the third main surface,

the third main surface of the substrate faces at least part of the second main surface of the mounting substrate in the thickness direction of the mounting substrate,

the substrate is connected to the mounting substrate with at least one of the second electronic component and the plurality of connection terminals interposed therebetween, and

the plurality of external connection electrodes are disposed on the fourth main surface of the substrate and are connected to the at least one of the second electronic component and the plurality of connection terminals with the substrate interposed therebetween.

7 . The radio-frequency module according to claim 6 , wherein the substrate is thinner than the mounting substrate.

8 . The radio-frequency module according to claim 6 , wherein

the substrate is connected to the mounting substrate with the plurality of connection terminals interposed therebetween, and

each of the plurality of external connection electrodes is connected to the plurality of connection terminals with the substrate interposed therebetween.

9 . The radio-frequency module according to claim 8 , wherein the third main surface of the substrate faces entirety of the second main surface of the mounting substrate in the thickness direction of the mounting substrate.

10 . The radio-frequency module according to claim 6 , wherein

the substrate is connected to the mounting substrate with the second electronic component and the plurality of connection terminals interposed therebetween, and

each of the plurality of external connection electrodes is connected to the second electronic component or the plurality of connection terminals with the substrate interposed therebetween.

11 . The radio-frequency module according to claim 6 , wherein

the substrate is connected to the mounting substrate with the second electronic component interposed therebetween, and

each of the plurality of external connection electrodes is connected to the second electronic component with the substrate interposed therebetween, and

the plurality of connection terminals each have an exposed tip.

12 . The radio-frequency module according to claim 11 , wherein

the radio-frequency module comprises a plurality of the second electronic components, and

the third main surface of the substrate faces at least one of the plurality of the second electronic components.

13 . The radio-frequency module according to claim 11 , wherein

the radio-frequency module comprises a plurality of the second electronic components, and

at least one of the plurality connection terminals is disposed between the plurality of second electronic components.

14 . The radio-frequency module according to claim 1 , wherein

the plurality of connection terminals include a long-length connection terminal that is longer than it is wide when viewed in plan in the thickness direction of the mounting substrate,

the long-length connection terminal is disposed on an end portion of the mounting substrate when viewed in plan in the thickness direction of the mounting substrate, and

at least one of the plurality of external connection electrodes is connected to the long-length connection terminal.

15 . The radio-frequency module according to claim 14 , wherein the long-length connection terminal is L-shaped when viewed in plan in the thickness direction of the mounting substrate.

16 . The radio-frequency module according to claim 14 , wherein the long-length connection terminal is T-shaped when viewed in plan in the thickness direction of the mounting substrate.

17 . The radio-frequency module according to claim 14 , wherein

the radio-frequency module comprises a plurality of the second electronic components, and

the long-length connection terminal is disposed between the plurality of second electronic components.

18 . The radio-frequency module according to claim 14 , wherein the long-length connection terminal is a signal terminal.