Isolated metal clips with structural bridge
Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.
1 . An apparatus comprising:
a plurality of metal clips including a first, a second, a third, and a fourth metal clip, and individual ones of the plurality of metal clips having vertical portion and folded over portion;
a plurality of circuit packages, including first and second circuit packages mounted to a first surface of a substrate; and
a separate third circuit package is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip, wherein the folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other above the substrate,
wherein a first metal clip of the plurality of metal clips is connected to a voltage terminal of a circuit package mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip and bypasses a first circuit package that is mounted to the substrate; and
the second metal clip provides an electrical conduction path for a voltage to a second circuit package.
2 . The apparatus of claim 1 , comprising a fourth circuit package mounted on and electrically connected to a folded-over portion of the third metal clip and to a folded-over portion of the fourth metal clip, wherein the folded-over portion of the third metal clip and the folded-over portion of the fourth metal clip are electrically isolated from each other above the substrate.
3 . The apparatus of claim 1 , wherein an insulating transfer molding material is located over the plurality of circuit packages and under the plurality of metal clips.
4 . The apparatus of claim 3 , wherein the insulating molding material is located over the plurality of circuit packages and over the first, second, third and fourth metal clips; and
the molding is arranged to expose a top surface of the first, second, third, and fourth metal clips.
5 . The apparatus of claim 1 , wherein a bend angle of the folded-over portion of the first metal clip and the second metal clip is between 80° up to 90°.
6 . The apparatus of claim 1 , further comprising:
a ground of the third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip is electrically connected to a substrate ground of at least one of the circuit packages on the substrate via the folded-over portion of the third metal clip, wherein the folded-over portion of the third metal clip is electrically isolated from the first metal clip and from the second metal clip.
7 . The apparatus of claim 6 , further comprising:
a ground of the circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip is electrically connected to an isolated ground via the folded-over portion of the third metal clip, wherein the folded-over portion of the third metal clip is electrically isolated from the first metal clip and from the second metal clip.
8 . The apparatus of claim 1 , wherein the circuit package mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip includes a voltage regulator.
9 . The apparatus of claim 1 , wherein the first circuit package and the second circuit package are a part of a voltage regulator that is mounted to the first surface of the substrate.
10 . The apparatus of claim 1 , wherein the folded-over portion of at least one of the first metal clip or the second metal clip includes a Kelvin sense measurement lead connected to the folded-over portion at a location away from current flow through the folded-over portion and the third circuit package.
11 . The apparatus of claim 10 , wherein the Kelvin sense measurement lead includes at least one of a voltage or current measurement lead.
12 . The apparatus of claim 10 , wherein the Kelvin sense measurement lead is configured to connect to inductor current measurement circuitry to measure an indication of inductor current of an inductor in the third circuit package.
13 . An apparatus comprising:
a plurality of metal clips including a first, a second, a third, and a fourth metal clip, and individual ones of the plurality of metal clips having vertical portion and folded over portion;
a plurality of circuit packages, including first and second circuit packages mounted to a first surface of a substrate;
a separate third circuit package is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip, wherein the folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other above the substrate; and
a dielectric support having a first end connected to the folded-over portion of the first metal clip and an opposite second end connected to the folded-over portion of the second metal clip, wherein the dielectric support is non-electrically-conductive and provides bridging mechanical support between the folded-over portions while maintaining their electrical isolation,
wherein a first metal clip of the plurality of metal clips is connected to a voltage terminal of a circuit package mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip and bypasses a first circuit package that is mounted to the substrate; and
the second metal clip provides an electrical conduction path for a voltage to a second circuit package.
14 . The apparatus of claim 13 , wherein an insulating molding material is located over the plurality of circuit packages and under the plurality of metal clips.
15 . The apparatus of claim 14 , wherein the insulating molding material is located over the plurality of circuit packages and over the first, second, third and fourth metal clips; and
the molding is arranged to expose a top surface of the first, second, third, and fourth metal clips.
16 . The apparatus of claim 13 , wherein a bend angle of the folded-over portion of the first metal clip and the second metal clip is between 80° up to 90°.
17 . The apparatus of claim 13 , further comprising:
a ground of the third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip is electrically connected to a substrate ground of at least one of the circuit packages on the substrate via the folded-over portion of the third metal clip, wherein the folded-over portion of the third metal clip is electrically isolated from the first metal clip and from the second metal clip.
18 . An apparatus comprising:
a plurality of metal clips including a first, a second, a third, and a fourth metal clip, and individual ones of the plurality of metal clips having vertical portion and folded over portion;
a plurality of circuit packages, including first and second circuit packages mounted to a first surface of a substrate;
a separate third circuit package is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip, wherein the folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other above the substrate; and
a dielectric support having a first end connected to the folded-over portion of the first metal clip and an opposite second end connected to the folded-over portion of the second metal clip, wherein the dielectric support is non-electrically-conductive and provides bridging mechanical support between the folded-over portions while maintaining their electrical isolation.
19 . The apparatus of claim 18 , wherein an insulating molding material is located over the plurality of circuit packages and under the plurality of metal clips.