Multi-die integrated circuit device with a spark gap
An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or between exposed portions of adjacent leads. The spark gap distance is designed to achieve required ratings for a given application. Stacked and side-by-side die configurations are described.
1 . Apparatus comprising:
a first die having a first power contact and a first ground contact;
a second die having a second power contact and a second ground contact;
a lead frame comprising a die attach paddle, a tie bar, and a plurality of leads, wherein the first ground contact is electrically coupled to the die attach paddle and the second ground contact is galvanically isolated from the die attach paddle; and
a package body enclosing the die attach paddle, the first die, and the second die, wherein the tie bar is exposed at a first side of the package body and each of the plurality of leads is exposed at a second side of the package body orthogonal to the first side, wherein a corner lead of the plurality of leads is exposed at the first side of the package body to form a spark gap between the exposed portion of the corner lead and the exposed portion of the tie bar.
2 . The apparatus of claim 1 wherein a distance between the exposed portion of the corner lead and the exposed portion of the tie bar along the first side of the package body is selected based on a predetermined voltage isolation.
3 . The apparatus of claim 1 wherein the tie bar is a first tie bar and wherein the die attach paddle comprises a second tie bar exposed at the first side of the package body, a third tie bar exposed at a third side of the package body opposite to the first side of the package body, and a fourth tie bar exposed at the third side of the package body.
4 . The apparatus of claim 1 wherein the plurality of leads comprises a first plurality of leads and wherein the apparatus further comprises a second plurality of leads, each exposed at a fourth side of the package body opposite to the second side of the package body.
5 . The apparatus of claim 1 further comprising a first wire bond with which the first ground contact is electrically coupled to the die attach paddle and a second wire bond with which the first ground contact is electrically coupled to a lead of the plurality of leads.
6 . The apparatus of claim 1 further comprising a first wire bond with which the first ground contact is electrically coupled to the die attach paddle, wherein the lead frame comprises a die attach paddle extension extending between the die attach paddle and a lead of the plurality of leads.
7 . The apparatus of claim 1 wherein the first die is attached to the die attach paddle and the second die is attached to the first die in a stacked arrangement.
8 . The apparatus of claim 7 further comprising a non-conductive adhesive between the first die and the die attach paddle and between the first die and the second die.
9 . The apparatus of claim 1 wherein the second die is attached to the die attach paddle and the first die is attached to the second die in a stacked configuration.
10 . The apparatus of claim 1 wherein the first die is attached to the die attach paddle and the second die is attached to the die attach paddle so that the first die and the second die are in a side-by-side configuration.
11 . The apparatus of claim 10 further comprising a non-conductive adhesive between the first die and the die attach paddle and between the second die and the die attach paddle.
12 . The apparatus of claim 1 wherein the first die and the second die are substantially identical.
13 . The apparatus of claim 1 wherein at least one of the plurality of leads that is not electrically connected to the first die or to the second die comprises a first portion enclosed by the package body and a second portion exposed outside of the package body, wherein the first portion is wider than the second portion to form a second spark gap to an adjacent lead of the plurality of leads.
14 . The apparatus of claim 13 wherein the at least one lead has a T-shape.
15 . The apparatus of claim 1 wherein the corner lead comprises a first portion formed from lead frame material and a second tab portion extending from the first portion to the first side of the package body.
16 . Apparatus comprising:
a first die having a first power contact and a first ground contact;
a second die having a second power contact and a second ground contact;
a lead frame comprising a die attach paddle having a tie bar and a plurality of leads, wherein the first ground contact is electrically coupled to the die attach paddle and the second ground contact is galvanically isolated from the die attach paddle; and
a package body enclosing the die attach paddle, the first die, and the second die, wherein at least one of the plurality of leads that is not electrically connected to the first die or to the second die comprises a first portion enclosed by the package body and a second portion exposed outside of the package body, wherein the first portion is wider than the second portion to form a spark gap to an adjacent lead of the plurality of leads.
17 . The apparatus of claim 16 wherein the at least one lead has a T-shape.
18 . The apparatus of claim 16 wherein the die attach paddle comprises a tie bar exposed at a first side of the package body and each of the plurality of leads is exposed at a second side of the package body orthogonal to the first side, wherein a corner lead of the plurality of is exposed at the first side of the package body to form a spark gap between the exposed portion of the corner lead and the exposed portion of the tie bar.
19 . A method for protecting a multi-die electronic device from electrostatic discharge comprising:
providing a lead frame with a die attach paddle, a tie bar, and a plurality of leads;
attaching first and second die to the die attach paddle of the lead frame;
electrically coupling a ground contact of the first die to the die attach paddle and galvanically isolating the second die from the first die;
enclosing the first die, the second die, and the die attach paddle with a package body having a first side along where each of the plurality of leads is exposed; and
exposing the tie bar and a corner lead of the plurality of leads along a second side of the package body orthogonal to the first side.