Semiconductor module
This semiconductor module includes: a base plate formed in a plate shape; a terminal member; an electronic component joined to one surface of the base plate; and mold resin sealing the base plate, the terminal member, and the electronic component. The base plate and the terminal member are conductive members and are arranged with an interval therebetween on the same plane. Each of the base plate and the terminal member has a body portion and a terminal portion exposed to outside from the mold resin. The base plate has a through hole at an extension part which is a part extending toward the terminal portion and connected to the terminal portion, in the body portion.
1 . A semiconductor module comprising:
a base plate formed in a plate shape;
a terminal member;
an electronic component joined to one surface of the base plate; and
mold resin sealing the base plate, the terminal member, and the electronic component, wherein
the base plate and the terminal member are conductive members and are arranged with an interval therebetween on the same plane,
each of the base plate and the terminal member has a body portion and a terminal portion exposed to outside from the mold resin, and
the base plate has a through hole at an extension part which is a part extending toward the terminal portion and connected to the terminal portion, in the body portion,
wherein the body portion has a width larger than the terminal portion in a direction perpendicular to a direction in which the terminal portion extends from the body portion.
2 . The semiconductor module according to claim 1 , wherein
the through hole is formed in an area, inside the mold resin, of the extension part of the body portion of the base plate and the mold resin completely fills in the through hole.
3 . The semiconductor module according to claim 1 , wherein
the through hole is completely formed in an area outside of the mold resin, of the extension part of the body portion of the base plate.
4 . The semiconductor module according to claim 1 , wherein
the extension part of the body portion of the base plate extends in a direction in which the terminal portion extends, and is connected to the terminal portion.
5 . The semiconductor module according to claim 2 , wherein
the extension part of the body portion of the base plate extends in a direction in which the terminal portion extends, and is connected to the terminal portion.
6 . The semiconductor module according to claim 3 , wherein
the extension part of the body portion of the base plate extends in a direction in which the terminal portion extends, and is connected to the terminal portion.
7 . The semiconductor module according to claim 4 , wherein
long-side lines of the through hole formed in a rectangular shape are parallel to a direction in which the terminal portion and the extension part of the body portion of the base plate extend.
8 . The semiconductor module according to claim 5 , wherein
long-side lines of the through hole formed in a rectangular shape are parallel to a direction in which the terminal portion and the extension part of the body portion of the base plate extend.
9 . The semiconductor module according to claim 6 , wherein
long-side lines of the through hole formed in a rectangular shape are parallel to a direction in which the terminal portion and the extension part of the body portion of the base plate extend.
10 . The semiconductor module according to claim 7 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are not less than a width of a tip part of the terminal portion.
11 . The semiconductor module according to claim 8 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are not less than a width of a tip part of the terminal portion.
12 . The semiconductor module according to claim 9 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are not less than a width of a tip part of the terminal portion.
13 . The semiconductor module according to claim 10 , wherein
the respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are equal to each other.
14 . The semiconductor module according to claim 11 , wherein
the respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are equal to each other.
15 . The semiconductor module according to claim 12 , wherein
the respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are equal to each other.
16 . The semiconductor module according to claim 7 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are different from each other, and
a sum of the respective widths on both sides of the long-side lines of the through hole is not less than the width of a tip part of the terminal portion.
17 . The semiconductor module according to claim 8 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are different from each other, and
a sum of the respective widths on both sides of the long-side lines of the through hole is not less than the width of a tip part of the terminal portion.
18 . The semiconductor module according to claim 9 , wherein
respective widths on both sides of the long-side lines of the through hole in the extension part of the body portion of the base plate are different from each other, and
a sum of the respective widths on both sides of the long-side lines of the through hole is not less than the width of a tip part of the terminal portion.