Die-bonding method for preventing die from bending
A method for preventing die from bending is provided, including: disposing a plurality of solder balls between a circuit layer and a substrate; preheating the substrate and the glass carrier respectively with a temperature lower than the melting point of the solder balls; one of the substrate and the glass carrier being made of a first material, and the other made of a second material; the first material having a coefficient of thermal expansion less than the second material and a temperature higher than the second material, so that the substrate and the glass carrier remaining equal length during heating; heating the solder balls by a light source with a temperature higher than the melting point of the solder balls; and after solidifying the solder balls, fastening the circuit layer on the substrate, and the substrate and the glass carrier remaining equal length during cooling.
1 . A die-bonding method for preventing die from bending, comprising:
placing a substrate placed on a heating carrier plate, placing a die on the substrate, disposing a plurality of solder balls between a circuit layer of the die and the substrate, and a die-bonding device contacting a glass carrier of the die, both the die-bonding device and the glass carrier being light-transmissible, and the substrate and the glass carrier having equal length at room temperature;
the heating carrier plate heating the substrate and the substrate transferring the heat to the solder balls, the heating carrier plate being configured to have a heating temperature lower than melting point of the solder balls; the die-bonding device pressurizing and heating the glass carrier, the glass carrier transferring the heat to the solder balls through the circuit layer, the die-bonding device being configured to have a heating temperature lower than the melting point of the solder balls; one of the substrate and the glass carrier being made of a first material and the other one of the substrate and the glass carrier being made of a second material, the first material having a thermal expansion coefficient smaller than the second material, and having a temperature higher than the second material, so that the substrate and the glass carrier remaining equal-length during heating process;
a light source projecting a light passing through the die-bonding device and the glass carrier to heat up the circuit layer; the circuit layer transferring the heat to the solder balls, and the light source having a heating temperature exceeding the melting point of the solder balls so that the solder balls melted into liquid solder and penetrating into the substrate; and
after solidifying the liquid solder, the circuit layer being completely fixed on the substrate, and the substrate and the glass carrier remaining equal-length during the process of cooling to room temperature.
2 . The die-bonding method for preventing die from bending according to claim 1 , wherein the light source includes a quartz lamp, and the infrared rays projected by the quartz lamp pass through the die-bonding device and the glass carrier to heat up the circuit layer.
3 . The die-bonding method for preventing die from bending according to claim 2 , wherein the light source further includes a reflector, and the quartz lamp tube is disposed in the reflector and projects infrared rays toward the opening of the reflector.
4 . The die-bonding method for preventing die from bending according to claim 2 , wherein the light source further includes a convex lens, the convex lens is disposed between the quartz lamp and the die-bonding device, the quartz lamp projects infrared rays toward the convex lens, and the convex lens focuses the infrared rays.
5 . The die-bonding method for preventing die from bending according to claim 1 , wherein the light source includes a laser module, and the laser beam projected by the laser module passes through the die-bonding device and the glass carrier to heat up the circuit layer.
6 . The die-bonding method for preventing die from bending according to claim 1 , wherein the heating temperature of the die-bonding device is between 140° C. and 270° C., and the heating temperature of the heating carrier plate is between 140° C. and 270° C.
7 . The die-bonding method for preventing die from bending according to claim 1 , wherein the size of the die-bonding device is larger than the size of the die.