Method for manufacturing package structure comprising irradiating package structure by light beam

1 . A method, comprising:

providing a package structure including a first region and a second region different from the first region, wherein the package structure comprises a package substrate having an active surface and a backside surface;

irradiating the package structure by a first light beam along a first direction from the active surface toward the backside surface, wherein the first light beam only irradiates the first region without irradiating the second region; and

irradiating the package structure by a second light beam along a second direction different from the first direction, wherein the second light beam only irradiates the second region without irradiating the first region,

wherein the package substrate comprises a semiconductor device and an encapsulant encapsulating the semiconductor device, and the second region is within a coverage area of the semiconductor device in a top view perspective.

2 . The method as claimed in claim 1 , wherein the step of irradiating the package structure along the second direction is later than the step of irradiating the package structure along the first direction.

3 . The method as claimed in claim 2 , further comprising stopping irradiating the package structure along the second direction earlier than stopping irradiating the package structure along the first direction.

4 . The method as claimed in claim 1 , wherein the first region is within a coverage area of the encapsulant and partially overlapping the coverage area of the semiconductor device in the top view perspective.

5 . The method as claimed in claim 1 , wherein the second region comprises a homogeneous material, and the first region comprises a composite material.

6 . The method as claimed in claim 5 wherein a light absorption rate of the first region is greater than a light absorption rate of the second region.